20080308937 | COPPER-FREE SEMICONDUCTOR DEVICE INTERFACE AND METHODS OF FABRICATION AND USE THEREOF - Embodiments of copper-free semiconductor device interfaces and methods for forming and/or utilizing the same are provided herein. In some embodiments, a semiconductor structure may include a substrate having an exposed copper-containing feature; and a copper-free interface disposed over the substrate and providing a conductive interconnect between the copper-containing feature and an upper surface of the copper-free interface to facilitate electrical coupling of the substrate to a semiconductor device while physically isolating the semiconductor device from the copper-containing feature. | 12-18-2008 |