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IBIDEN CO., LTD.
OGAKI-SHI, JP
1. 20090291841 HONEYCOMB STRUCTURE - includes at least one honeycomb unit and a peripheral wall at a peripheral surface connecting one end face and another end face of 11-26-20092. 20090291840 HONEYCOMB STRUCTURE - includes at least one honeycomb unit having a longitudinal direction and including cell walls extending along the longitudinal 11-26-2009
3. 20090291839 HONEYCOMB STRUCTURE - includes at least one honeycomb unit 11-26-2009
4. 20090291837 HONEYCOMB STRUCTURE - includes honeycomb units 11-26-2009
5. 20090291836 HONEYCOMB STRUCTURE - includes at least one honeycomb unit which includes walls 11-26-2009
6. 20090291835 HONEYCOMB STRUCTURE AND PROCESS FOR MANUFACTURING HONEYCOMB STRUCTURE 11-26-2009
7. 20090291834 HONEYCOMB STRUCTURE - includes a honeycomb unit and a coating layer 11-26-2009
8. 20090291833 HONEYCOMB STRUCTURE - includes center and peripheral regions 11-26-2009
9. 20090291832 HONEYCOMB STRUCTURE - includes a first end face, a second end face, and at least one honeycomb unit 11-26-2009
10. 20090291831 HONEYCOMB STRUCTURE - includes at least one honeycomb unit 11-26-2009
11. 20090291830 HONEYCOMB STRUCTURE - includes a center area, an outer peripheral area, and at least one honeycomb unit having a longitudinal direction 11-26-2009
12. 20090291829 HONEYCOMB STRUCTURE - includes at least one honeycomb unit 11-26-2009
13. 20090291828 HONEYCOMB STRUCTURE - includes a plurality of honeycomb units and an adhesive layer 11-26-2009
14. 20090291827 HONEYCOMB STRUCTURE - includes at least one honeycomb unit and a coat layer provided at a peripheral surface of the honeycomb structure 11-26-2009
15. 20090291826 HONEYCOMB STRUCTURE - includes at least one honeycomb unit 11-26-2009
16. 20090291825 HONEYCOMB STRUCTURE - includes a honeycomb unit containing zeolite and an inorganic binder and having cell walls extending from one end to another end 11-26-2009
17. 20090291824 HONEYCOMB STRUCTURE - includes a honeycomb structure includes a honeycomb unit 11-26-2009
18. 20090291256 HONEYCOMB STRUCTURE - includes a honeycomb unit which has zeolite inorganic binder and cell walls extending from one end to another end along a 11-26-2009
19. 20090291255 HONEYCOMB STRUCTURE - includes at least one honeycomb unit 11-26-2009
20. 20090291254 HONEYCOMB STRUCTURE - includes at least one honeycomb unit 11-26-2009
21. 20090291253 HONEYCOMB STRUCTURE - includes at least one honeycomb unit 11-26-2009
22. 20090291252 HONEYCOMB STRUCTURE AND MANUFACTURING METHOD OF THE HONEYCOMB STRUCTURE 11-26-2009
23. 20090291034 HONEYCOMB STRUCTURE, EXHAUST GAS CONVERSION APPARATUS, AND MANUFACTURING METHOD OF THE HONEYCOMB STRUCTURE 11-26-2009
24. 20090291032 HONEYCOMB STRUCTURE, EXHAUST GAS CLEANING UNIT, AND MANUFACTURING METHOD OF HONEYCOMB STRUCTURE 11-26-2009
25. 20090290318 Printed wiring board and method for manufacturing the same 11-26-2009
26. 20090288592 CRUCIBLE HOLDING MEMBER AND METHOD FOR PRODUCING THE SAME 11-26-2009
27. 20090285980 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 11-19-2009
28. 20090283312 Printed wiring board and method for manufacturing the same 11-19-2009
29. 20090283301 Multilayer wiring board and method for manufacturing the same 11-19-2009
30. 20090274888 HIGH-PURITY CARBON FIBER-REINFORCED CARBON COMPOSITE AND METHOD FOR PRODUCING THE SAME 11-05-2009
31. 20090272600 MAT MEMBER, METHOD FOR MANUFACTURING THE MAT MEMBER, MUFFLER AND METHOD FOR MANUFACTURING THE MUFFLER 11-05-2009
32. 20090272314 CRUCIBLE HOLDING MEMBER AND METHOD FOR PRODUCING THE SAME 11-05-2009
33. 20090269254 HOLDING SEALING MATERIAL, METHOD FOR MANUFACTURING HOLDING SEALING MATERIAL, AND EXHAUST GAS PURIFYING APPARATUS 10-29-2009
34. 20090266594 WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 10-29-2009
35. 20090266588 MULTILAYER PRINTED WIRING BOARD - has a core substrate an interlayer insulation layer formed over the core substrate 10-29-2009
36. 20090263939 SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 10-22-2009
37. 20090260857 HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD 10-22-2009
38. 20090260853 WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 10-22-2009
39. 20090257925 HOLDING SEALING MATERIAL, EXHAUST GAS PURIFYING APPARATUS, AND METHOD FOR MANUFACTURING HOLDING SEALING MATERIAL 10-15-2009
40. 20090255716 HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD 10-15-2009
41. 20090255111 MULTILAYER PRINTED WIRING BOARD - method of forming a circuit board which includes generating laser light with a carbon dioxide laser and making a hole 10-15-2009
42. 20090252906 HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 10-08-2009
43. 20090247403 HONEYCOMB STRUCTURE - includes at least one a honeycomb unit having a longitudinal direction 10-01-2009
44. 20090247402 HONEYCOMB STRUCTURE AND METHOD OF MANUFACTURING THE SAME 10-01-2009
45. 20090247395 HONEYCOMB STRUCTURAL BODY - includes at least one honeycomb unit which has a longitudinal direction 10-01-2009
46. 20090247394 HONEYCOMB STRUCTURE - includes adhesive layers and plural honeycomb units bonded to each other by interposing the adhesive layers between the plural 10-01-2009
47. 20090246456 HONEYCOMB STRUCTURE - includes at least one honeycomb unit having a longitudinal direction 10-01-2009
48. 20090246451 HONEYCOMB STRUCTURE - includes at least one honeycomb unit and coating layers 10-01-2009
49. 20090246450 HONEYCOMB STRUCTURE - includes at least one honeycomb unit having a first end face and a second end face 10-01-2009
50. 20090246103 HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 10-01-2009
51. 20090246099 HONEYCOMB STRUCTURE AND EXHAUST GAS TREATING APPARATUS 10-01-2009
52. 20090246097 HONEYCOMB STRUCTURE AND EXHAUST GAS TREATING APPARATUS 10-01-2009
53. 20090246096 HONEYCOMB STRUCTURE AND EXHAUST GAS TREATMENT APPARATUS 10-01-2009
54. 20090246095 EXHAUST GAS TREATING APPARATUS, METHOD OF MANUFACTURING EXHAUST GAS TREATING APPARATUS, MAT MEMBER, AND METHOD OF MANUFACTURING MAT MEMBER 10-01-2009
55. 20090243165 STOPPING MEMBER, FIRING FURNACE, AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 10-01-2009
56. 20090242252 Method for Manufacturing A Multilayer Printed Wiring Board for Providing an Electronic Component Therein 10-01-2009
57. 20090242100 METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 10-01-2009
58. 20090239740 HONEYCOMB STRUCTURE - includes a plurality of honeycomb fired bodies 09-24-2009
59. 20090239028 HONEYCOMB STRUCTURE - includes a plurality of honeycomb fired bodies each having cells 09-24-2009
60. 20090238733 HONEYCOMB STRUCTURE, EXHAUST GAS PURIFYING APPARATUS, AND METHOD FOR PRODUCING HONEYCOMB STRUCTURE 09-24-2009
61. 20090238732 HONEYCOMB FILTER, EXHAUST GAS PURIFYING APPARATUS AND METHOD FOR MANUFACTURING HONEYCOMB FILTER 09-24-2009
62. 20090238577 OPTICAL MODULE AND DATA COMMUNICATION SYSTEM INCLUDING THE OPTICAL MODULE 09-24-2009
63. 20090236128 PRINTED WIRING BOARD WITH RESIN COMPLEX LAYER AND MANUFACTURING METHOD THEREOF 09-24-2009
64. 20090235652 EXHAUST GAS PURIFICATION APPARATUS - includes a honeycomb structure which has an introduction end face and an exhaust end face opposite to the 09-24-2009
65. 20090231820 CAPACITOR-INCORPORATED PRINTED WIRING BOARD AND ELECTRONIC COMPONENT 09-17-2009
66. 20090229876 FLEXIBLE WIRING BOARD AND METHOD OF MANUFACTURING SAME 09-17-2009
67. 20090229868 PRINTED WIRING BOARD WITH REINFORCED INSULATION LAYER AND MANUFACTURING METHOD THEREOF 09-17-2009
68. 20090220735 SEALING MATERIAL FOR HONEYCOMB STRUCTURE, HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 09-03-2009
69. 20090220040 TUBULAR BODY AND METHOD FOR PRODUCING THE SAME 09-03-2009
70. 20090218125 MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD 09-03-2009
71. 20090214808 CONTAINER HOLDING MEMBER AND METHOD FOR PRODUCING THE SAME 08-27-2009
72. 20090211518 CRUCIBLE HOLDING MEMBER AND METHOD FOR PRODUCING THE SAME 08-27-2009
73. 20090211517 CRUCIBLE HOLDING MEMBER AND METHOD FOR PRODUCING THE SAME 08-27-2009
74. 20090208700 HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 08-20-2009
75. 20090205859 METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT 08-20-2009
76. 20090205202 METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT 08-20-2009
77. 20090200639 PACKAGE SUBSTRATE WITH BUILT-IN CAPACITOR AND MANUFACTURING METHOD THEREOF 08-13-2009
78. 20090200069 MULTILAYER PRINTED WIRING BOARD - 10 includes: a mounting portion 60 on the top surface of which is mounted a semiconductor element that is electrically 08-13-2009
79. 20090199953 METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 08-13-2009
80. 20090199399 METHOD FOR MANUFACTURING BOARD WITH BUILT-IN ELECTRONIC ELEMENTS 08-13-2009
81. 20090191378 HONEYCOMB STRUCTURE - includes a plurality of honeycomb fired bodies and an adhesive layer 07-30-2009
82. 20090188703 MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME 07-30-2009
83. 20090183904 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 07-23-2009
84. 20090175023 INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER 07-09-2009
85. 20090175011 PACKAGE SUBSTRATE WITH BUILT-IN CAPACITOR AND MANUFACTURING METHOD THEREOF 07-09-2009
86. 20090174081 COMBINATION SUBSTRATE - includes a first substrate having multiple wiring board mounting pads for installing a printed wiring board and multiple 07-09-2009
87. 20090173530 INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER 07-09-2009
88. 20090159327 PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD 06-25-2009
89. 20090154131 CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE 06-18-2009
90. 20090148356 HOLDING MEMBER TO HOLD EXHAUST GAS TREATING ELEMENT AND EXHAUST GAS TREATING DEVICE INCLUDING THE HOLDING MEMBER 06-11-2009
91. 20090147817 OPTICAL MODULE, METHOD OF MANUFACTURING THE OPTICAL MODULE, AND DATA COMMUNICATION SYSTEM INCLUDING THE OPTICAL MODULE 06-11-2009
92. 20090145652 PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD 06-11-2009
93. 20090145643 PRINTED WIRING BOARD WITH A BUILT-IN RESISTIVE ELEMENT 06-11-2009
94. 20090130378 HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 05-21-2009
95. 20090123696 CARBON-BASED COMPOSITE MATERIAL AND PRODUCING METHOD THEREOF 05-14-2009
96. 20090120996 SOLDER BALL MOUNTING DECIVE - solder ball mounting device that can mount minute solder balls with a diameter of 200 05-14-2009
97. 20090114431 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 05-07-2009
98. 20090114097 MAT MATERIAL AND EXHAUST GAS TREATMENT DEVICE 05-07-2009
99. 20090107879 PACKING MEMBER FOR HONEYCOMB STRUCTURE AND METHOD FOR TRANSPORTING HONEYCOMB STRUCTURE 04-30-2009
100. 20090107847 PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD 04-30-2009
101. 20090107711 PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD 04-30-2009
102. 20090107708 ELECTRONIC PARTS SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 04-30-2009
103. 20090098333 HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING THE HONEYCOMB STRUCTURE 04-16-2009
104. 20090095416 METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 04-16-2009
105. 20090090547 MULTILAYER PRINTED WIRING BOARD - 10 includes: a build-up layer that is formed on a core substrate 20 and has a conductor pattern disposed on an upper 04-09-2009
106. 20090090542 MULTILAYER PRINTED WIRING BOARD - IC chip for a high frequency region, particularly a packaged substrate in which no malfunction or error occurs even if 04-09-2009
107. 20090087353 MAT MEMBER, EXHAUST GAS TREATMENT APPARATUS, AND MUFFLING APPARATUS 04-02-2009
108. 20090087352 MAT MATERIAL, EXHAUST GAS TREATING APPARATUS, AND MUFFLER 04-02-2009
109. 20090084827 SOLDER BALL LOADING METHOD AND SOLDER BALL LOADING UNIT 04-02-2009
110. 20090084594 HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD 04-02-2009
111. 20090084268 MAT MEMBER, METHOD OF FABRICATING MAT MEMBER, EXHAUST GAS TREATING APPARATUS, AND SILENCING DEVICE 04-02-2009
112. 20090081455 INORGANIC FIBER MAT, HOLDING SEALER, SOUND ABSORBER, AND METHOD FOR MANUFACTURING INORGANIC FIBER MAT 03-26-2009
113. 20090081442 ALUMINA-SILICA-BASED FIBER, CERAMIC FIBER, CERAMIC FIBER COMPLEX, RETAINING SEAL MATERIAL, PRODUCTION METHOD THEREOF, AND ALUMINA FIBER COMPLEX PRODUCTION METHOD 03-26-2009
114. 20090078451 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME 03-26-2009
115. 20090077796 SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 03-26-2009
116. 20090072498 ALUMINA-SILICA-BASED FIBER, CERAMIC FIBER, CERAMIC FIBER COMPLEX, RETAINING SEAL MATERIAL, PRODUCTION METHOD THEREOF, AND ALUMINA FIBER COMPLEX PRODUCTION METHOD 03-19-2009
117. 20090070996 PRINTED CIRCUIT BOARD MANUFACTURING METHOD 03-19-2009
118. 20090065243 PRINTED WIRING BOARD - including solder pads excellent in frequency characteristic is provided 03-12-2009
119. 20090064493 PRINTED CIRCUIT BOARD - including a conductor portion an insulating layer formed over the conductor portion 03-12-2009
120. 20090053459 CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE 02-26-2009
121. 20090049690 HOLDING AND SEALING MATERIAL AND MANUFACTURING METHOD THEREOF 02-26-2009
122. 20090038830 SUBSTRATE FOR MOUNTING IC CHIP AND METHOD OF MANUFACTURING THE SAME 02-12-2009
123. 20090033179 MULTILAYER PIEZOELECTRIC ELEMENT - 20 includes a plurality of piezoelectric layers 11 and a plurality of inner electrode layers 12 alternately stacked 02-05-2009
124. 20090032404 PLATING APPARATUS AND PLATING METHOD - apparatus that performs an electrolytic plating on a plating surface of a belt substrate is provided 02-05-2009
125. 20090028497 OPTOELECTRONIC WIRING BOARD, OPTICAL COMMUNICATION DEVICE, AND METHOD OF MANUFACTURING THE OPTICAL COMMUNICATION DEVICE 01-29-2009
126. 20090026250 METHOD AND APPARATUS FOR LOADING SOLDER BALLS 01-29-2009
127. 20090025216 MULTI-LAYER PRINTED WIRING BOARD INCLUDING AN ALIGHMENT MARK AS AN INDEX FOR A POSITION OF VIA HOLES 01-29-2009
128. 20090020326 WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD 01-22-2009
129. 20090020317 WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD 01-22-2009
130. 20090014207 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME 01-15-2009
131. 20090010594 OPTICAL AND ELECTRICAL CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 01-08-2009
132. 20090004431 HONEYCOMB STRUCTURAL BODY AND EXHAUST GAS PURIFYING DEVICE 01-01-2009
133. 20080318001 HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 12-25-2008
134. 20080317402 OPTICAL/ELECTRICAL COMPOSITE WIRING BOARD AND A MANUFACTURING METHOD THEREOF 12-25-2008
135. 20080309203 Piezoelectric Element - includes an electrode disposed on at least one of the front and back surfaces of a piezoelectric material prepared by molding a 12-18-2008
136. 20080305319 GRAPHITE MATERIAL AND A METHOD OF PRODUCING GRAPHITE MATERIAL 12-11-2008
137. 20080305259 FIRING JIG AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 12-11-2008
138. 20080295470 HONEYCOMB FILTER AND METHOD FOR MANUFACTURING THE SAME 12-04-2008
139. 20080289859 Flex-Rigid Wiring Board and Manufacturing Method Thereof 11-27-2008
140. 20080289307 HONEYCOMB STRUCTURE, METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE, AND EXHAUST GAS PURIFYING APPARATUS 11-27-2008
141. 20080286523 HONEYCOMB STRUCTURE AND METHOD OF MANUFACTURING THE HONEYCOMB STRUCTURE 11-20-2008
142. 20080285910 PHOTOELECTRIC CIRCUIT BOARD AND DEVICE FOR OPTICAL COMMUNICATION 11-20-2008
143. 20080284067 METHOD FOR MANUFACTURING MATERIAL FOR SILICON CARBIDE FIRED BODY AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 11-20-2008
144. 20080283282 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 11-20-2008
145. 20080277776 SUBSTRATE AND MULTILAYER CIRCUIT BOARD - substrate includes a inorganic material base board has a recess and at least one penetration hole provided 11-13-2008
146. 20080276586 HONEYCOMB FILTER AND METHOD FOR MANUFACTURING THE SAME 11-13-2008
147. 20080261806 CATALYST SUPPORTING HONEYCOMB AND METHOD OF MANUFACTURING THE SAME 10-23-2008
148. 20080260991 CATALYST SUPPORTING HONEYCOMB AND METHOD OF MANUFACTURING THE SAME 10-23-2008
149. 20080260599 HONEYCOMB FILTER AND EXHAUST GAS PURIFYING APPARATUS 10-23-2008
150. 20080254254 HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 10-16-2008
151. 20080251977 METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 10-16-2008
152. 20080247918 HONEYCOMB FILTER, EXHAUST GAS PURIFYING APPARATUS, AND METHOD FOR MANUFACTURING HONEYCOMB FILTER 10-09-2008
153. 20080241501 HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 10-02-2008
154. 20080241465 CATALYST CARRIER - includes a honeycomb structure where cells extending in a longitudinal direction are divided by cell walls 10-02-2008
155. 20080241015 HONEYCOMB FILTER FOR PURIFYING EXHAUST GASES, ADHESIVE, COATING MATERIAL, AND MANUFACTURING METHOD OF HONEYCOMB FILTER FOR PURIFYING EXHAUST GASES 10-02-2008
156. 20080241013 HONEYCOMB FILTER AND EXHAUST GAS PURIFYING APPARATUS 10-02-2008
157. 20080241012 HONEYCOMB STRUCTURE, METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE, AND EXHAUST GAS PURIFYING APPARATUS 10-02-2008
158. 20080241011 HONEYCOMB FILTER AND EXHAUST GAS PURIFYING APPARATUS 10-02-2008
159. 20080241010 EXHAUST GAS PURIFYING SYSTEM - is provided that includes a catalyst carrier, and a honeycomb filter 10-02-2008
160. 20080241003 CATALYST SUPPORTER, METHOD OF MANUFACTURING CATALYST SUPPORTER AND EXHAUST GAS PROCESSING DEVICE 10-02-2008
161. 20080237942 METHOD FOR MANUFACTURING POROUS SILICON CARBIDE SINTERED BODY 10-02-2008
162. 20080237941 METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 10-02-2008
163. 20080236876 MULTILAYER PRINTED CIRCUIT BOARD - The multilayer printed circuit board according to the present invention is a multilayer printed circuit board 10-02-2008
164. 20080236724 METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 10-02-2008
165. 20080236394 HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 10-02-2008
166. 20080230914 SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 09-25-2008
167. 20080230263 Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board 09-25-2008
168. 20080223502 Manufacturing method of printed wiring board and a laminate Jointing apparatus 09-18-2008
169. 20080223427 THERMOELECTRIC CONVERTER - including plural thermoelectric conversion modules connected in series by having p-type semiconductors and n-type 09-18-2008
170. 20080206926 SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 08-28-2008
171. 20080201944 MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD 08-28-2008