PRINCO CORP. Patent applications |
Patent application number | Title | Published |
20130008811 | DISC PACKAGE ASSEMBLY - A disc package assembly for packaging and accommodating multiple discs is provided. The disc package assembly includes an upper cover and a base. The upper cover includes a through-hole, a first annular protrusion, a second annular protrusion, and a restraining portion. The thickness of the upper cover gradually increases from the edge of the upper cover toward the center. Further, the base includes a hollow fastening portion and a third annular protrusion. An annular part is formed at the upper end of the fastening portion and has several slots. The fastening portion includes a central through-hole penetrating through the base. The thickness of the base gradually increases from the edge of the base toward the center. The disc package assembly may further include a thermal shrink film for wrapping over the disc package assembly and the discs. | 01-10-2013 |
20120275283 | RECORDABLE OPTICAL RECORDING CARRIER AND METHOD FOR MANUFACTURING RECORDABLE OPTICAL RECORDING CARRIER COMPATIBLE WITH CD-R - An optical recording carrier including, in a data recording area, a continuous-grooved main track for recording primary data to be stored, and a subtrack for recording control data including parameter data and address information. The control data includes a clock signal needless to be provided by the main track. The subtrack has a narrower full width at half maximum (FWHM) and a shallower depth than the main track. The distance between the main track and the subtrack is not more than half of that between two adjacent main tracks. The main track and the subtrack form a double-spiral pattern. When recording data, a recording spot tracks mostly along the centerline of the main track and reads the control data in the subtrack simultaneously to control the recording process. A method for manufacturing a recordable optical recording carrier compatible with a conventional CD-R is also provided. | 11-01-2012 |
20120270158 | MANUFACTURING METHOD OF METAL STRUCTURE OF FLEXIBLE MULTI-LAYER SUBSTRATE - Disclosed is a metal structure of a multi-layer substrate, comprising a first metal layer and a dielectric layer. The first metal layer has an embedded base and a main body positioned on the embedded base. The base area of the embedded base is larger than the base area of the main body. After the dielectric layer covers the main body and the embedded base, the dielectric layer is opened at the specific position of the first metal layer for connecting the first metal layer with a second metal layer above the dielectric layer. When the metal structure is employed as a pad or a metal line of the flexible multi-layer substrate according to the present invention, the metal structure cannot easily be delaminated or separated from the contacted dielectric layer. Therefore, a higher reliability for the flexible multi-layer substrate can be achieved. A manufacturing method thereof is also provided. | 10-25-2012 |
20120202159 | MANUFACTURING METHOD OF METAL STRUCTURE IN MULTI-LAYER SUBSTRATE - Disclosed is a manufacturing method of metal structure in multi-layer substrate. The manufacturing method includes following steps: coating at least one photoresist layer on a surface of a dielectric layer; exposing the photoresist dielectric layer to define a predetermined position of the metal structure; removing the photoresist layer at the predetermined position to undercut an edge of the photoresist layer adjacent to the predetermined position by a horizontal distance of at least 0.1 μm between a top and a bottom of the edge; forming the metal structure at the predetermined position; and forming at least one top-cover metal layer to cover a top surface and two side surfaces of the metal structure. The present invention can form a cover metal layer covering the top surface and the two side surfaces by one single photomask. | 08-09-2012 |
20120107745 | VIA STRUCTURE IN MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed is a via structure in a multi-layer substrate, comprising a first metal layer, a dielectric layer and a second metal layer. The first metal layer has an upper surface. The dielectric layer covers the first metal layer in which a via is opened to expose the upper surface. The second metal layer is formed in the via and contacts an upper surface and an inclined wall of the via. A contacting surface of the second metal layer has a top line lower than the upper edge of the inclined wall. Alternatively, the second metal layer can be formed on the dielectric layer as being a metal line simultaneously as formed in the via as being a pad. The metal line and the pad are connected electronically. The aforesaid metal second layer can be formed in the via and on the dielectric layer by a metal lift-off process. | 05-03-2012 |
20120067287 | EVAPORATION BOAT FOR VACUUM VAPOR DEPOSITION AND VACUUM VAPOR DEPOSITION SYSTEM - The present invention provides an evaporation boat, comprising: a source material container configured to contain source material and provided with an opening; a cover plate disposed, with a predetermined gap, above the opening of the source material container, wherein the vertical projection of the cover plate covers the opening of the source material container, so that the scattering range of the source material vapor formed by evaporating the source material is controlled by the cover plate as the source material vapor scatters through the predetermined gap to the outside of the evaporation boat; and a supporting member connecting the source material container and the cover plate to maintain a predetermined gap therebetween. | 03-22-2012 |
20120007254 | MULTI-LAYER VIA STRUCTURE - Disclosed is a multi-layer via structure, comprising a metal layer, a first via metal layer formed on a first open of a first dielectric layer and a second via metal layer formed on a second open of a second dielectric layer. The first and second via metal layers comprise first and second bottoms, first and second top portions, first and second inclined walls, respectively. The first and second inclined walls comprise first and second top edges, first and second bottom edges respectively. The second top edge has a point closest to a geometric center of the first bottom. A vertical projection of the point falls on the first inclined wall. Alternatively, a point of the second bottom edge, which is closest to the geometric center, has a vertical projection. The vertical projection is vertical to the metal layer and falls on the first inclined wall. | 01-12-2012 |
20110314484 | OPTICAL DISC WITH THICKER SUPPORTING SECTION AND THINNER RECORDING SECTION - An optical disc of a thicker supporting section and a thinner recording section is characterized by: a reinforcement section of a predetermined width which overlaps a supporting section and a recording section. With the reinforcement section, the structure of the optical disc is strengthened, and the resonant frequency of the optical disc is raised, so that the vibration of the optical disc is suppressed and the disc is suitable for high speed (16× up) reading/writing. The optical disc comprises: a circular opening disposed in the center of the optical disc; an annular recording section; an annular supporting section disposed between the annular recording section and the circular opening, wherein the annular supporting section is thicker than the annular recording section; and an annular reinforcement section which is disposed on one of the two sides of the optical disc and overlaps the annular supporting section and the annular recording section. | 12-22-2011 |
20110212307 | METHOD TO DECREASE WARPAGE OF A MULTI-LAYER SUBSTRATE AND STRUCTURE THEREOF - Disclosed is a method to decrease warpage of a multi-layer substrate, comprises a plurality of metal layers and a plurality of dielectric layers, which are alternately formed. A plane parallel with a first metal layer and a second metal layer of the plurality of metal layers substantially has the same distance between the first metal layer and the second metal layer respectively. The plane is defined as a central plane between the first metal layer and the second metal layer. A first total area covered by metal in the first metal layer is larger than a second area covered by metal in the second metal layer. At least one redundant metal is further set in same layer of the second metal layer. A second total area comprising a redundant metal area covered by the redundant metal and the second area is considerably equivalent to the first total area. | 09-01-2011 |
20110212257 | METHOD TO DECREASE WARPAGE OF A MULTI-LAYER SUBSTRATE AND STRUCTURE THEREOF - Disclosed is a method to improve heat dissipation efficiency and to decrease warpage of a multi-layer substrate, comprising a plurality of metal layers and a plurality of dielectric layers, which are alternately formed. A plane parallel with a first metal layer and a second metal layer, substantially has the same distance between the first metal layer and the second metal layer respectively. The plane is defined as a central plane between the first metal layer and the second metal layer. A first total area covered by metal in the first metal layer is larger than a second area covered by metal in the second metal layer. At least one redundant metal is set in same layer of the second metal layer to make a second total area comprising a redundant metal area covered by the redundant metal and the second area considerably equivalent to the first total area. | 09-01-2011 |
20110198782 | MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein. | 08-18-2011 |
20110129964 | STRUCTURE COMBINING AN IC INTEGRATED SUBSTRATE AND A CARRIER, AND METHOD OF MANUFACTURING SUCH STRUCTURE - The present invention provides a structure combining an IC integrated substrate and a carrier, which comprises a carrier and an IC integrated substrate formed on the carrier. The IC integrated substrate has a first dielectric layer attached to the carrier. The materials of the carrier and the first dielectric layer are selected to prevent the IC integrated substrate from peeling off the carrier during processing and to allow the IC integrated substrate to naturally separate from the carrier after being cut, through the adhesion between the carrier and the first dielectric layer. The present invention also provides a method of manufacturing the above structure and a method of manufacturing electrical devices using the above structure. | 06-02-2011 |
20110124155 | HYBRID STRUCTURE OF MULTI-LAYER SUBSTRATES AND MANUFACTURE METHOD THEREOF - A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer. | 05-26-2011 |
20110124154 | HYBRID STRUCTURE OF MULTI-LAYER SUBSTRATES AND MANUFACTURE METHOD THEREOF - A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer. | 05-26-2011 |
20110088929 | METAL STRUCTURE OF FLEXIBLE MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed is a metal structure of a multi-layer substrate, comprising a first metal layer and a dielectric layer. The first metal layer has an embedded base and a main body positioned on the embedded base. The base area of the embedded base is larger than the base area of the main body. After the dielectric layer covers the main body and the embedded base, the dielectric layer is opened at the specific position of the first metal layer for connecting the first metal layer with a second metal layer above the dielectric layer. When the metal structure is employed as a pad or a metal line of the flexible multi-layer substrate according to the present invention, the metal structure cannot easily be delaminated or separated from the contacted dielectric layer. Therefore, a higher reliability for the flexible multi-layer substrate can be achieved. | 04-21-2011 |
20100108363 | VIA STRUCTURE IN MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed is a via structure in a multi-layer substrate, comprising a first metal layer, a dielectric layer and a second metal layer. The first metal layer has an upper surface. The dielectric layer covers the first metal layer in which a via is opened to expose the upper surface. The second metal layer is formed in the via and contacts an upper surface and an inclined wall of the via. A contacting surface of the second metal layer has a top line lower than the upper edge of the inclined wall. Alternatively, the second metal layer can be formed on the dielectric layer as being a metal line simultaneously as formed in the via as being a pad. The metal line and the pad are connected electronically. The aforesaid metal second layer can be formed in the via and on the dielectric layer by a metal lift-off process. | 05-06-2010 |
20100107183 | OPTICAL DISC HAVING GAS FLOW SPOILER AND THE METHOD FOR FABRICATING THE SAME - An optical disc includes a round opening at the center of the optical disc, an annular recording section configured to record information, an annular supporting section between the round opening and the annular recording section and configured to support the optical disc, and a spoiler provided on a non-read/write side of the annular recording section and configured to disturb the flow field inside the optical disc drive when the optical disc is rotating, the spoiler having a centerline average roughness between 2 μm and 10 μm, a thickness between 0.02 mm and 0.05 mm, an area occupying at least 5% of the non-read/write side. The flow field so disturbed changes from a laminar state to a turbulent state and thus the read/write characteristics of the disc is improved due to lower air resistance experienced by the rotating disc. | 04-29-2010 |
20100104889 | METHOD TO DECREASE WARPAGE OF MULTI-LAYER SUBSTRATE AND STRUCTURE THEREOF - Disclosed is a method to decrease warpage of a multi-layer substrate, comprises a first metal layer and a second metal layer. First area of the first metal layer is larger than second area of the second metal layer. In the same layer of the second metal layer, a redundant metal layer can be set to make a redundant metal layer area plus the second area considerably equivalent to the first area. Alternatively, a redundant space can be set in the first metal layer to achieve the same result. When the multi-layer substrate comprises a first dielectric layer with an opening and a second dielectric layer, a redundant opening positioned corresponding to the opening can be set in the second dielectric layer. The present invention employs a method of balancing the multi-layer substrate stress, i.e. to homogenize the multi-layer structure composed of different metal layers and dielectric layers to decrease warpage thereof. | 04-29-2010 |
20100103809 | OPTICAL DISC AND MANUFACTURING METHOD THEREOF - A method of manufacturing an optical disc comprises the steps of: (1) forming a substrate including an inner supporting section and an outer information recording section, the inner supporting section having a thickness larger than that of the outer information recording section; and (2) forming a vibration suppressing layer by printing UV curable paste three to five times over the surface of the non-recording side of the outer information recording section from an inner edge of the outer information recording section to a designated diameter, wherein the printed UV curable paste has a weight of 15% to 25% of the weight of the substrate, and at least 90% of the weight of the printed UV curable paste is distributed within a circular region with diameter 90 mm to 110 mm, each time the UV curable paste printed not exceeding 5% of the weight of the substrate. | 04-29-2010 |
20090321115 | MANUFACTURING METHOD OF METAL STRUCTURE IN MULTI-LAYER SUBSTRATE AND STRUCTURE THEREOF - Disclosed is a manufacturing method of metal structure in multi-layer substrate and structure thereof. The manufacturing method of the present invention comprises following steps: coating at least one photoresist layer on a surface of a dielectric layer, and then exposing the photoresist dielectric layer to define a predetermined position of the metal structure; therefore, removing the photoresist layer at the predetermined position and forming the metal structure at the predetermined position before forming at least one top-cover metal layer on a surface of the metal structure. The present invention can form a cover metal layer covering over the top surface and the two side surfaces, even the under surface of the metal structure, by one single photomask. Moreover, a finer metal structure with higher reliability can be manufactured. Furthermore, a metal structure can be used as a coaxial structure is also realized. | 12-31-2009 |
20090314524 | METHOD OF MANUFACTURING HYBRID STRUCTURE OF MULTI-LAYER SUBSTRATES AND HYBRID STRUCTURE THEREOF - Disclosed is a method of manufacturing a hybrid structure of multi-layer substrates. The method comprises steps of: separating a border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate and connecting a separated border of a metal layer of one multi-layer substrate with a separated border district of a metal layer of another multi-layer substrate to form a connection section. The hybrid structure comprises at least a first multi-layer substrate and a second multi-layer substrate. At least one first metal layer is connected with at least one second metal layer to form a connection section. | 12-24-2009 |
20090208712 | METHOD TO DECREASE WARPAGE OF MULTI-LAYER SUBSTRATE AND STRUCTURE THEREOF - Disclosed is a method to decrease warpage of a multi-layer substrate, comprises a first metal layer and a second metal layer. First area of the first metal layer is larger than second area of the second metal layer. In the same layer of the second metal layer, a redundant metal layer can be set to make a redundant metal layer area plus the second area considerably equivalent to the first area. Alternatively, a redundant space can be set in the first metal layer to achieve the same result. When the multi-layer substrate comprises a first dielectric layer with an opening and a second dielectric layer, a redundant opening positioned corresponding to the opening can be set in the second dielectric layer. The present invention employs a method of balancing the multi-layer substrate stress, i.e. to homogenize the multi-layer structure composed of different metal layers and dielectric layers to decrease warpage thereof. | 08-20-2009 |
20090092750 | TOOL FOR COATING AN OPTICAL DISC, METHOD OF COATING AN OPTICAL DISC, AND METHOD FOR FABRICATING AN OPTICAL DISC - The invention relates to a tool for coating an optical disc, and the tool includes: a coating section for spreading coating material; a restricting section for defining a coating area; and a support section for supporting the coating section and the restricting section. The coating section and the restricting section form a material accommodating space. Also, a method for coating an optical disc by using such tool and a method for fabricating an optical disc are disclosed. | 04-09-2009 |
20090061565 | STRUCTURE COMBINING AN IC INTEGRATED SUBSTRATE AND A CARRIER, AND METHOD OF MANUFACTURING SUCH STRUCTURE - The present invention provides a structure combining an IC integrated substrate and a carrier, which comprises a carrier and an IC integrated substrate formed on the carrier. The interface between the IC integrated substrate and the carrier has a specific area at which the interface adhesion is different from that at the remaining area of the interface. The present invention also provides a method of manufacturing the above structure and a method of manufacturing electronic devices using the above structure. | 03-05-2009 |
20090053454 | OPTICAL DISC AND METHOD FOR FABRICATING THE SAME - An optical disc includes an annular substrate, a coating layer, a damping layer, and a leveling layer. The annular substrate includes a supporting portion, and a recording portion surrounding the supporting portion, wherein the recording portion has a recording surface located on a first side thereof. For disc clamping and cost saving, the supporting portion is thicker than the recording portion. The coating layer is formed on the recoding surface for recording dada. The damping layer is formed on the coating layer to shorten the response time of the optical disc to vibration. The leveling layer is formed on the side of the annular substrate opposite to the recording surface for leveling the disk deformation caused during fabrication. A method for fabricating the aforementioned optical disc is also disclosed. | 02-26-2009 |
20080316726 | MULTI-LAYER SUBSTRATE AND MANUFACTURE METHOD THEREOF - Disclosed are a multi-layer substrate and a manufacture method thereof. The multi-layer substrate of the present invention comprises a surface dielectric layer and at least one bond pad layer. The surface dielectric layer is located at a surface of the multi-layer substrate. The bond pad layer is embedded in the surface dielectric layer to construct the multi-layer substrate with the surface dielectric layer of the present invention. The manufacture method of the present invention forms at least one bond pad layer on a flat surface of a carrier and then forms the surface dielectric layer to cover the bond pad layer where the bond pad layer is embedded therein. After the multi-layer substrate is separated from the carrier, the bond pad layer and the surface dielectric layer construct a flat surface of the multi-layer substrate. | 12-25-2008 |
20080314629 | MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein. | 12-25-2008 |
20080292892 | MANUFACTURING METHOD OF METAL STRUCTURE IN MULTI-LAYER SUBSTRATE AND STRUCTURE THEREOF - Disclosed is a manufacturing method of metal structure in multi-layer substrate and structure thereof. The manufacturing method of the present invention comprises following steps: coating at least one photoresist layer on a surface of a dielectric layer, and then exposing the photoresist dielectric layer to define a predetermined position of the metal structure; therefore, removing the photoresist layer at the predetermined position and forming the metal structure at the predetermined position before forming at least one top-cover metal layer on a surface of the metal structure. The present invention can form a cover metal layer covering over the top surface and the two side surfaces, even the under surface of the metal structure, by one single photomask. Moreover, a finer metal structure with higher reliability can be manufactured. Furthermore, a metal structure can be used as a coaxial structure is also realized. | 11-27-2008 |
20080289863 | SURFACE FINISH STRUCTURE OF MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - A surface finish structure of multi-layer substrate and manufacturing method thereof. The surface finish structure of the present invention includes a bond pad layer, at least one cover metal layer and a solder mask. The cover metal layer covers the bond pad layer. The solder mask has a hole to expose the cover metal layer. The present invention can form the cover metal layer to cover the bond pad layer and then forms the solder mask. Thereafter, the hole is made to the solder mask at the position of the cover metal layer to expose thereof. Because the bond pad layer is embedded in a dielectric layer of the multi-layer substrate, adhesion intensity between the bond pad layer and the dielectric layer can be enhanced. Meanwhile, contact of the bond pad layer with the solder can be prevented with the cover metal layer. | 11-27-2008 |
20080265405 | SUBSTRATE WITH MULTI-LAYER INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME - The invention provides a substrate with multi-layer interconnection structure, which includes a substrate and a multi-layer interconnection structure formed on the substrate. The multi-layer interconnection structure is adhered to the substrate in partial areas. The invention also provides a method of manufacturing and recycling such substrate and a method of packaging electronic devices by using such substrate. The invention also provides a method of manufacturing multi-layer interconnection devices. | 10-30-2008 |
20080213944 | STRUCTURE COMBINING AN IC INTEGRATED SUBSTRATE AND A CARRIER, AND METHOD OF MANUFACTURING SUCH STRUCTURE - The present invention provides a structure combining an IC integrated substrate and a carrier, which comprises a carrier and an IC integrated substrate formed on the carrier. The IC integrated substrate has a first dielectric layer attached to the carrier. The materials of the carrier and the first dielectric layer are selected to prevent the IC integrated substrate from peeling off the carrier during processing and to allow the IC integrated substrate to naturally separate from the carrier after being cut, through the adhesion between the carrier and the first dielectric layer. The present invention also provides a method of manufacturing the above structure and a method of manufacturing electrical devices using the above structure. | 09-04-2008 |