IBIDEN, CO., LTD. Patent applications |
Patent application number | Title | Published |
20160143134 | WIRING BOARD WITH BUILT-IN METAL BLOCK AND METHOD FOR MANUFACTURING THE SAME - A wiring board with built-in metal block includes a substrate having a cavity penetrating through the substrate, a metal block accommodated in the cavity and having first surface, second surface, and side surface connecting outer edges of the first and second surface, filling resin filling gap between inner side surface of the substrate in the cavity and the side surface of the block, a first build-up layer laminated on first surface of the substrate and including an insulating layer such that the first layer is covering the cavity and the first surface of the block, and a second build-up layer laminated on second surface of the substrate and including an insulating layer such that the second layer is covering the cavity and the second surface of the block. The side surface of the block is recessed such that the side surface of the block is forming a groove shape. | 05-19-2016 |
20160136616 | HONEYCOMB CATALYST AND METHOD FOR MANUFACTURING HONEYCOMB CATALYST - The present invention aims to provide a honeycomb catalyst that includes titanium oxide, vanadium oxide, and tungsten oxide, and exhibits sufficient NOx conversion ability although it contains a small amount of vanadium oxide. The honeycomb catalyst of the present invention contains: titanium oxide; vanadium oxide; and tungsten oxide, the honeycomb catalyst containing the vanadium oxide in an amount of 0.3 to 5.0 wt %, a peak attributable to a vanadium atom being spaced by an interatomic distance of 2.4 to 2.5 Å from a tungsten atom in a radial distribution function, the intensity of the peak being 0.05 Å or more in the radial distribution function per 1 wt % of the amount of the vanadium oxide in the honeycomb catalyst, the radial distribution function being obtained by Fourier transformation of an extended X-ray absorption fine structure (EXAFS) spectrum in a K-absorption edge of the tungsten in the honeycomb catalyst. | 05-19-2016 |
20160135302 | SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A substrate for mounting an electronic component includes a base material including insulating resin, a first conductor layer formed on first surface of the material, a second conductor layer formed on second surface of the material, and a metal block inserted into a hole penetrating through the first conductor, material and second conductor such that the metal block is fitted in the hole. The material has a bent portion in contact with the metal block in the hole such that the bent portion is bending toward the second conductor, the metal block has surface on first conductor side such that the surface has an outer peripheral portion having a curved-surface shape, and the hole has a first fitting inlet on the first conductor layer side and a second fitting inlet on second conductor side and that the metal block is positioned in contact with the second fitting inlet. | 05-12-2016 |
20160133555 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a core substrate including an insulating layer and a conductor layer formed on the insulating layer, and a build-up layer laminated on the substrate and including an inter-layer insulating layer and a conductor layer laminated on the inter-layer. The substrate has opening penetrating through the insulating layer such that surface of the conductor layer in the substrate is forming bottom of the opening, the substrate has a via conductor formed in the opening and including plating filling the opening, the conductor layer in the substrate includes a metal foil, the conductor layer in the build-up layer includes a metal foil, and the metal foil in the substrate has surface in contact with the surface of the insulating layer such that the surface of the metal foil in the substrate has surface roughness smaller than surface roughness of surface of the metal foil in the build-up layer. | 05-12-2016 |
20160120033 | PRINTED WIRING BOARD - A printed wiring board includes a substrate, a first conductor layer formed on first surface of the substrate, a second conductor layer formed on second surface of the substrate, a through-hole conductor penetrating through the substrate and connecting the first and second conductor layers, a build-up layer formed on the second surface of the substrate and including conductor layers, insulating layers and via conductors, and a first insulating layer formed on the first surface the substrate and covering the first conductor layer. The substrate has a cavity penetrating through the first insulating layer and substrate and exposing the build-up layer on the substrate, the via conductors include a lowermost via conductor having a bottom portion exposed at bottom of the cavity, and the bottom portion of the lowermost via conductor is recessed relative to surface of a lowermost insulating layer in the build-up layer at the bottom of the cavity. | 04-28-2016 |
20160115843 | ELECTRICALLY HEATED CATALYTIC CONVERTER - The present invention provides a highly durable, electrically heated catalytic converter including an insulation layer formed on an inner tube, wherein the insulation layer is less susceptible to cracking and peeling even when high thermal stress occurs in the insulation layer at and near the end portion of an inner tube, at upstream of a catalyst carrier. An electrically heated catalytic converter for purifying exhaust gas includes a catalyst carrier supporting a catalyst and configured to generate heat by energization; a case for accommodating the catalyst carrier; and an electrical insulation mat interposed between the catalyst carrier and the case, wherein the case includes an outer tube disposed at the outermost side and an inner tube disposed inside the outer tube; in a cross section upstream of the catalyst carrier taken along a plane including the central axis of the case, the inner tube is curved at least once so as to outwardly project and then obliquely extends toward the central axis of the case, an insulation layer having a thickness of 100 to 200 μm is formed in the range from an end portion of the inner tube to 10% of the length of the inner tube from the end portion of the inner tube to an end of the catalyst carrier, an insulation layer having a thickness of 100 to 400 μm is formed in the range from a point immediately after 10% of the length away from the end portion of the inner tube to 50% of the length of the inner tube from the end portion to the end of the catalyst carrier, and the insulation layer formed in the range from the end portion of the inner tube to 10% of the length is thinner than the insulation layer formed in the range from a point immediately after 10% of the length away from the end portion of the inner tube to 50% of the length. | 04-28-2016 |
20160115842 | ELECTRICALLY HEATED CATALYTIC CONVERTER - The present invention provides a highly durable, electrically heated catalytic converter having a relatively simple structure while its inner tube is curved toward the central axis, wherein an insulation layer formed on the inner tube is less susceptible to cracking and peeling even when the inner tube is subjected to temperature changes or temperature gradients. An electrically heated catalytic converter for purifying exhaust gas includes a catalyst carrier supporting a catalyst and configured to generate heat by energization; a case for accommodating the catalyst carrier; and an electrical insulation mat interposed between the catalyst carrier and the case, wherein the case includes an outer tube disposed at the outermost side and an inner tube disposed inside the outer tube; in a cross section upstream of the catalyst carrier taken along a plane including the central axis of the case, the inner tube includes a first curved portion and a second curved portion formed in this order from the side closer to the catalyst carrier, the first curved portion is curved so as to outwardly project and the second curved portion is curved in the direction opposite to the curvature of the first curved portion so as to project toward the central axis, the second curved portion has a curvature radius larger than that of the first curved portion, and an insulation layer is formed on at least one portion of the inner tube. | 04-28-2016 |
20160115841 | ELECTRICALLY HEATED CATALYTIC CONVERTER - The present invention provides a highly durable, electrically heated catalytic converter including an inner tube on which an insulation layer is formed, wherein the insulation layer is less susceptible to damage such as cracking and peeling even when thermal stress occurs in a curvature section of the inner tube where the insulation layer is formed. The present invention provides an electrically heated catalytic converter for purifying exhaust gas, the electrically heated catalytic converter including a catalyst carrier supporting a catalyst and configured to generate heat by energization; a case for accommodating the catalyst carrier; and an electrical insulation mat interposed between the catalyst carrier and the case, wherein the case includes an outer tube disposed at the outermost side and an inner tube disposed inside the outer tube; in a cross section upstream of the catalyst carrier taken along a plane including the central axis of the case, the inner tube includes one or more curvature sections curved so as to outwardly project and extended sections connected to the one or more curvature sections, an insulation layer including an amorphous inorganic material is formed at least on an inner surface of the one or more curvature sections and the extended sections of the inner tube, the one or more curvature sections include a first curvature section located closest to the catalyst carrier, the first curvature section has a first curvature section insulation layer formed thereon, the first curvature section insulation layer having a thickness of 100 to 400 μm, the extended sections include a first extended section connected to the first curvature section and adjacent to the catalyst carrier, the first extended section has a first extended section insulation layer formed thereon, and the thickness of the first curvature section insulation layer is greater than 1 time to less than 1.4 times the thickness of the first extended section insulation layer. | 04-28-2016 |
20160113120 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a printed wiring board includes forming on carrier a laminate including a second metal foil, a resin layer laminated on the second foil and a first metal foil laminated on the resin layer, irradiating laser upon the first foil such that opening is formed through the first foil and resin layer and exposes surface of the second foil at bottom, plating the first foil such that a via conductor is formed in the opening and a first conductor layer including the first foil and an electroplating film is formed on surface of the resin layer, removing the carrier from the laminate, patterning the first conductor layer on the resin layer, and patterning the second foil such that a second conductor layer including the second foil is formed on opposite surface of the resin layer. The second foil has thickness greater than thickness of the first foil. | 04-21-2016 |
20160113110 | PRINTED WIRING BOARD - A printed wiring board includes a substrate, a first conductor layer formed on first surface of the substrate, a second conductor layer formed on second surface of the substrate, a through-hole conductor penetrating through the substrate and connecting the first and second conductor layers, a build-up layer formed on the second surface of the substrate and including conductor layers and insulating layers, and a first insulating layer formed on the first surface of the substrate such that the first insulating layer is covering the first conductor layer on the substrate. The substrate has a cavity penetrating through the first insulating layer and substrate such that the cavity is exposing the build-up layer on the second surface of the substrate, and the substrate and insulating layers in the build-up layer are formed such that difference between thermal expansion coefficients of the substrate and insulating layers is set 15 ppm or less. | 04-21-2016 |
20160105966 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having cavity, an insulating layer formed on the substrate such that the insulating layer is covering the cavity, a conductor layer formed on the insulating layer, and an electronic component accommodated in the cavity and including a rectangular cuboid body and terminal electrodes such that each electrode has a metal film form formed on outer surface of the body, and via conductors formed in the insulating layer such that the via conductors are connecting the conductor layer and electrodes. The electrodes are arrayed in a matrix having rows and columns such that adjacent electrodes in row and column directions have the opposite polarities, and the conductor layer includes a line pattern shunting first group of the electrodes in one polarity and a solid pattern shunting second group of the electrodes in the other polarity. | 04-14-2016 |
20160105960 | MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayer wiring board includes a main wiring board including insulation layers, first via conductors formed in the insulation layers, and a first conductive layer including first mounting pads such that the first mounting pads are positioned to mount a first electronic component and a second electronic component adjacent to each other on the main wiring board, and a wiring structure body mounted on the main wiring board such that the wiring structure body is positioned in an outermost insulation layer of the insulation layers, the wiring structure body including a second conductive layer which includes second mounting pads such that the second mounting pads are positioned to connect to the first electronic component and the second electronic component mounted on the main wiring board. The first via conductors are formed such that the first via conductors have diameters which increase in a same direction. | 04-14-2016 |
20160105957 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having a cavity, an interlayer insulating layer formed on the substrate such that the interlayer insulating layer is covering the cavity of the substrate, a conductor layer formed on the interlayer insulating layer, an electronic component accommodated in the cavity of the substrate and including a rectangular cuboid body and three terminal electrodes such that each of the three terminal electrodes has a metal film form formed on an outer surface of the rectangular cuboid body, and via conductors formed in the interlayer insulating layer such that the via conductors are connecting the conductor layer and the three terminal electrodes of the electronic component. The three terminal electrodes are arrayed in parallel on the outer surface of the rectangular cuboid body such that adjacent terminal electrodes have the opposite polarities. | 04-14-2016 |
20160100484 | PRINTED WIRING BOARD WITH BUMP AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a base insulating layer including an insulating material, a conductor layer formed on the base insulating layer and including conductor pads, a coating insulating layer formed on the base insulating layer such that the coating insulating layer is covering the conductor layer and having opening portions exposing the conductor pads, respectively, and bumps formed on the conductor pads respectively such that each of the bumps includes an electroless plating metal layer formed on a respective one of the conductor pads and a solder layer formed on the electroless plating metal layer, the electroless plating metal layer having an upper end surface formed such that a central portion of the upper end surface is recessed relative to a peripheral portion of the upper end surface. | 04-07-2016 |
20160100482 | PRINTED WIRING BOARD WITH METAL POST AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a resin insulating layer, a conductor layer formed on the resin insulating layer and including conductor pads, a solder resist layer formed on the resin insulating layer such that the solder resist layer is covering the conductor layer and has opening portions exposing the conductor pads, respectively, and metal posts formed on the conductor pads such that each of the metal posts is protruding from the solder resist layer and has a side surface forming an angle with respect to a surface of the solder resist layer. | 04-07-2016 |
20160095219 | PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE HAVING THE SAME - A printed wiring board includes a main wiring board having a main wiring pattern, and a sub wiring board mounted to the main board and having a sub wiring pattern such that the sub pattern electrically connects first and second electronic components, first conductor pads positioned to connect the first component to the main board and the sub board and having surfaces such that the first component is mounted onto the surfaces of the first pads via solder bumps, and second conductor pads positioned to connect the second component to the main board and the sub board and having surfaces such that the second component is mounted onto the surfaces of the second pads via solder bumps. The first and second pads are formed such that the surfaces of the first and second pads are formed on the same plane and have the same shape and the same size. | 03-31-2016 |
20160095215 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a resin insulating layer, and a first conductor layer including a fine wiring pattern and a thick-film wiring pattern. The fine wiring pattern is embedded in the resin insulating layer such that the fine wiring pattern has an exposed surface exposed on a first surface of the resin insulating layer. The thick-film wiring pattern includes an embedded wiring portion and a thick-film wiring portion such that the embedded wiring portion is embedded in the resin insulating layer and the thick-film wiring portion is projecting from the first surface of the resin insulating layer. The embedded wiring portion of the thick-film wiring pattern has a line width which is greater than a line width of the fine wiring pattern. | 03-31-2016 |
20160095207 | FLEX-RIGID WIRING BOARD - A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers. | 03-31-2016 |
20160088727 | PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE - A printed wiring board includes a core laminate body including insulating layers, conductor layers including first and second conductor layers, and via conductors having smaller end surfaces connected to the first conductor layer, a first build-up layer formed on the core body and including an interlayer, a conductor layer on the interlayer, and via conductors having smaller end surfaces connected to the first conductor layer, and a second build-up layer formed on the core body and including an interlayer and a conductor layer on the interlayer. The first conductor layer is embedded such that the first conductor layer has exposed surface on the surface of the core body, the second conductor layer is formed on the other surface of the core body, and the first conductor layer has wiring pattern having the smallest minimum width of wiring patterns of the conductor layers in the core body and build-up layers. | 03-24-2016 |
20160086885 | PACKAGE SUBSTRATE - A package substrate includes resin insulating interlayers, and four or more conductive layers including dedicated wiring layers such that the dedicated wiring layers are two dedicated wiring layers which transmit data between a first electronic component and a second electronic component connected by the two dedicated wiring layers. | 03-24-2016 |
20160081190 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a resin insulation layer, a conductive layer formed on a surface of the resin insulation layer and including NSMD pads, and a solder-resist layer formed on the resin insulation layer and having openings such that the openings are exposing the NSMD pads, respectively. The solder-resist layer includes a lower solder-resist layer formed on the surface of the resin insulation layer and an upper solder-resist layer formed on the lower solder-resist layer, and each of the openings has a lower opening portion formed in the lower solder-resist layer and an upper opening portion formed in the upper solder-resist layer such that the upper opening portion has a size which is greater than a size of the lower opening portion. | 03-17-2016 |
20160073515 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity and having electrode terminals, an insulating layer formed on the substrate such that the insulating layer is covering the electronic component in the cavity, and via conductors formed through the insulating layer and including first via conductors and second via conductors such that the second via conductors are connected to the electrode terminals of the electronic component, respectively. The via conductors are formed in via formation holes penetrating through the insulating layer, respectively, and the via formation holes include first via formation holes and second via formation holes such that the second via formation holes are exposing the electrode terminals of the electronic component, respectively, and that a second via formation hole has a diameter which is smaller than a diameter of a first via formation hole. | 03-10-2016 |
20160066429 | FLEX-RIGID WIRING BOARD - A flex-rigid wiring board includes a flexible base material structure, a rigid base material structure extending from opposite ends of the flexible base material structure, an electronic component embedded in the rigid base material structure, a first buildup layer laminated on first surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure, and a second buildup layer laminated on second surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure. The first and second buildup layers are formed such that the flexible base material structure exposed by the exposing portions of the first and second buildup layers forms a bendable portion and that the rigid base material structure and the first and second buildup layers form non-bendable portions connected to the bendable portion. | 03-03-2016 |
20160066423 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an insulating layer including insulating material, and a conductor layer formed on a surface of the insulating layer and including conductor pads and conductor patterns such that the conductor pads are positioned to connect one or more electronic components and that the conductor patterns are formed between the conductor pads. The conductor patterns are formed such that each conductor pattern has a pattern width of 3 μm or less and that the conductor patterns have a pattern interval of 3 μm or less between adjacent conductor patterns, and the insulating layer has recess portions formed on the surface between the conductor patterns at least along the conductor patterns such that the recess portions have a depth in a range of 0.1 μm to 2.0 μm relative to a contact interface at which the conductor patterns and the insulating layer are in contact with each other. | 03-03-2016 |
20160066422 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE - A printed wiring board includes a first resin insulating layer, a first conductor pattern including first mounting pads formed on the first resin insulating layer, and a wiring structure positioned on the first resin insulating layer and including a second resin insulating layer and a second conductor pattern such that the second resin insulating layer and second conductor pattern are positioned adjacent to the first conductor pattern and that the second conductor pattern includes second mounting pads. The second mounting pads are embedded in the second resin insulating layer such that the second mounting pads have mounting surfaces exposed on an exposed surface of the second resin insulating layer, and the first mounting pads have mounting surfaces such that the mounting surfaces of the first and second mounting pads are formed on a same plane. | 03-03-2016 |
20160064318 | PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE - A package substrate includes an outermost interlayer, an outermost conductive layer including first pads positioned to mount at electronic component and second pads positioned to mount another electronic component, a first conductive layer including first circuits and formed such that the outermost interlayer is on the first conductive layer and that the first circuits are connecting the first and second pads, an inner interlayer formed such that the first conductive layer is on the inner interlayer, a second conductive layer formed such that the inner interlayer is on the second conductive layer, via conductors penetrating through the outermost interlayer and including first via conductors connecting the first conductive layer and the first pads and second via conductors connecting the first conductive layer and the second pads, and third via conductors penetrating through the inner interlayer and positioned such that the first and third via conductors form stacked via conductors. | 03-03-2016 |
20160044789 | WIRING BOARD WITH CAVITY FOR BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a cavity for a built-in electronic component includes a conductor layer including a conductor circuit layer and a plane layer, and an insulating layer laminated on the conductor layer and having a cavity such that the cavity is forming an exposed portion of the plane layer and formed to mount a built-in electronic component on the exposed portion of the plane layer. The plane layer has a recess structure formed in an outer peripheral portion in the exposed portion of the plane layer. | 02-11-2016 |
20160044783 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE - A printed wiring board includes a wiring conductor layer having a first surface, conductor posts formed on a second surface of the wiring conductor layer on the opposite side with respect to the first surface, and a resin insulating layer embedding the wiring conductor layer such that the first surface of the wiring conductor layer is recessed with respect to a first surface of the resin insulating layer and exposed on the first surface of the resin insulating layer and covering side surfaces of the conductor posts such that an end surface of each of the conductor posts is protruding from a second surface of the resin insulating layer on the opposite side with respect to the first surface of the resin insulating layer. | 02-11-2016 |
20160044780 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an insulating layer, a first conductor layer embedded into a first surface of the insulating layer and including connecting portions to connect an electronic component, a second conductor layer projecting from a second surface of the insulating layer, a solder resist layer covering the first conductor layer and having an opening structure exposing the connecting portions, a barrier metal layer formed on the connecting portions such that the barrier layer is projecting from the first surface of the insulating layer, and metal posts formed on the barrier layer such that the metal posts are positioned on the connecting portions, respectively. Each metal post has width which is greater than width of a respective connecting portion, and the barrier metal layer includes a metal material which is different from a metal material forming the metal posts and a metal material forming the first conductor layer. | 02-11-2016 |
20160043027 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an insulating layer, a first conductor layer embedded into first surface of the insulating layer and including multiple wirings such that the wirings include connecting portions positioned to connect an electronic component, respectively, a second conductor layer projecting from second surface of the insulating layer on the opposite side, a solder resist layer formed on the first surface of the insulating layer such that the solder resist layer is covering the first conductor layer and has an opening structure exposing the connecting portions of the wirings, and multiple metal posts formed on the connecting portions respectively such that each of the metal posts has a width which is larger than a width of a respective one of the wirings having the connecting portions. The wirings are formed such that the connecting portions are positioned side by side on every other adjacent one of the wirings. | 02-11-2016 |
20160043024 | PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE - A printed wiring board includes a wiring conductor layer having first surface, conductor posts formed on second surface of the wiring layer, and an insulating layer embedding the wiring layer such that the first surface of the wiring layer is exposed on first surface of the insulating layer and covering side surfaces of the posts such that end surface of each conductor post is exposed from second surface of the insulating layer. The first surface of the wiring layer is recessed with respect to the first surface of the insulating layer and the end surface of each conductor post is recessed with respect to the second surface of the insulating layer such that distance between the end surface of each conductor post and the second surface of the insulating layer is greater than distance between the first surface of the wiring layer and the first surface of the insulating layer. | 02-11-2016 |
20160042861 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a cavity, an inductor component positioned in the cavity of the substrate, a first buildup layer formed on first surface of the substrate, and a second buildup layer formed on second surface of the substrate. The inductor component includes an insulating layer having first openings and a second opening formed between the first openings, conductive through holes formed in the first openings, respectively, a magnetic body formed in the second opening, a first interconnect formed on first surface of the insulating layer and connecting the conductive through holes on the first surface of the insulating layer, and a second interconnect formed on second surface of the insulating layer and connecting the conductive through holes on the second surface of the insulating layer, and the first interconnect, second interconnect and conductive through holes are positioned to form a spiral structure. | 02-11-2016 |
20160037647 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity, a conductive layer formed on the substrate and extending over the electronic component in the cavity, and a solder-resist layer formed on the conductive layer and having first and second openings such that the first openings are forming first pads including the conductive layer exposed by the first openings and that the second openings are forming second pads including the conductive layer exposed by the second openings. The second pads include portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic component, the first pads include portions of the conductive layer formed on outer side with respect to the electronic component, respectively, and each second opening has an opening diameter which is formed smaller than an opening diameter of each first opening. | 02-04-2016 |
20160037629 | PRINTED WIRING BOARD - A printed wiring board includes an insulation layer, conductive pads formed on the insulation layer and positioned to connect an electronic component, and a conductive wiring pattern including first and second conductive patterns and formed on the insulation layer such that the conductive wiring pattern is extending between the conductive pads. The first pattern includes first wiring lines, the second pattern includes second wiring lines, the first and second conductive patterns are formed such that the first wiring lines and the second wiring lines are alternately arrayed on the insulation layer, each of the first wiring lines includes a first metal layer formed on an interface with the insulation layer, each of the second wiring lines includes a second metal layer formed on an interface with the insulation layer, and the first metal layer includes a metal material which is different from a metal material forming the second metal layer. | 02-04-2016 |
20160033057 | HEAT RELEASING PIPE - A heat releasing pipe includes a metal pipe and a surface coating layer. The metal pipe has an outer circumferential surface. The surface coating layer is provided on the outer circumferential surface of the metal pipe. The surface coating layer contains an inorganic glass base material and has concave portions and convex portions on an outer surface of the surface coating layer. The concave portions and the convex portions are constructed using electrocoating with an electrocoating resin. The concave portions have a virtually circular shape when seen in a direction perpendicular to the outer circumferential surface of the metal pipe and are lower than a first reference surface. The first reference surface has an average height of the outer surface of the surface coating layer. The convex portions are located on peripheral edge portions of the concave portions and surround the concave portions. | 02-04-2016 |
20160027725 | MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A multilayer wiring board includes a main wiring board which mounts a semiconductor component on a surface of the main wiring board, and a wiring structure body which is mounted to the main wiring board and is formed to be electrically connected to the semiconductor component. The wiring structure body includes conductive pads formed on a first side of the wiring structure body, a heat radiation component formed on a second side of the wiring structure body on the opposite side with respect to the first side, an insulation layer positioned between the conductive pads and the heat radiation component, and via conductors formed in the insulation layer such that each of the via conductors has a diameter which increases from the first side toward the second side of the wiring structure body. | 01-28-2016 |
20160021759 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a insulation layer, a first conductive layer embedded into first surface of the insulation layer and having surface exposed on the first surface of the insulation layer, a second conductive layer formed on second surface of the insulation layer and protruding from the second surface of the insulation layer, a via penetrating through the insulation layer and electrically connecting the first and second conductive layers, a solder-resist layer covering the first conductive layer and having an opening structure forming an exposed structure of the first conductive layer, and a metal layer formed on the exposed structure and protruding from the first surface of the insulation layer. The exposed structure of the first conductive layer includes pads positioned to mount an electronic component to the first conductive layer, and the metal layer has a solder layer formed on the metal layer and having a flat surface. | 01-21-2016 |
20160021758 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an insulation layer, a first conductive layer embedded into first surface of the insulation layer, a second conductive layer formed on second surface of the insulation layer, a via conductor penetrating through the insulation layer and electrically connecting the first and second layers, and a solder-resist layer covering the first layer and having an opening structure forming an exposed structure of the first layer. The exposed structure is formed to connect an electronic component to the first layer, and the first layer has a barrier-metal layer and a metal layer on the first layer such that the barrier-metal layer is on surface of the first layer and includes metal different from metal forming the metal layer and that the metal layer is on surface of the barrier-metal layer in the exposed structure and protruding from the first surface of the insulation layer. | 01-21-2016 |
20160021753 | CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A circuit substrate includes a core substrate having a cavity penetrating through the substrate, a combined component accommodated in the cavity of the substrate, a first build-up layer laminated on first surface of the substrate and including an insulating layer such that the insulating layer is covering the cavity, a second build-up layer laminated on second surface of the substrate and including an insulating layer such that the insulating layer is covering the cavity, and a filling resin filling gap formed between the cavity and combined component accommodated in the cavity of the substrate. The combined component includes an electronic component and a metal block, the electronic component has terminal surface on side facing the first surface of the substrate, and the metal block is superposed to surface of the electronic component on the opposite side of the electronic component with respect to the terminal surface. | 01-21-2016 |
20160020164 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A wiring substrate includes a first outermost conductor layer, a first outermost insulating layer covering the first conductor layer, a second outermost conductor layer formed on opposite side of the first conductor layer, and a second outermost insulating layer covering the second conductor layer. The first insulating layer has first openings such that the first openings are exposing first conductor pads including portions of the first conductor layer, the second insulating layer has second openings such that the second openings are exposing second conductor pads including portions of the second conductor layer, each of the first conductor pads has a first plating layer recessed with respect to outer surface of the first insulating layer, and each of the second conductor pads has a second plating layer formed flush with outer surface of the second insulating layer or having bump shape protruding from the outer surface of the second insulating layer. | 01-21-2016 |
20160007468 | CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A circuit substrate includes a core substrate having cavity, metal blocks in the cavity, first and second build-up layers including insulating layers and laminated on first and second sides of the core substrate such that the insulating layers are covering the cavity, and a filling resin filling gap formed between the cavity and metal blocks in the cavity. The cavity is penetrating through the core substrate, the core substrate has an intracavity projection structure projecting from one or more side surfaces of the cavity such that the projection structure is positioned between the metal blocks and separating the metal blocks from contacting each other in the cavity, the first build-up layer has first conductors connected to the metal blocks such that each first conductor conducts electricity or heat, and the second build-up layer has second conductors connected to the metal blocks such that each second conductor conducts electricity or heat. | 01-07-2016 |
20160007451 | CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A circuit substrate includes a core substrate having cavity penetrating through the core substrate, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating layer and laminated on first side of the core substrate such that the first build-up layer is covering the cavity on the first side of the core substrate, and a second build-up layer including an insulating layer and laminated on second side of the core substrate such that the second build-up layer is covering the cavity on the second side of the core substrate, and a filling resin filling gap formed between the cavity and block positioned in the cavity of the core substrate. The block has roughened surfaces such that the roughened surfaces are in contact with the insulating layers in the first and second build-up layers on the first and second sides of the core substrate. | 01-07-2016 |
20160001277 | ZEOLITE, METHOD FOR MANUFACTURING ZEOLITE, HONEYCOMB CATALYST, AND EXHAUST GAS PURIFYIG APPARATUS - A zeolite has a CHA structure, a SiO | 01-07-2016 |
20160001274 | ZEOLITE, METHOD FOR MANUFACTURING ZEOLITE, HONEYCOMB CATALYST, AND EXHAUST GAS PURIFYIG APPARATUS - A zeolite has a CHA structure, a SiO | 01-07-2016 |
20150382471 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate. The boundary portion has a width which is in a range of approximately 0.05 to approximately 2.0 mm. | 12-31-2015 |
20150366102 | ELECTRONIC CIRCUIT APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT APPARATUS - An electronic circuit apparatus includes a circuit substrate, a heat generating component positioned on the circuit substrate, a metal plate forming a portion of an inner layer of the circuit substrate and protruding from a side surface of the circuit substrate such that the metal plate has an exposed portion exposed to outside the circuit substrate, and an external component connected to the exposed portion of the metal plate and including one of an external heat dissipation component and an external cooling component. | 12-17-2015 |
20150366062 | PRINTED WIRING BOARD - A printed wiring board includes a first circuit board having a first surface and a second surface on the opposite side with respect to the first surface, and a second circuit board having a third surface and a fourth surface on the opposite side with respect to the third surface and having a mounting area on the third surface of the second circuit board. | 12-17-2015 |
20150366061 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a first circuit board having a first surface and a second surface, and a second circuit board having a third surface and a fourth surface and having a mounting area on the third surface of the second circuit board. The first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board is in contact with the third surface of the second circuit board, the first circuit board includes reinforcing material and has an opening portion exposing the mounting area of the second circuit board, and the first circuit board and the second circuit board are formed such that a ratio H | 12-17-2015 |
20150359090 | CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE - A circuit substrate includes an insulating layer, a conductor layer laminated on the insulating layer and including a plane layer portion, and a solder resist layer formed on the insulating layer such that the solder resist layer is covering the conductor layer. The plane layer portion of the conductor layer has recess portions or opening portions, and the solder resist layer includes recessed portions covering the recess portions or opening portions of the plane layer portion. | 12-10-2015 |
20150357316 | PACKAGE SUBSTRATE - A package substrate includes an inner interlayer, a first conductor layer on the inner interlayer, a second conductor layer on which the inner interlayer is formed, an outermost interlayer on the first conductor layer, an outermost conductor layer on the outermost interlayer and including first and second pads positioned to mount first and second electronic components on the outermost interlayer, outermost vias connecting the first and outermost conductor layers through the outermost interlayer, and skip vias connecting the outermost and second conductor layers through the outermost and inner interlayers. The first conductor layer includes a first circuit connecting two outermost vias, and the outermost conductor layer includes an outermost circuit connecting one of the two outermost vias and one skip via such that the first conductor circuit, two outermost vias, outermost circuit and one skip via form a connection path connecting one second pad and the second conductor layer. | 12-10-2015 |
20150351159 | CARBON HEATER, HEATER UNIT, FIRING FURNACE, AND METHOD FOR MANUFACTURING SILICON-CONTAINING POROUS CERAMIC FIRED BODY - A carbon heater to fire a silicon-containing material in a non-oxidizing atmosphere includes a cross-sectional shape of a substantially n-sided polygon, and n represents any one of 3 to 8. | 12-03-2015 |
20150342039 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an inner conductive-circuit layer, an insulation layer structure including a first insulation layer laminated on inner conductive-circuit layer and a second insulation layer laminated on the first insulation layer, and an outermost conductive-circuit layer laminated on the insulation layer structure and including connection portions such that the connection portions are positioned to mount a component on the insulation layer structure. The second insulation layer is interposed between the first insulation layer and the outermost conductive-circuit layer and has a thickness which is smaller than a thickness of the first insulation layer such that an outer surface of the second insulation layer on an outermost conductive-circuit-layer side is flatter than an inner surface of the second insulation layer on a first insulation-layer side. | 11-26-2015 |
20150340309 | PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a first interlayer, a first conductive layer on first-surface side of the first interlayer, a second conductive layer on second-surface side of the first interlayer, a first buildup layer including interlayers and conductive layers and formed on first surface of the first interlayer, and a second buildup layer including interlayers and conductive layers and formed on second surface of the first interlayer. The first conductive layer is formed such that the first conductive layer is embedded in the first interlayer and exposing surface on the first surface of the first interlayer, the second conductive layer is formed on the second surface of the first interlayer, and the interlayers in the first buildup layer include a second interlayer positioned adjacent to the first conductive layer and having the greatest thickness among the first interlayer and interlayers in the first and second buildup layers. | 11-26-2015 |
20150334844 | PRINTED WIRING BOARD - A printed wiring board includes a substrate having first and second cavities, first electronic components accommodated in the first cavity, second electronic components accommodated in the second cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the first and second cavities. The substrate has a first projection structure partitioning the first components in the first cavity and a second projection structure partitioning the second components in the second cavity, and the first and second cavities and the first and second projection structures are formed in the substrate such that T | 11-19-2015 |
20150334842 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a cavity, multiple electronic components accommodated in the cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the cavity. The components include a first component, second component and third component, the core substrate has a first projection structure partitioning the first and second components in the cavity and a second projection structure partitioning the second and third components in the cavity, and the cavity and the first and second structures are formed in the substrate such that T | 11-19-2015 |
20150332792 | MEMBER FOR NUCLEAR REACTORS - A member for nuclear reactors is provided with: a core section including an aggregate of graphite particulate matter; and a covering layer including a ceramic dense body that covers the core section. | 11-19-2015 |
20150327363 | PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE - A package substrate includes an inner interlayer, a first conductor layer, a second conductor layer, an outermost interlayer, an outermost conductor layer including first and second pads to mount electronic components, vias including first and second vias such that the first vias are connecting the first conductor layer and first pads and the second vias are connecting the first conductor layer and second pads, and skip vias penetrating through the outermost and inner interlayers such that the skip vias are connecting the outermost and second conductor layers. Sum of insulation distances (t | 11-12-2015 |
20150319866 | WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A wiring board includes a core structure having a first surface and a second surface on the opposite side of the first surface, a first buildup structure formed on the first surface of the core structure and including insulation layers, and a second buildup structure formed on the second surface of the core structure and including insulation layers and an inductor device. The insulation layers in the second buildup structure have the thicknesses which are thinner than the thicknesses of the insulation layers in the first buildup structure, and the inductor device in the second buildup structure is position on the second surface of the core structure and includes at least a portion of a conductive pattern formed in the core structure. | 11-05-2015 |
20150319848 | PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a core laminate including insulating layers and conductor layers, a first build-up layer formed on first surface of the laminate and including first interlayer resin and conductor layers, and a second build-up layer formed on second surface of the core laminate on the opposite side and including second interlayer resin and conductor layers. The conductor layers in the laminate include first and second conductor layers such that the first conductor layer is embedded in one of the insulating layers forming the first surface of the laminate and has an exposed surface exposed from the insulating layer and that the second conductor layer is formed on one of the insulating layers forming the second surface of the laminate, and the first interlayer resin layer has thickness greater than thickness of the second interlayer resin layer. | 11-05-2015 |
20150319842 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A circuit substrate includes an insulating layer, circuit layers including a first layer on first surface side of the insulating layer and a second layer on second surface side of the insulating layer, conductor heat transfer layers including a first transfer layer on the first side of the insulating layer and a second transfer layer on the second side of the insulating layer, through hole electrical conductors filling first through holes penetrating through the insulating layer such that the electrical conductors connect the first and second layers, and a through hole thermal conductor filling a second through hole penetrating through the insulating layer such that the thermal conductor connects the first and second transfer layers. The second hole is positioned between two or more of the first holes and has a shape extending in direction that intersects direction connecting the two or more of the first holes. | 11-05-2015 |
20150318596 | PACKAGE SUBSTRATE - A package substrate includes a core substrate, a first buildup layer and a second buildup layer. The first buildup layer includes an uppermost interlayer, an upper inner interlayer, an uppermost conductive layer including first pads and second pads, an upper first conductive layer, an upper second conductive layer, vias formed through the uppermost interlayer and connecting the upper first conductive layer and the second pads, and skip vias formed through the uppermost and upper inner interlayers and connecting the uppermost and upper second conductive layers. The second buildup layer includes a lowermost interlayer, a lower inner interlayer, a lowermost conductive layer including third pads, a lower first conductive layer, a lower second conductive layer, vias formed through the lowermost interlayer and connecting the lower first conductive layer and third pads, and skip vias formed through the lowermost and lower inner interlayers and connecting the lowermost and lower second conductive layers. | 11-05-2015 |
20150282314 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD WITH CONDUCTIVE POST AND PRINTED WIRING BOARD WITH CONDUCTIVE POST - A method for manufacturing a printed wiring board with conductive posts includes forming on a first foil provided on carrier a first conductive layer including mounting pattern to connect electronic component via conductive posts, forming on the first foil a laminate including an insulating layer and a second foil to form the laminate on the first conductive layer, removing the carrier, forming a metal film on the laminate and first film, forming resist on the metal film to have pattern exposing portion of the metal film corresponding to the mounting pattern and portion of the second foil for a second conductive layer, forming an electroplating layer on the portion of the metal film not covered by the resist, removing the resist, and applying etching to remove the first and second foils below the metal film exposed by the removing the resist and to form the posts on the mounting pattern. | 10-01-2015 |
20150282305 | MULTILAYER WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A multilayer wiring board with a built-in electronic component includes a substrate, a conductor layer formed on surface of the substrate, one or more electronic components positioned in a cavity formed through the substrate, an insulating layer formed on the substrate such that the insulating layer is formed on the component in the cavity, and a wiring layer formed on the insulating layer. The conductor layer has an opening formed such that the cavity is formed in the opening of the conductor layer and that the conductor layer has a first side in the opening and a second side in the opening on the opposite side across the cavity, and the cavity is formed in the opening of the conductor layer such that width between the cavity and the first side of the conductor layer is greater than width between the cavity and the second side of the conductor layer. | 10-01-2015 |
20150279772 | PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE - A package substrate includes interlayer insulating layers including outermost and inner-layer layers, conductor layers including an outermost layer, a first layer between the outermost and inner-layer layers, and a second layer on which the inner-layer layer is formed, via conductors including first and second conductors through the outermost insulating layer, and skip via conductors through the outermost and inner-layer insulating layers to connect the outermost and second conductor layers. The outermost conductor layer includes first and second pads to mount first and second electronic components on the outermost insulating layer, the first conductors are positioned to connect the first conductor layer and first pads, the second conductors are positioned to connect the first conductor layer and second pads, and the first conductor layer has area on surface of the inner-layer insulating layer which is in range of 3 to 15% of area of the surface of the inner-layer insulating layer. | 10-01-2015 |
20150273446 | HONEYCOMB STRUCTURE - Provided is a honeycomb structure which is suppressed in the occurrence of cracks and hydration degradation, while maintaining excellent NOx removal performance of SAPO. A honeycomb structure having a honeycomb unit that comprises two zeolite species and an inorganic binder, and that has a plurality of through holes arranged side by side with a partition wall therebetween to be extended in the longitudinal direction of the unit. This honeycomb structure is characterized in that one of the two zeolite species is silicoaluminophosphate (SAPO) having a composition ratio Si/(Si+Al+P) of 0.1-0.25, and the other is aluminosilicate (CHA) having a composition ratio Si/Al of 2-10. | 10-01-2015 |
20150271929 | METHOD FOR MANUFACTURING WIRING BOARD WITH CONDUCTIVE POST - A method for manufacturing a wiring board having conductive posts includes preparing a wiring board including electronic circuit and a solder resist layer covering the electronic circuit and having first openings and second openings surrounding the first openings such that the first openings are exposing pad portions of the electronic circuit and that the second openings are exposing post connecting portions of the electronic circuit surrounding the pad portions, applying surface treatment to the pad portions, forming a plating resist layer on the wiring board after the surface treatment of the pad portions such that the plating resist layer has resist openings exposing the post connecting portions, applying electrolytic plating on the post connecting portions such that conductive posts rising from the post connecting portions are formed in the resist openings, and removing the plating resist layer from the wiring board after forming the conductive posts in the resist openings. | 09-24-2015 |
20150271923 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a multilayer core substrate, an electronic component accommodated in an opening portion formed in the multilayer core substrate, and a build-up layer including an interlayer resin insulating layer formed on the multilayer core substrate such that the interlayer resin insulating layer is covering the opening portion of the multilayer core substrate. The multilayer core substrate includes resin layers, inner layer conductor patterns formed on an inner layer of the resin layers and outer layer conductor patterns formed on an outer layer of the resin layers, and via conductors formed in the resin layers, and the multilayer core substrate is formed such that a distance from the opening portion to each of the inner layer conductor patterns is greater than a distance from the opening portion to each of the outer layer conductor patterns. | 09-24-2015 |
20150270071 | CARBON MATERIAL FOR ELECTRICAL STORAGE DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRICAL STORAGE DEVICE USING THE SAME - Provided are: a carbon material for an electrical storage device which exhibits, even under low-temperature conditions, sufficiently excellent characteristics from the standpoint of resistivity; and a process for manufacturing the same. This carbon material for an electrical storage device is a carbon material made by pulverizing a graphite material and in which the 10% volume cumulative diameter, 50% volume cumulative diameter and 90% volume cumulative diameter are controlled to 0.45 to 1.7 μm, 0.8 to 4.0 μm and 1.55 to 8.9 μm respectively, and the volume average particle diameter distribution has at least a second peak with the highest frequency of appearance and a first peak located on the side of a particle diameter smaller than that of the second peak. The use of the carbon material in an electrical storage device makes it possible to lower the low-temperature charge transfer resistance of the device. | 09-24-2015 |
20150264817 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a wiring board includes positioning on a first insulation layer a wiring structure including an insulation layer and conductive patterns formed on the insulation layer, forming a second insulation layer on the first insulation layer and the wiring structure such that the wiring structure is interposed between the first insulation layer and the second insulation layer, forming a via conductor through the second insulation layer, and forming conductive patterns on the second insulation layer such that one of the conductive patterns on the second insulation layer is connected to the via conductor in the second insulation layer. | 09-17-2015 |
20150264815 | SUBSTRATE WITH BUILT-IN CAPACITOR AND METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN CAPACITOR - A substrate with a built-in capacitor includes an insulating base material layer, a build-up layer formed on the insulating base material layer and including a conductor layer and an insulating layer, and a multilayer ceramic capacitor positioned in an opening of the base material layer and including internal electrodes, ceramic dielectric layers and a pair of external electrodes. The ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes is formed on opposing long-side sides such that the external electrodes are separated by a distance in range of 30 μm to 200 μm and that each external electrode includes a conductive paste layer connected to a respective group of the internal electrodes and a copper plated layer covering the conductive paste layer, and the conductive paste layer includes Ni paste or Cu paste including glass component in range of 5% to 40%. | 09-17-2015 |
20150257276 | METHOD FOR MANUFACTURING WIRING BOARD - A method for manufacturing a wiring board includes preparing a large-sized wiring board having an effective region and a dummy region such that the board has a penetrating hole on a border of the effective and dummy regions and an inner-hole conductive layer covering an inner surface of the penetrating hole, moving a rotary tool having a tip blade along rotation axis at a peripheral portion of the penetrating hole such that the rotary tool drills a hole into the board at the peripheral portion and segments the conductive layer into portions in the effective and dummy regions, and moving a rotary tool having a side blade in a direction perpendicular to rotation axis such that the dummy region is cut off from the effective region after the rotary tool having tip blade makes the hole and a wiring board having the effective region of the board is formed. | 09-10-2015 |
20150257269 | COMBINED WIRING BOARD - A combined wiring board includes multiple metal frames arrayed in a first direction, and multiple wiring boards bonded to the metal frames such that the wiring boards are arrayed in the first direction. The metal frames directly or indirectly engage with the wiring boards such that each of the metal frames is positioned between two adjacent wiring boards of the wiring boards. | 09-10-2015 |
20150257268 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a core substrate, and a buildup layer formed on the core substrate and including an interlayer resin insulation layer and a conductive layer. The core substrate includes a metal core, a first insulation layer on first surface of the metal core, a first conductive layer on the first insulation layer, a second insulation layer on second surface of the metal core, and a second conductive layer on the second insulation layer, the metal core has a penetrating hole penetrating from the first surface to the second surface and a resin portion filling the penetrating hole, the resin portion includes resin material from the first insulation layer, the core substrate has a through-hole conductor formed in the resin portion through the metal core, the interlayer resin insulation layer has a core material, and the first insulation layer does not have a core material. | 09-10-2015 |
20150257261 | PRINTED WIRING BOARD - A printed wiring board includes a multilayer core substrate, a first buildup layer formed on the multilayer core substrate and including an interlayer insulation layer and a conductive layer, a second buildup layer formed on the multilayer core substrate and including an interlayer resin insulation layer and a conductive layer, and an end-surface through hole conductor formed on side surfaces of the first and second buildup layers and core substrate such that the through hole conductor connects the conductive layers of the first and second buildup layers. The core substrate includes a first conductive layer, a middle conductive layer, a second conductive layer, a first insulation layer between the first and middle conductive layers and a second insulation layer between the second and middle conductive layers, and the middle conductive layer is connected to the through-hole conductor and has thickness greater than thicknesses of the first and second conductive layers. | 09-10-2015 |
20150255433 | COMBINED SUBSTRATE - A combined substrate includes a first substrate having multiple first metal posts, a second substrate having multiple second metal posts such that the second metal posts are positioned to oppose the first metal posts, respectively, and multiple solder structures interposed between the first metal posts and the second metal posts, respectively. The first metal posts and/or the second metal posts have recessed surfaces formed such that the solder structures are formed on the recessed surfaces, respectively. | 09-10-2015 |
20150255359 | ELECTRONIC COMPONENT HAVING ENCAPSULATED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - An electronic component including a wiring board having interlayer insulation layers and conductive patterns, the wiring board having a first surface and a second surface on the opposite side of the first surface, multiple first bumps formed on a first conductive pattern positioned on the first surface of the wiring board among the conductive patterns of the wiring board, a semiconductor element mounted on the first surface of the wiring board through the first bumps, an encapsulating resin encapsulating the semiconductor element and at least a portion of a side surface of the wiring board, the side surface of the wiring board extending between the first surface and second surface of the wiring board, and multiple of second bumps formed on the second surface of the wiring board and connected to a second conductive pattern of the conductive patterns in the wiring board. | 09-10-2015 |
20150250054 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND PACKAGE-ON-PACKAGE - A printed wiring board includes an uppermost insulating layer, first pads positioned to mount an IC chip on the insulating layer, second pads positioned to mount a second printed wiring board on the insulating layer, metal posts formed on the second pads, respectively, such that the metal posts mount the second board over the chip, and a solder resist layer formed on the uppermost insulating layer and having first and second openings such that the first openings exposes the first pads and that the second openings exposes the second pads, respectively. The metal posts are formed such that each of the metal posts has a diameter which is smaller than a diameter of each of the second opening portions, and the second opening portions are formed such that the diameter of each of the second opening portions is smaller than a diameter of each of the second pads. | 09-03-2015 |
20150245492 | MULTILAYER WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A multilayer wiring board with built-in electronic components includes a substrate including an insulating material and having multiple opening portions, a first conductor layer formed on a surface of the substrate and having an opening portion such that the substrate has the opening portions inside the opening portion of the first conductor layer, multiple electronic components positioned in the opening portions of the substrate, and an insulating layer formed on the substrate such that the insulating layer is formed on the electronic components and on the first conductor layer. The opening portions are formed in the substrate such that the opening portions include two opening portions and that the substrate has a partition wall formed between the two opening portions. | 08-27-2015 |
20150245485 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a first insulating layer, a first conductor layer formed on a surface of the first insulating layer and including first pads, and a wiring structure including a second conductor layer formed on the first insulating layer, a second insulating layer laminated on the second conductor layer, a third conductor layer formed on the second insulating layer, and formed through the second insulating layer. The second conductor layer includes second pads formed on the first insulating layer, the third conductor layer includes third pads formed on the second insulating layer, the via conductors are positioned such that the via conductors are connecting the second pads and the third conductor layer, and the wiring structure is formed such that the second conductor layer and third conductor layer are not electrically connected to the first conductor layer. | 08-27-2015 |
20150245474 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first multilayer wiring board having a built-in electronic component and first conductive layers, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing a surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer. | 08-27-2015 |
20150230346 | MASK FOR LOADING BALL, BALL LOADING APPARATUS AND METHOD FOR MANUFACTURING PRINTED WRING BOARD USING MASK - A method for manufacturing a printed wiring board includes clamping a mask device at clamping portioned formed in the mask device with a movable clamp device to apply tensile force to the mask device, positioning the mask device over a printed wiring board having connection pads, applying the tensile force to the mask device through the clamping portions such that a mask of the mask device undergoes elastic deformation and positions of opening portions in the mask are vertically aligned relative to positions of the connection pads of the printed wiring board, and loading solder balls through the opening portions in the mask onto the connection pads of the printed wiring board, respectively. | 08-13-2015 |
20150223338 | PRINTED WIRING BOARD - A printed wiring board includes a first substrate having first pads and second pads such that the first pads are positioned to mount an electronic component on the first substrate and that the second pads are positioned to electrically connect a second substrate to the first substrate, and metal posts formed on the second pads, respectively, such that the metal posts are positioned to mount the second substrate on the first substrate. The first substrate and the metal posts satisfy that a ratio, b/e, is in a range from 0.3 to 1.0, where b represents a length of each of the metal posts and e represents a thickness of the first substrate. | 08-06-2015 |
20150223318 | MULTILAYER WIRING BOARD - A multilayer wiring board includes a first insulating layer, first conductor patterns formed on the first insulating layer, and a wiring structure formed on the first insulating layer and including a heat sink and second conductor patterns formed on the heat sink such that the wiring structure is positioned adjacent to the first conductor patterns on the first insulating layer. | 08-06-2015 |
20150216055 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board including providing a starting material including an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface of the insulating resin substrate such that a first opening portion having an opening on the first surface is formed, irradiating laser upon the second surface of the insulating resin substrate such that a second opening portion having an opening on the second surface and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming a first conductor on the first surface of the insulating resin substrate, forming a second conductor on the second surface of the insulating resin substrate, and forming a through hole conductor structure in the penetrating-hole to electrically connecting the first conductor and the second conductor. | 07-30-2015 |
20150216050 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion. | 07-30-2015 |
20150216049 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first interlayer insulation layer, a second interlayer insulation layer formed on the first interlayer insulation layer and having an opening portion, first conductive pads formed on the second interlayer insulation layer, a conductive plane layer formed on the first interlayer insulation layer such that the conductive plane layer is exposed by the opening portion of the second interlayer insulation layer, a wiring structure positioned directly on the conductive plane layer such that the wiring structure is accommodated in the opening portion of the second interlayer insulation layer, and second conductive pads formed on the wiring structure such that the first conductive pads and the second conductive pads are set to be positioned on a same plane. | 07-30-2015 |
20150213946 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate, a first buildup layer formed on first-surface side of the substrate, a second buildup layer formed on second-surface side of the substrate, and an inductor component formed on the second-surface side of the substrate. The inductor component includes a base layer, first conductive patterns formed on first surface of the base layer, second conductive patterns formed on second surface of the base layer and through-hole conductors connecting the first and second conductive patterns through the base layer such that the inductor component has an inductor structure having the first conductive patterns, the second conductive patterns and the through-hole conductors, and the base layer of the inductor component has a magnetic body structure including magnetic material such that the magnetic body structure is positioned on an inner side of the inductor structure. | 07-30-2015 |
20150210601 | METHOD FOR PRODUCING HONEYCOMB DRIED BODY AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURED BODY - In a method for producing a honeycomb dried body, a ceramic raw material is extruded using an extruder to mold the ceramic raw material into an uncut honeycomb molded body including cell walls defining a plurality of cells. The uncut honeycomb molded body is dried to obtain an uncut honeycomb dried body. The uncut honeycomb dried body is cut. The extruding, the drying, and the cutting are carried out successively. | 07-30-2015 |
20150210029 | METHOD FOR PRODUCING HONEYCOMB DRIED BODY AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURED BODY - In a method for producing a honeycomb dried body, a ceramic raw material is extruded using an extruder to mold the ceramic raw material into an uncut honeycomb molded body including cell walls defining a plurality of cells. The uncut honeycomb molded body is dried to obtain an uncut honeycomb dried body. The uncut honeycomb dried body is cut using a cutter while the cutter moves along a moving direction of the uncut honeycomb dried body. The extruding, the drying, and the cutting are carried out successively. A moving speed of the cutter is synchronized with a moving speed of the uncut honeycomb dried body during the cutting. | 07-30-2015 |
20150209934 | METHOD FOR CUTTING HONEYCOMB DRIED BODY, METHOD FOR MANUFACTURING HONEYCOMB STRUCTURED BODY, HONEYCOMB DRIED BODY, AND HONEYCOMB STRUCTURED BODY - In a method for cutting a honeycomb dried body, the honeycomb dried body is cut using a water jet. The honeycomb dried body is made by drying a honeycomb molded body including cell walls defining a plurality of cells. | 07-30-2015 |
20150192228 | PAINT AND EXHAUST SYSTEM COMPONENT WITH THE PAINT - A paint includes an amorphous inorganic material, crystalline inorganic material particles, and pore-forming material particles. The amorphous inorganic material contains silica. The crystalline inorganic material particles contain zirconia. The crystalline inorganic material particles have an average particle size of about 0.1 μm to about 150 μm. A weight of the crystalline inorganic material particles is about 30 parts by weight to about 180 parts by weight to 100 parts by weight of the amorphous inorganic material. The pore-forming material particles have an average particle size of about 0.1 μm to about 25 μm. A weight of the pore-forming material particles is about 0.001 parts by weight to about 1 parts by weight to 100 parts by weight of the amorphous inorganic material. | 07-09-2015 |
20150182955 | METHOD FOR MANUFACTURING ZEOLITE, HONEYCOMB CATALYST, METHOD FOR MANUFACTURING HONEYCOMB CATALYST, AND ZEOLITE - In a method for manufacturing a zeolite, a raw material composition containing a Si source, an Al source, an alkali source, and a structure directing agent is reacted to synthesize the zeolite including a CHA-structured aluminosilicate. The Al source includes a dried aluminum hydroxide gel. | 07-02-2015 |
20150182900 | HONEYCOMB FILTER - A honeycomb filter includes a plurality of honeycomb fired bodies. Each of the plurality of honeycomb fired bodies includes an outer wall, a plurality of cells, and porous cell walls. The plurality of cells include exhaust gas introduction cells each having an open end at an exhaust gas inlet side and a plugged end at an exhaust gas outlet side and exhaust gas emission cells each having an open end at the exhaust gas outlet side and a plugged end at the exhaust gas inlet side. Sub-cells adjacent to the outer wall include exhaust gas introduction sub-cells among the exhaust gas introduction cells and exhaust gas emission sub-cells among the exhaust gas emission cells. A total volume of the exhaust gas emission sub-cells adjacent to the outer wall is greater than a total volume of the exhaust gas introduction sub-cells adjacent to the outer wall. | 07-02-2015 |
20150163919 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - A substrate having a built-in electronic component includes an insulating substrate having an opening portion, a conductor pattern formed on the substrate, an electronic component accommodated in the opening portion of the substrate and having a terminal, an insulating layer formed on the substrate such that the insulating layer is covering the pattern and the component in the substrate, and multiple via conductors penetrating through the insulating layer and including a first via conductor reaching to the pattern on the substrate and a second via conductor reaching to the terminal of the component in the substrate. The pattern has a recessed connecting portion connected to the first via conductor, the terminal of the component has a recessed connecting portion connected to the second via conductor, and the recessed connecting portion of the pattern has depth which is greater than depth of the recessed connecting portion of the terminal. | 06-11-2015 |
20150163901 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes resin insulation layers, conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of the resin insulation layers, and via conductors penetrating through the resin insulation layers respectively such that the via conductors are connecting the conductive layers through the resin insulation layers. The conductive layers and the via conductors are formed such that each of the conductive layers and each of the via conductors includes an electroless copper-plated film, an intermediate compound layer having Cu | 06-11-2015 |
20150163900 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes resin insulation layers, conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of the resin insulation layers, and via conductors penetrating through the resin insulation layers respectively such that the via conductors are connecting the conductive layers through the resin insulation layers. Each of the resin insulation layers includes a modified resin layer formed by plasma treatment such that the modified resin layer is forming the surface of each of the resin insulation layers, each of the conducive layers includes a modified conductive layer formed by the plasma treatment such that the modified conductive layer is forming the surface of each of the conductive layers, and the modified resin layer has a surface modification different from a surface modification of the modified conductive layer. | 06-11-2015 |
20150162255 | SEMICONDUCTOR MOUNTING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MOUNTING DEVICE - A semiconductor mounting device including a first substrate having insulation layers, conductor layers formed on the insulation layers, and via conductors connecting the conductor layers, a second substrate having insulation layers and conductor layers formed on the insulation layers of the second substrate, first bumps connecting the first substrate and the second substrate and formed on an outermost conductor layer of the first substrate formed on an outermost insulation layer of the first substrate, and second bumps positioned to mount a semiconductor element to the second substrate and formed on an outermost conductor layer of the second substrate formed on an outermost insulation layer of the second substrate. The second substrate has a thickness which is greater than a thickness of the first substrate. | 06-11-2015 |
20150156888 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes forming a through hole in an insulating substrate such that the hole extends from first surface of the substrate to second surface of the substrate on the opposite side, forming a seed layer on the first and second surfaces and wall of the hole, and applying pulse plating to the substrate via the seed layer such that a through-hole conductor is formed in the hole. The applying of the pulse plating includes flowing forward and reverse current on the first and second surfaces of the substrate such that when the forward current flows on the first surface of the substrate, the reverse current flows on the second surface of the substrate and that when the reverse current flows on the first surface of the substrate, the forward current flows on the second surface of the substrate. | 06-04-2015 |
20150156881 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - A substrate with a built-in electronic component includes multiple resin insulating layers including first, second, third and fourth insulating layers, multiple conductor layers including a first wiring layer including a first pad, a second wiring layer including a second pad, and a third wiring layer including third and fourth pads, multiple via conductors including a first via connecting the first and second pads through the second insulating layer, a second via connecting the second and third pads through the third and fourth insulating layers, and a third via connected to the fourth pad through the fourth insulating layer, and an electronic component positioned a cavity through the second and third insulating layers such that the third via is connecting terminal of the component and fourth pad. The second and third vias have filled plating filling opening portions through the third and fourth insulating layers and through the fourth insulating layer. | 06-04-2015 |
20150156880 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a core substrate, a first build-up layer formed on first surface of the substrate and having a recess formed to accommodate an electronic component, a second build-up layer formed on second surface of the substrate, and multiple pads including first pads on the first layer, second pads on the second layer, and third pads in bottom surface of the recess. The first and second layers have interlayer insulating layers, the insulating layers in interior portion of the first layer between the substrate and the bottom surface of the recess has number of insulating layers equal to number of insulating layers in the second layer, and the insulating layers in exterior portion of the first layer between the core substrate and the surface of the first layer has number of insulating layers greater than number of insulating layers in the second layer. | 06-04-2015 |
20150137931 | INDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND PRINTED WIRING BOARD - A printed wiring board includes an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding a circumference of the magnetic core structure. The magnetic core structure and the inductor pattern of the conductor layer form an inductor device. | 05-21-2015 |
20150136459 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A wiring board includes a first resin insulating layer, conductor pads on the first insulating layer including first and second conductor pads, a second resin insulating layer on the first insulating layer covering the first and second pads, an outermost conductor layer on the second insulating layer including first and second outermost wiring layers, via conductors through the second insulating layer including a first via conductor connecting the first wiring layer and first pad and a second via conductor connecting the second wiring layer and second pad, and a solder resist layer on the second insulating layer such that the solder resist layer is covering the first wiring layer and has one or more openings exposing the second wiring layer. The first wiring layer includes first main metal, and the second wiring layer includes second main metal which is different from the first metal of the first wiring layer. | 05-21-2015 |
20150136454 | COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A combined wiring board includes multiple wiring boards, and a connected metal frame having multiple metal frames and one or more connecting portions such that the metal frames are connected each other by the connecting portion or connecting portions and have accommodation opening portions formed to accommodate the wiring boards, respectively. | 05-21-2015 |
20150136453 | COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A combined wiring board includes a wiring board set having multiple wiring boards and one or more adhesive agent portions such that the wiring boards are connected each other by the adhesive agent portion or adhesive agent portions, and a metal frame having an accommodation opening portion formed to accommodate the wiring board set such that the wiring board set is positioned in the accommodation opening portion of the metal frame. | 05-21-2015 |
20150130079 | SEMICONDUCTOR ELEMENT - A multilayer device has a resin layer, a semiconductor device positioned in the resin layer and including an electronic component and a passivation layer having an opening exposing an electrode of the electronic component, an intermediate layer including metal layers and formed in the opening of the passivation layer such that the intermediate layer is connected to the electrode of the electronic component, and a buildup layer formed on the resin layer and including an insulating layer and a via conductor formed in the insulating layer such that the via conductor is connected to the intermediate layer. The resin layer includes one or more resin material selected from the group consisting of a thermosetting resin material and a thermoplastic resin material. | 05-14-2015 |
20150122530 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate including a resin insulating layer and multiple conductor layers, a first wiring structure formed on a first surface of the core substrate and including a conductor layer and a resin insulating layer, and a second wiring structure formed on a second surface of the core substrate and including a conductor layer and a resin insulating layer. The core substrate is interposed between the first wiring structure and the second wiring structure such that the resin insulating layers and conductor layers in the core substrate, first wiring structure and second wiring structure are alternately laminated, the resin insulating layer in the first wiring structure has a vol % of resin which is larger than a vol % of resin in the resin insulating layer in the second wiring structure such that a difference in the vol % of resin in the first and second wiring structures is in the range of from 0.5% to 5.0%. | 05-07-2015 |
20150121826 | HONEYCOMB FILTER - An object of the present invention is to provide a honeycomb filter having low pressure loss and high collection efficiency. The honeycomb filter of the present invention comprises a ceramic honeycomb substrate in which a multitude of cells through which a fluid flows are disposed in parallel in a longitudinal direction and are separated by cell walls, each cell being sealed at an end section at either the fluid inlet side or the fluid outlet side, and a filter layer which, among the surfaces of the cell walls, is formed on the surface of the cell walls of those cells in which the end section at the fluid inlet side is open and the end section at the fluid outlet side is sealed by a sealing material, wherein the filter layer comprises spherical ceramic particles, and the average particle size of the spherical ceramic particles increases gradually from the fluid inlet side toward the fluid outlet side. | 05-07-2015 |
20150121825 | HONEYCOMB FILTER - An object of the present invention is to provide a honeycomb filter which is resistant to detachment of the filter layer during regeneration processing, while suppressing any sudden increase in pressure loss caused by depth filtration. The honeycomb filter of the present invention comprises a ceramic honeycomb substrate in which a multitude of cells through which a fluid flows are disposed in parallel in a longitudinal direction and are separated by cell walls, each cell being sealed at an end section at either the fluid inlet side or the fluid outlet side, and a filter layer which, among the surfaces of the cell walls, is formed on the surface of the cell walls of those cells in which the end section at the fluid inlet side is open and the end section at the fluid outlet side is sealed, wherein the filter layer comprises hollow particles. | 05-07-2015 |
20150121824 | HONEYCOMB FILTER AND PRODUCTION METHOD FOR HONEYCOMB FILTER - An object of the present invention is to provide a honeycomb filter capable of preventing depth filtration and achieving a combination of high collection efficiency and low pressure loss. The honeycomb filter of the present invention comprises a ceramic honeycomb substrate in which a multitude of cells through which a fluid flows are disposed in parallel in a longitudinal direction and are separated by cell walls, each cell being sealed at an end section at either the fluid inlet side or the fluid outlet side, and a filter layer which, among the surfaces of the cell walls, is formed on the surface of the cell walls of those cells in which the end section at the fluid inlet side is open and the end section at the fluid outlet side is sealed, wherein the filter layer is composed of a plurality of spherical ceramic particles, and crosslinking bodies which bind the spherical ceramic particles to each other by crosslinking the spherical ceramic particles, and the spherical ceramic particles and the crosslinking bodies form a three-dimensional network structure. | 05-07-2015 |
20150114690 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIRING BOARD - A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer on first surface sides of the flexible and non-flexible substrates, a second wiring layer on second surface sides of the flexible and non-flexible substrates, a first insulating layer covering the first sides of the flexible and non-flexible substrates and having an opening exposing a portion of the first side of the flexible substrate, and a second insulating layer covering the second sides of the flexible and non-flexible substrates and having an opening exposing a portion of the second side of the flexible substrate. The first wiring layer includes first conductor pattern on the first side of the flexible substrate, and the second wiring layer includes second conductor pattern extending across the second sides of the flexible and non-flexible substrates. | 04-30-2015 |
20150114689 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIRING BOARD - A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer formed on first surfaces of the flexible and non-flexible substrates, a second wiring layer embedded in second surfaces of the flexible and non-flexible substrates, a first insulating layer covering the first surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the first surface of the flexible substrate, and a second insulating layer covering the second surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the second surface of the flexible substrate. The first wiring layer includes non-embedded wirings on the first surfaces of the flexible and non-flexible substrates, and the second wiring layer includes embedded wirings in the second surfaces of the flexible and non-flexible substrates. | 04-30-2015 |
20150104617 | STRUCTURE AND PAINT SET - A structure includes a surface coat layer of which the thickness on a bump such as a weld bead and a weld spatter or an edge portion, possibly formed on the surface of a base, is not greatly different from the thickness on a flat portion. The structure therefore has excellent properties including heat insulation properties and electrical insulation properties. The structure includes a base that is made of a metal and has a flat portion and at least one of a bump and an edge portion on a surface; and a surface coat layer covering the surface of the base, the surface coat layer including a first surface coat layer covering the flat portion and a second surface coat layer covering the at least one of a bump and an edge portion. | 04-16-2015 |
20150104616 | STRUCTURE AND PAINT SET - A structure includes a surface coat layer of which the thickness on a bump such as a weld bead and a weld spatter or an edge portion, possibly formed on the surface of a base, is not greatly different from the thickness on a flat portion. The structure therefore has excellent properties including heat insulation properties and electrical insulation properties. The structure includes a base that is made of a metal, and has a flat portion and at least one of a bump and an edge portion on a surface; and a surface coat layer that covers the surface of the base, the surface coat layer including: a first surface coat layer that covers the flat portion, and contains an amorphous inorganic material, or a crystalline inorganic material and an amorphous inorganic material in combination. | 04-16-2015 |
20150104611 | STRUCTURE AND PAINT FOR FORMING SURFACE COAT LAYER - A structure includes a surface coat layer of which the thickness on a bump such as a weld bead and a weld spatter or an edge portion, possibly formed on the surface of a base, is not greatly different from the thickness on a flat portion. The structure therefore has excellent properties including heat insulation properties and electrical insulation properties. The structure includes a base that is made of a metal, and has a flat portion and at least one of a bump and an edge portion on a surface; and a surface coat layer that is formed from an amorphous inorganic material and particles of a crystalline inorganic material, and covers the surface of the base, the surface coat layer including a first coat portion covering the flat portion and a second coat portion covering the at least one of a bump and an edge portion. | 04-16-2015 |
20150104610 | STRUCTURE AND PAINT FOR FORMING SURFACE COAT LAYER - A structure includes a surface coat layer of which the thickness on a bump such as a weld bead and a weld spatter or an edge portion, possibly formed on the surface of a base, is not greatly different from the thickness on a flat portion. The structure therefore has excellent properties including heat insulation properties and electrical insulation properties. The structure includes a base that is made of a metal, and has a flat portion and at least one of a bump and an edge portion on a surface; and a surface coat layer that is formed from an amorphous inorganic material and particles of a crystalline inorganic material, and covers the surface of the base, the surface coat layer including a first coat portion covering the flat portion and a second coat portion covering the at least one of a bump and an edge portion. | 04-16-2015 |
20150098204 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE - A method for manufacturing a printed wiring board includes forming a resin layer on an interlayer layer such that the resin layer has first openings exposing circuits in central portion and second openings exposing circuits in peripheral portion of the interlayer layer, forming solder bumps on the circuits in the first openings, forming a plating resist over the bumps and resin layer such that the resist has openings having diameters greater than the second openings and exposing the second openings, forming a seed layer on the resist, in the openings and on the circuits through the second openings, applying electrolytic plating on the resist such that electrolytic plating fills the openings and forms a plated film on the resist and metal posts in the openings, etching the plating such that the plated film is removed and recesses are formed on end surfaces of the posts, and removing the resist. | 04-09-2015 |
20150096275 | HONEYCOMB FILTER - A honeycomb filter includes a plurality of honeycomb fired bodies and adhesive layers. Each of the plurality of honeycomb fired bodies includes a plurality of cells, porous cell walls, and an outer wall. The plurality of cells includes exhaust gas introduction cells and exhaust gas emission cells. The exhaust gas introduction cells and the exhaust gas emission cells each have a uniform cross-sectional shape throughout from the exhaust gas inlet side to the exhaust gas outlet side excluding a plugged portion in a cross section perpendicular to a longitudinal direction of the plurality of cells. Each of the exhaust gas emission cells is adjacently surrounded fully by the exhaust gas introduction cells across the porous cell walls. The plurality of cells includes outer cells which are adjacent to the outer wall and which include the exhaust gas introduction cells. | 04-09-2015 |
20150096274 | HONEYCOMB FILTER - A honeycomb filter includes a plurality of cells and porous cell walls. The plurality of cells defines exhaust gas passages. The plurality of cells includes exhaust gas introduction cells and exhaust gas emission cells. Each of the exhaust gas emission cells is adjacently surrounded fully by the exhaust gas introduction cells across the porous cell walls. The exhaust gas introduction cells include first exhaust gas introduction cells and second exhaust gas introduction cells. A cross-sectional area of each of the exhaust gas emission cells in a cross section perpendicular to a longitudinal direction of the plurality of cells is equal to or larger than a cross-sectional area of each of the second exhaust gas introduction cells in the cross section. The exhaust gas introduction cells and the exhaust gas emission cells have one of a first structure and a second structure in the cross section. | 04-09-2015 |
20150092357 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE - A method for manufacturing a printed wiring board includes forming a resin insulation layer on an interlayer resin insulation layer and conductive circuits such that the resin insulation layer has first openings exposing pad portions in central portion of the interlayer layer and second openings exposing pad portions in peripheral portion of the interlayer layer, forming a seed layer on the resin insulation layer, in the first and second openings and on the pad portions, forming on the seed layer a plating resist such that the resist has resist openings exposing the second openings and having diameters greater than the second openings, filling the resist openings with electrolytic plating material via the seed layer such that metal posts are formed in the resist openings, removing the resist from the resin insulation layer, and removing the seed layer exposed on the resin insulation layer by the removing of the resist. | 04-02-2015 |
20150092356 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE - A method for manufacturing a printed wiring board includes forming a removable layer over first pads in central portion of an interlayer insulation layer to mount IC chip, forming on the interlayer and removable layers a resin insulation layer having openings exposing second pads in peripheral portion of the interlayer layer to connect second substrate, forming a seed layer on the resin layer, in the openings and on the second pads, forming on the seed layer a plating resist having resist openings exposing the openings of the resin layer with diameters greater than the openings, filling the resist openings with electrolytic plating such that metal posts are formed in the resist openings, removing the resist, removing the seed layer exposed on the resin layer, and removing the removable layer and the resin layer on the removable layer such that cavity exposing the first pads is formed in the resin layer. | 04-02-2015 |
20150087499 | HONEYCOMB STRUCTURE - A honeycomb structure includes a honeycomb unit. The honeycomb unit has a plurality of through holes defined by partition walls along a longitudinal direction of the honeycomb unit. The partition walls have a thickness of approximately 0.1 mm to approximately 0.4 mm. The honeycomb unit is manufactured by molding raw material paste by extrusion molding and thereafter by firing the molded raw material paste. The raw material paste contains zeolite and an inorganic binder. A specific surface area of the zeolite is more than or equal to approximately 500 m | 03-26-2015 |
20150086436 | EXHAUST GAS PROCESSING DEVICE - An exhaust gas processing device includes a cylindrical metallic member and an insulating layer. The insulating layer has a thickness of about 20 μm to about 400 μm and is densely formed such that no through pores exist in a thickness direction of the insulating layer. The insulating layer is provided on an inner surface of the cylindrical metallic member. | 03-26-2015 |
20150085461 | COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD - A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards. | 03-26-2015 |
20150083471 | COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A combined wiring board includes a metal frame having multiple opening portions, and multiple wiring boards accommodated in the opening portions in the metal frame, respectively. The opening portions in the metal frame have side walls having holding portions such that the holding portions hold the wiring boards in the opening portions in the metal frame, and the metal frame has slit portions adjacent to the holding portions and connecting portions connecting the slit portions to the opening portions. | 03-26-2015 |
20150082759 | HOLDING SEALING MATERIAL, METHOD FOR PRODUCING HOLDING SEALING MATERIAL, METHOD FOR MANUFACTURING EXHAUST GAS PURIFYING APPARATUS, AND EXHAUST GAS PURIFYING APPARATUS - A holding sealing material includes inorganic fibers, a longitudinal direction, a width direction, a thickness direction, a first main face, a second main face, and a structure. The first main face is substantially perpendicular to the thickness direction. The holding sealing material is to be wrapped along the longitudinal direction around an exhaust gas treating body housed in a casing of an exhaust gas purifying apparatus and disposed between the exhaust gas treating body and the casing so that the first main face faces an outer circumference face of the exhaust gas treating body and the second main face faces an inner circumference face of the casing. The structure is plastically deformed by applying a shear stress to the first main face and the second main face respectively in mutually opposite directions along the width direction. | 03-26-2015 |
20150077963 | PRINTED WIRING BOARD WITH METAL POST AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD WITH METAL POST - A printed wiring board includes a wiring board, and multiple posts formed on the wiring board and positioned to mount a second printed wiring board onto the wiring board. Each of the metal posts has a first surface connected to the wiring board, a second surface formed to connect the second printed wiring board, and a side surface between the first surface and the second surface, and the side surface of each of the metal posts forms a curved surface. | 03-19-2015 |
20150075851 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an interlayer resin insulation layer having a penetrating hole, a conductive circuit formed on a first surface of the interlayer resin insulation layer, a filled via conductor formed in the penetrating hole of the interlayer resin insulation layer and connected to the conductive circuit, a first surface-treatment coating structure formed on a first surface of the filled via conductor and having an electroless plating structure, and a second surface-treatment coating structure formed on a second surface of the filled via conductor on an opposite side with respect to the first surface-treatment coating structure and having an electroless plating structure. The filled via conductor includes a first conductive layer formed on side wall of the penetrating hole and a plated material filling the penetrating hole, and the first surface-treatment coating structure has a thickness which is different from a thickness of the second surface-treatment coating structure. | 03-19-2015 |
20150075848 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes multiple insulating layers including first, second, third, fourth and fifth insulation layers laminated in the order of the first, second, third, fourth and fifth insulation layers. The first insulation layer has a first conductor including plating, the second insulation layer has a second conductor including plating, the third insulation layer has a third conductor including conductive paste, the fourth insulation layer has a fourth conductor including plating, the fifth insulation layer has a fifth conductor including plating, and the first conductor, the second conductor, the third conductor, the fourth conductor and the fifth conductor are formed along the same axis and are electrically continuous with each other. | 03-19-2015 |
20150071829 | HONEYCOMB FILTER, EXHAUST GAS PURIFYING APPARATUS, AND METHOD FOR PURIFYING EXHAUST GAS - A honeycomb filter includes a honeycomb fired body made of silicon carbide particles. The honeycomb fired body includes cell walls, a peripheral wall, and a silicon-containing oxide layer. The cell walls are to define cells placed in a longitudinal direction of the honeycomb fired body. The cell walls have a thickness of about 0.2 mm or less. Each of the cells has a first end portion and a second end portion opposite to the first end portion in the longitudinal direction. Either the first end portion or the second end portion of the each of the cells is sealed. The peripheral wall constitutes a periphery of the honeycomb fired body. The peripheral wall has a thickness larger than the thickness of the cell walls. The silicon-containing oxide layer is provided on surfaces of the silicon carbide particles. | 03-12-2015 |
20150068791 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate, pads formed on an electronic-component mounting surface of the substrate, and a resin insulation layer covering the electronic-component mounting surface and having opening portions such that the opening portions are exposing the pads, respectively. The pads include a non-solder mask defined pad having a wiring portion and a non-solder mask defined pad having no wiring portion, and the opening portions are formed such that the non-solder mask defined pads have exposed conductor areas which have substantially same areas inside the opening portions. | 03-12-2015 |
20150068788 | PRINTED WIRING BOARD - A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer. | 03-12-2015 |
20150068176 | HONEYCOMB FILTER - The honeycomb filter of the present invention comprises a ceramic honeycomb substrate formed from a porous body of sintered ceramic particles, and a filter layer formed on the surface of the cell walls, wherein a portion of the filter layer penetrates from the surface of the cell walls into pores formed by the ceramic particles to form inter-particle filtration bodies, these inter-particle filtration bodies are formed from a plurality of spherical ceramic particles and crosslinking bodies which bind the spherical ceramic particles to each other, and the spherical ceramic particles and the crosslinking bodies form a three-dimensional network structure. | 03-12-2015 |
20150065337 | HONEYCOMB CATALYST AND EXHAUST GAS PURIFYING APPARATUS - A honeycomb catalyst includes a honeycomb unit. The honeycomb unit has a plurality of through holes that are arranged in parallel in a longitudinal direction and partitions that are provided between the plurality of through holes. The partitions have pores having an average pore size of about 0.05 to about 0.2 μm. The honeycomb unit includes a zeolite and an inorganic binder. The zeolite includes a CHA-structured aluminosilicate having a Si/Al ratio of about 15 to about 50. | 03-05-2015 |
20150065336 | HONEYCOMB CATALYST AND EXHAUST GAS PURIFYING APPARATUS - A honeycomb catalyst includes a honeycomb unit. The honeycomb unit has a plurality of through holes that are arranged in parallel in a longitudinal direction and partitions that are provided between the plurality of through holes. The honeycomb unit includes a first zeolite, a second zeolite, and an inorganic binder. The first zeolite includes a CHA-structured aluminosilicate having a Si/Al ratio of about 15 to about 50. The second zeolite includes a silicoaluminophosphate having a Si/(Si+Al+P) ratio of about 0.1 to about 0.25. A volume ratio of the first zeolite to the second zeolite is about 75:about 25 to about 90:about 10. | 03-05-2015 |
20150065334 | HONEYCOMB CATALYST AND EXHAUST GAS PURIFYING APPARATUS - A honeycomb catalyst includes a honeycomb unit. The honeycomb unit has a plurality of through holes that are arranged in parallel in a longitudinal direction and partitions that are provided between the plurality of through holes. The honeycomb unit includes a zeolite, inorganic particles, and an inorganic binder. The zeolite includes a CHA-structured aluminosilicate having a Si/Al ratio of about 15 to about 50. The inorganic particles includes an oxide that has a positive coefficient of thermal expansion. A volume ratio of the zeolite to the inorganic particles is about 50:about 50 to about 90:about 10. | 03-05-2015 |
20150062849 | PRINTED WIRING BOARD - A wiring board includes a unit section including product portions, and a frame section formed along the periphery of the unit section. The frame section has a dummy pattern which includes conductive portions and connection lines such that the connection lines are formed in spaces between the conductive portions and linking the conductive portions. | 03-05-2015 |
20150060127 | COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A combined printed wiring board includes a multilayer printed wiring board, and a wiring film fixed to a surface of the multilayer printed wiring board and including a first wiring structure formed to connect multiple semiconductor elements and a second wiring structure formed to connect the multilayer printed wiring board and each of the semiconductor elements. | 03-05-2015 |
20150060124 | COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A combined printed wiring board includes a multilayer printed wiring board having an outermost insulation layer, and a wiring film fixed to a portion of the outermost insulation layer of the multilayer printed wiring board. The wiring film includes dense-pitch pads formed on a semiconductor-mounting surface of the wiring film, the multilayer printed wiring board has sparse-pitch pads formed on a semiconductor-mounting surface of the multilayer printed wiring board, the dense-pitch pads are formed to facilitate electrical connection between a first semiconductor element and a second semiconductor element, and the sparse-pitch pads are formed to facilitate electrical connection between the multilayer printed wiring board and the first semiconductor element and/or the second semiconductor element. | 03-05-2015 |
20150059305 | HONEYCOMB FILTER AND METHOD FOR PRODUCING HONEYCOMB FILTER - An object of the present invention is to provide a honeycomb filter capable of achieving a combination of high collection efficiency and low pressure loss. The honeycomb filter comprises a ceramic honeycomb substrate in which a multitude of cells through which a fluid flows are disposed in parallel in a longitudinal direction and are separated by cell walls, each cell being sealed at an end section at either the fluid inlet side or the fluid outlet side, and a filter layer which, among the surfaces of the cell walls, is formed on the surface of the cell walls of those cells in which the end section at the fluid inlet side is open and the end section at the fluid outlet side is sealed by a sealing material, wherein the thickness of the filter layer increases gradually from the fluid inlet side toward the fluid outlet side. | 03-05-2015 |
20150055313 | COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD - A method for manufacturing a combined wiring board includes preparing wiring boards, preparing a metal frame having opening portions formed to accommodate the wiring boards, respectively, positioning the wiring boards in the opening portions in the metal frame, and forming crimped portions in the metal frame by plastic deformation such that sidewalls of the metal frame in the opening portions bond sidewalls of each of the wiring boards. The crimped portions are formed such that the crimped portions in the metal frame have amounts of the plastic deformation which are set different for positions of the crimped portions in the metal frame. | 02-26-2015 |
20150053470 | PRINTED WIRING BOARD - A wiring board includes a first resin insulation layer, a conductive layer formed on the first insulation layer and including first and second conductive circuits formed adjacent to each other, and a second resin insulation layer formed on the first insulation layer and on the conductive layer such that the second insulation layer is filling a space between the first and second conductive circuits. The first and second conductive circuits are formed such that a distance between the first conductive circuit and the second conductive circuit is in a range of 10 μm or less at the first insulation layer, and each of the first and second conductive circuits has a bottom portion in contact with the first insulation layer and an upper portion on the bottom portion such that the upper portion has a roughened sidewall and the bottom portion has a sidewall which is not roughened. | 02-26-2015 |
20150043183 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A wiring board with a built-in electronic component includes a core substrate, an electronic component in the substrate, a first upper-layer structure on first surface of the substrate, a second upper-layer structure on second surface of the substrate, and via conductors in the substrate and first upper-layer structure such that the via conductors are connected to an electrode of the component. The substrate has an accommodating layer, a first connection layer on first surface of the accommodating layer, and a second connection layer on second surface of the accommodating layer, the accommodating layer includes inner wiring and insulation layers and has cavity accommodating the component, the first connection layer includes inner wiring and insulation layers, and the second connection layer includes inner wiring and insulation layers such that the second connection layer includes greater number of inner wiring and insulation layers than the first connection layer. | 02-12-2015 |
20150040389 | METHOD FOR MANUFACTURING WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A method for manufacturing a wiring board with a built-in electronic component includes positioning an electronic component in a cavity of a substrate, forming intermediate structures each including an intermediate insulation layer and an intermediate wiring-pattern layer on upper and lower surfaces of the substrate, respectively, such that a component-accommodating substrate is formed, attaching a support sheet to a first surface of the component-accommodating substrate, forming a connection layer including insulation layers and wiring-pattern layers on a second surface of the component-accommodating substrate on the opposite side with respect to the first surface of the component-accommodating substrate, removing the support sheet from the component-accommodating substrate such that an intermediate laminate structure having the connection layer laminated on the second surface of the component-accommodating substrate is formed, and forming upper-layer structures each including an insulation layer and a wiring-pattern layer on upper and lower surfaces of the intermediate laminate, respectively. | 02-12-2015 |
20150037532 | HONEYCOMB FILTER - A honeycomb filter includes a plurality of cells, porous cell walls, and an oxidation catalyst. The plurality of cells include exhaust gas introduction cells and exhaust gas emission cells. The oxidation catalyst is supported inside the porous cell walls in an amount of 5 to 60 g/L. The exhaust gas emission cells have an average cross sectional area larger than an average cross sectional area of the exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction. A total volume of the exhaust gas introduction cells is larger than a total volume of the exhaust gas emission cells. | 02-05-2015 |
20150037221 | HONEYCOMB FILTER - A honeycomb filter includes a plurality of cells and porous cell walls. The plurality of cells include exhaust gas introduction cells and exhaust gas emission cells. The porous cell walls supports an SCR catalyst. The exhaust gas introduction cells include first exhaust gas introduction cells and second exhaust gas introduction cells. The second exhaust gas introduction cells each have a cross sectional area larger than a cross sectional area of each of the first exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality of cells. Each of the exhaust gas emission cells has a cross sectional area equal to or larger than the cross sectional area of each of the second exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality of cells. | 02-05-2015 |
20150037220 | HONEYCOMB FILTER - A honeycomb filter includes a plurality of cells and porous cell walls. Exhaust gas is to flow through the plurality of cells. The plurality of cells include exhaust gas introduction cells and exhaust gas emission cells. The honeycomb filter has a round cross sectional shape. The honeycomb filter has a ratio of length of the honeycomb filter to a diameter of the round cross sectional shape of less than 1.0. A total volume of the exhaust gas introduction cells is larger than a total volume of the exhaust gas emission cells. | 02-05-2015 |
20150034378 | PRINTED WIRING BOARD - A printed wiring board includes an insulative resin substrate having a penetrating hole, a first conductive layer formed on first surface of the substrate, a second conductive layer formed on second surface of the substrate on the opposite side, and a through-hole conductor formed in the penetrating hole and connecting the first and second conductive layers. The through-hole conductor includes a seed layer on inner wall of the penetrating hole, a first electrolytic plated layer on the seed layer such that the first plated layer is filling the space formed by the seed layer in the penetrating hole and forming recesses at the ends of the penetrating hole, respectively, and second electrolytic plated layers filling the recesses, respectively, and the second plated layers includes electrolytic plating having an average crystalline particle diameter greater than an average crystalline particle diameter of electrolytic plating forming the first plated layer. | 02-05-2015 |
20150034374 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a first insulation layer, an electronic component built into the first insulation layer, a second insulation layer having a via conductor and formed on a first surface of the first insulation layer, and a conductive film formed on the first insulation layer on the opposite side with respect to the first surface of the first insulation layer such that the conductive film is positioned to face a back surface of the electronic component. The first insulation layer has a coefficient of thermal expansion which is set higher than a coefficient of thermal expansion of the second insulation layer. | 02-05-2015 |
20150034365 | METHOD FOR MANUFACTURING WIRING BOARD AND WIRING BOARD - A method for manufacturing a wiring board includes preparing a wiring board having an insulation layer, a conductive pattern and a solder-resist layer laminated such that the solder-resist layer is covering the conductive pattern and exposing a conductive pad portion of the conductive pattern, applying microwave plasma on the wiring board in a nonoxidative atmosphere such that the wiring board undergoes microwave plasma treatment in the nonoxidative atmosphere, and forming a surface-treatment layer on the conductive pad portion of the conductive pattern after the applying of microwave plasma on the wiring board. | 02-05-2015 |
20150033691 | HONEYCOMB FILTER - A honeycomb filter includes a plurality of cells and porous cell walls. The plurality of cells include exhaust gas introduction cells and exhaust gas emission cells. Each of the exhaust gas emission cells is adjacently surrounded fully by the exhaust gas introduction cells across the porous cell walls. The exhaust gas introduction cells include first exhaust gas introduction cells and second exhaust gas introduction cells. Each of the first exhaust gas introduction cells has the cross sectional area equal to or smaller than 0.7 mm | 02-05-2015 |
20150033690 | HONEYCOMB FILTER - A honeycomb filter includes a silicon carbide honeycomb fired body, an end face, and porous cell walls. The silicon carbide honeycomb fired body includes a plurality of cells through which exhaust gas is to flow and which include exhaust gas introduction cells and exhaust gas emission cells. The silicon carbide honeycomb fired body includes silicon carbide grains having a silicon-containing oxide layer with a thickness of 0.1 to 2 μm on surfaces of the silicon carbide grains. The end face has an aperture ratio of not less than 20% at the exhaust gas emission side. The porous cell walls define rims of the plurality of cells. The plugged portions of the exhaust gas introduction cells are arranged in vertical and horizontal lines with the porous cell walls residing between the plugged portions in the end face at the exhaust gas emission side. | 02-05-2015 |
20150033686 | HONEYCOMB FILTER - A honeycomb filter includes a plurality of cells and porous cell walls. The plurality of cells include exhaust gas introduction cells and exhaust gas emission cells. The porous cell walls each have a porosity of 55% or acre but not more than 70%. The porous cell walls include pores with a pore diameter of 40 μm or more. The pores have a pore volume occupying 10% or more of a total pore volume of the porous cell walls. The exhaust gas emission cells have an average cross sectional area larger than an average cross sectional area of the exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality of cells. A total volume of the exhaust gas introduction cells is larger than a total volume of the exhaust gas emission cells. | 02-05-2015 |
20150026975 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer. | 01-29-2015 |
20150022982 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component. | 01-22-2015 |
20150021070 | WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD - A wiring board includes an insulation layer, and a conductive pattern formed on the insulation layer having a repaired disconnected portion. The repaired disconnected portion has a first conductive layer connecting disconnected edges of the conductive pattern and a second conductive layer covering the first conductive layer, the first conductive layer has a first electrical resistivity which is set higher than an electrical resistivity of the conductive pattern, and the second conductive layer has a second electrical resistivity which is set lower than the first electrical resistivity of the first conductive layer. | 01-22-2015 |
20150017343 | DIE FOR EXTRUSION MOLDING, METHOD OF PRODUCING DIE FOR EXTRUSION MOLDING, EXTRUDER, AND METHOD OF PRODUCING HONEYCOMB STRUCTURED BODY - A die for extrusion molding includes a first face, a second face, a raw material supply section, and a molding section. The second face is provided opposite the first face. The raw material supply section includes a first through hole that extends from the first face toward the second face. The molding section includes a second through hole and a nitride layer. The second through hole extends from the second face toward the first face so as to communicate with the first through hole. The nitride layer is provided on an inner wall surface of the second through hole. | 01-15-2015 |
20150017330 | APPLICATION JIG AND METHOD OF MANUFACTURING HONEYCOMB STRUCTURED BODY - An application jig includes a first principal surface, a second principal surface, and an opening section. The second principal surface is provided on an opposite side of the first principal surface. The opening section penetrates from the first principal surface to the second principal surface and includes a first opening section and a second opening section. The first opening section is provided on the first principal surface side. The second opening section is provided on the second principal surface side and has a substantially constant diameter from the second principal surface toward a boundary line between the first opening section and the second opening section. The first opening section has a diameter gradually decreasing from the first principal surface toward the boundary line. | 01-15-2015 |
20150017328 | SURFACE TREATMENT APPARATUS AND METHOD FOR NUFACTURING SURFACE-TREATED SUBSTRATE - A surface treatment apparatus includes a treatment vessel which contains a treatment solution, a transfer device which transfers a substrate through an interior portion of the treatment vessel in an in-plane direction of the substrate, and a jet device which is positioned in the interior portion of the treatment vessel and jets the treatment solution onto a surface of the substrate such that the surface of the substrate is treated with the treatment solution in the interior portion of the treatment vessel. The jet device has a nozzle hole which jets the treatment solution in a jet direction set parallel or diagonal with respect to the substrate surface. | 01-15-2015 |
20150017075 | HONEYCOMB FILTER AND PRODUCTION METHOD FOR HONEYCOMB FILTER - A honeycomb filter includes a ceramic honeycomb substrate, an auxiliary filter layer, an SCR catalyst, and a portion. The ceramic honeycomb substrate has cell walls provided along a longitudinal direction of the ceramic honeycomb substrate to define cells through which fluid is to pass and which have a fluid inlet end and a fluid outlet end opposite to the fluid inlet end along the longitudinal direction. The cells include first cells and second cells. The auxiliary filter layer is provided on first surfaces of first cell walls of the first cells. The SCR catalyst is supported on second surfaces of second cell walls of the second cells. The second surfaces substantially correspond to the first surfaces. The portion satisfies a01-15-2015 | |
20150017072 | INORGANIC FIBER, METHOD OF PRODUCING INORGANIC FIBER AGGREGATE, HOLDING SEALING MATERIAL, AND EXHAUST GAS PURIFYING APPARATUS - Inorganic fibers include a surface and a structure. The surface has a friction coefficient of about 0.5 or greater. The friction coefficient is measured using a scanning probe microscope. The structure is to constitute a holding sealing material to be provided in an exhaust gas purifying apparatus. | 01-15-2015 |
20150016079 | PRINTED WIRING BOARD - A wiring board includes a first resin insulation layer, an electronic component positioned on first surface of the first insulation layer, a second resin insulation layer formed on the first surface of the first insulation layer such that the second insulation layer is embedding the electronic component, a conductive layer formed on the second insulation layer, a third resin insulation layer formed on the conductive layer and second insulation layer, and a connection via conductor formed in the second insulation layer such that the connection via conductor is connecting electrode of the electronic component and conductive layer on the second insulation layer. The first insulation layer has a pad structure on second surface side of the first insulation layer on opposite side of the first surface, and the first insulation layer has coefficient of thermal expansion set lower than coefficients of thermal expansion of the second and third insulation layers. | 01-15-2015 |
20150014903 | DIE FOR EXTRUSION MOLDING, METHOD OF PRODUCING DIE FOR EXTRUSION MOLDING, AND METHOD OF PRODUCING HONEYCOMB STRUCTURED BODY - A die for extrusion molding includes a first face, a second face, a raw material supply section, a molding section, and a treated surface. The second face is provided opposite the first face. The molding section has a second through hole that extends from the second face toward the first face so as to communicate with a first through hole. The treated surface is provided on an inner wall surface of the second through hole to have a structure such that a material for the die is machined to form the material into a die shape and to provide a machining-affected layer on the inner wall surface of the second through hole in the molding section, an oxidized layer is provided by heating the machining-affected layer to oxidize the machining-affected layer so as to convert the machining-affected layer into the oxidized layer, and the oxidized layer is removed. | 01-15-2015 |
20150014902 | DIE FOR EXTRUSION MOLDING, METHOD OF PRODUCING DIE FOR EXTRUSION MOLDING, AND METHOD OF PRODUCING HONEYCOMB STRUCTURED BODY - A die for extrusion molding includes a first face, a second face, a raw material supply section, a molding section, and a structure. The molding section has a second through hole that extends from the second face toward the first face so as to communicate with a first through hole. The structure is such that a material for the die is machined to form the material into a predetermined shape and to provide a machining-affected layer on an inner wall surface of the second through hole in the molding section, an oxidized layer is provided by heating the machining-affected layer to oxidize the machining-affected layer so as to convert the machining-affected layer into the oxidized layer, the oxidized layer is removed so that a treated surface is provided, and the treated surface is nitrided by ion implantation to provide a nitride layer. | 01-15-2015 |
20150013577 | ANNULAR STRUCTURE HAVING EXCELLENT HEAT INSULATING AND HEAT RELEASING PROPERTIES - A structure of the present invention is the structure which is formed of a base made of a metal and an inorganic material surface layer made of crystalline and amorphous inorganic materials, wherein thermal conductivity of the inorganic material surface layer is lower than the thermal conductivity of the base, infrared emissivity of the inorganic material surface layer is higher than the infrared emissivity of the base, and the base is an annular body. | 01-15-2015 |
20150013286 | HONEYCOMB FILTER AND PRODUCTION METHOD FOR HONEYCOMB FILTER - A honeycomb filter includes a ceramic honeycomb substrate and an auxiliary filter layer. The ceramic honeycomb substrate includes a porous honeycomb fired body having cell walls provided along a longitudinal direction of the porous honeycomb fired body to define cells through which fluid is to pass and which have a fluid inlet end and a fluid outlet end opposite to the fluid inlet end along the longitudinal direction. The cells include first cells including an inlet opening end at the fluid inlet end and an outlet closed end at the fluid outlet end. The auxiliary filter layer is provided on a surface of first cell walls of the first cells and on a pore portion in the first cell walls, and includes a first layer and a second layer. In the first layer, particles having a first average particle diameter are deposited on the surface of the first cell walls. | 01-15-2015 |
20150013284 | HONEYCOMB STRUCTURED BODY, EXHAUST GAS PURIFYING HONEYCOMB FILTER, AND EXHAUST GAS PURIFYING DEVICE - A honeycomb structured body includes a plurality of silicon carbide-based honeycomb fired bodies and adhesive layers. The plurality of silicon carbide-based honeycomb fired bodies each include silicon carbide particles and cell walls. The silicon carbide particles have a surface coated with a silicon-containing oxide layer. The cell walls are provided along a longitudinal direction of the plurality of silicon carbide-based honeycomb fired bodies to define cells. Each of the cells has a first end and a second end opposite to the first end along the longitudinal direction. Either the first end or the second end is sealed. The adhesive layers are provided between the plurality of silicon carbide-based honeycomb fired bodies to bond the plurality of silicon carbide-based honeycomb fired bodies. The adhesive layers include alumina fibers and inorganic balloons. | 01-15-2015 |
20150013283 | HONEYCOMB STRUCTURED BODY, EXHAUST GAS PURIFYING HONEYCOMB FILTER, AND EXHAUST GAS PURIFYING DEVICE - A honeycomb structured body includes a plurality of pillar-shaped honeycomb fired bodies and adhesive layers. The plurality of pillar-shaped honeycomb fired bodies each include cell walls provided along a longitudinal direction of the plurality of pillar-shaped honeycomb fired bodies to define cells. Each of the cells has a first end and a second end opposite to the first end along the longitudinal direction. Either the first end or the second end is sealed. The adhesive layers are provided between the plurality of pillar-shaped honeycomb fired bodies to bond the plurality of pillar-shaped honeycomb fired bodies. The adhesive layers include alumina fibers and inorganic balloons. The alumina fibers have an average length of about 25 μm to about 100 μm. The inorganic balloons have an average particle size of about 150 μm to about 250 μm. | 01-15-2015 |
20150008625 | METHOD OF PRODUCING HONEYCOMB STRUCTURED BODY, AND DIE FOR EXTRUSION MOLDING - In a method of producing a honeycomb structured body, a die for extrusion molding is provided to produce at least one honeycomb molded body. The die includes a die body having a raw material inlet side face and a molded body extrusion side face. The raw material inlet side face includes raw material supply holes for supplying a ceramic raw material. The molded body extrusion side face includes molding grooves for molding the ceramic raw material into a shape of the at least one honeycomb molded body. The raw material supply holes and the molding grooves communicate with one another through connecting parts provided between the raw material supply holes and the molding grooves. The connecting parts each include, in a cross section substantially parallel to an extruding direction of the ceramic raw material, a curved part and a straight part. | 01-08-2015 |
20150008021 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes an interlayer resin insulation layer, multiple pads formed on the interlayer resin insulation layer, and multiple metal posts having bonding material portions and positioned on the pads, respectively, such that the metal posts are bonded to the pads through the bonding material portions of the metal posts, respectively. | 01-08-2015 |
20140374150 | PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE - A package substrate includes an outermost interlayer resin insulation layer, an outermost conductive layer formed on a first surface of the outermost interlayer resin insulation layer and including first pads positioned to mount a first electronic component and second pads positioned to mount a second electronic component, a first conductive layer including first conductive circuits and formed on a second surface of the outermost interlayer resin insulation layer on the opposite side with respect to the first surface, first via conductors penetrating through the outermost interlayer resin insulation layer such that the first via conductors are connecting the first conductive layer and the first pads, and second via conductors penetrating through the outermost interlayer resin insulation layer such that the second via conductors are connecting the first conductive layer and the second pads. The first conductive circuits in the first conductive layer are connecting the first and second pads, respectively. | 12-25-2014 |
20140363620 | METHOD FOR MANUFACTURING ALUMINUM-TITANATE-BASED CERAMIC HONEYCOMB STRUCTURE - A method for manufacturing a ceramic honeycomb structure includes kneading titania particles, alumina particles and a binder such that a raw material paste containing the titania particles, the alumina particles and the binder is prepared, forming a body made of the raw material paste and having the honeycomb structure, and sintering the body having the honeycomb structure such that a ceramic body having the honeycomb structure and made of aluminum titanate is formed. The titania particles are secondary titania particles each comprising primary titania particles aggregated such that the secondary titania particles have a mean volume particle diameter in the range of from 5 μm to 20 μm, and the alumina particles have a mean volume particle diameter in the range of from 2 μm to 5 μm. | 12-11-2014 |
20140363619 | METHOD FOR MANUFACTURING ALUMINUM-TITANATE-BASED CERAMIC HONEYCOMB STRUCTURE - A method for manufacturing a ceramic honeycomb structure includes kneading titania particles, alumina particles and a binder such that a raw material paste containing the titania particles, the alumina particles and the binder is prepared, forming a body made of the raw material paste and having the honeycomb structure, and sintering the body having the honeycomb structure such that a ceramic body having the honeycomb structure and made of aluminum titanate is formed. The kneading includes combining the binder, a titania powder containing the titania particles and an alumina powder containing the alumina particles, and the titania powder includes magnesium in an amount of 500 ppm or less with respect to the titania powder in a weight ratio based on conversion from MgO. | 12-11-2014 |
20140363618 | METHOD FOR MANUFACTURING ALUMINUM-TITANATE-BASED CERAMIC HONEYCOMB STRUCTURE - A method for manufacturing a ceramic honeycomb structure includes kneading titania particles, alumina particles and a binder such that a raw material paste containing the titania particles, the alumina particles and the binder is prepared, forming a body made of the raw material paste and having the honeycomb structure, and sintering the body having the honeycomb structure such that a ceramic body having the honeycomb structure and made of aluminum titanate is formed. The kneading includes combining the binder, a titania powder containing the titania particles and an alumina powder containing the alumina particles, and the titania powder includes potassium in an amount of from 100 ppm to 600 ppm with respect to the titania powder in a weight ratio based on conversion from K | 12-11-2014 |
20140363617 | METHOD FOR MANUFACTURING ALUMINUM-TITANATE-BASED CERAMIC HONEYCOMB STRUCTURE - A method for manufacturing a ceramic honeycomb structure includes kneading titania particles, alumina particles and a binder such that a raw material paste containing the titania particles, the alumina particles and the binder is prepared, forming a body made of the raw material paste and having the honeycomb structure, and sintering the body having the honeycomb structure such that a ceramic body having the honeycomb structure and made of aluminum titanate is formed. The kneading includes combining the binder, a titania powder containing the titania particles and an alumina powder containing the alumina particles, and the titania powder includes sodium in an amount of from 200 ppm to 1,000 ppm with respect to the titania powder in a weight ratio based on conversion from Na | 12-11-2014 |
20140360767 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and including a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and are set off from the second mounting pads toward the semiconductor element. | 12-11-2014 |
20140360759 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and having a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and form a distance between adjacent first and third mounting pads which is greater than a distance between adjacent first mounting pads. | 12-11-2014 |
20140356242 | HOLDING SEALING MATERIAL, EXHAUST GAS PURIFYING APPARATUS, AND METHOD FOR MANUFACTURING EXHAUST GAS PURIFYING APPARATUS - A holding sealing material includes a laminate of a plurality of mats and a film. The plurality of mats each include inorganic fibers and have a rectangular shape in a plan view. The plurality of mats are arranged in an order of longitudinal length from a shortest longitudinal length to a longest longitudinal length. The film is provided around a longest mat having the longest longitudinal length among the plurality of mats. The longest mat has a first main surface and a second main surface which is on a side opposite to the first main surface and which is in contact with a second longest mat. The film is adhered to the first main surface and longitudinal side surfaces of the longest mat and is adhered to the second main surface to allow the second main surface to be partly exposed. | 12-04-2014 |
20140356241 | HOLDING SEAL MATERIAL, MANUFACTURING METHOD FOR HOLDING SEAL MATERIAL, EXHAUST GAS PURIFICATION APPARATUS AND MANUFACTURING METHOD FOR EXHAUST GAS PURIFICATION APPARATUS - A holding seal material made of a laminated mat configured by laminating a plurality of mats containing an inorganic fiber and having a rectangular planar shape so that longitudinal-direction lengths of the respective mats sequentially increase as the mats are laminated, in which the film is attached to a principal surface of the mat configuring the laminated mat and having a longest longitudinal-direction length on an opposite side to a side on which the mat having the longest longitudinal-direction length is in contact with other mats and longitudinal-direction side surfaces of the mat having the longest longitudinal-direction length, and the film is attached to a principal surface of the mat having the longest longitudinal-direction length on the side on which the mat having the longest longitudinal-direction length is in contact with other mats in a state in which a part of the principal surface is exposed. | 12-04-2014 |
20140353027 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes an insulative substrate having a penetrating hole, a first conductive layer formed on a first surface of the insulative substrate, a second conductive layer formed on a second surface of the insulative substrate, and a through-hole conductor formed in the penetrating hole through the insulative substrate such that the through-hole conductor is connecting the first conductive layer and second conductive layer. The penetrating hole has a first opening portion formed on a first-surface side of the insulative substrate and a second opening portion formed on a second-surface side of the insulative substrate such that the second opening portion has a depth which is greater than a depth of the first opening portion and the second opening portion has a volume which is greater than a volume of the first opening portion, and the through-hole conductor formed in the second opening portion includes a void portion. | 12-04-2014 |
20140353022 | WIRING BOARD - A wiring board includes a substrate having a laminated-inductor forming portion and including multiple first insulation layers and a second insulation layer formed on a first side of the first insulation layers such that the first insulation layers have the laminated-inductor forming portion, and a planar conductor formed on the second insulation layer of the substrate and formed to shield electromagnetic force generated from the laminated-inductor forming portion of the substrate. The laminated-inductor forming portion of the substrate has multiple inductor patterns formed on the first insulation layers and multiple via conductors connecting the inductor patterns through the first insulation layers, and the inductor patterns include an uppermost inductor pattern formed between the second insulation layer and the first insulation layers such that the uppermost inductor pattern has a distance of 100 μm or more from the planar conductor. | 12-04-2014 |
20140353017 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a core substrate including an insulative substrate and a first inner conductive-circuit layer formed on first surface of the insulative substrate, an electronic component positioned in a penetrating hole formed in the insulative substrate and having a positive electrode terminal on first end portion and a negative electrode terminal on second end portion on the opposite side, a first interlayer insulative resin layer formed on first surface of the core such that the first insulative layer is positioned over the core and component in the penetrating hole, and an outer conductive-circuit layer formed on surface of the first insulative layer such that thicknesses of the first insulative layer between the outer conductive-circuit layer and the terminals are less than thickness of the first insulative layer between the first inner conductive-circuit layer and the outer conductive-circuit layer. | 12-04-2014 |
20140352870 | METHOD OF MANUFACTURING HONEYCOMB STRUCTURED BODY - In a method of manufacturing a honeycomb structured body, a ceramic block is formed by binding multiple pillar-shaped honeycomb fired bodies with adhesive layers interposed therebetween. The multiple pillar-shaped honeycomb fired bodies are bound on a support by piling up the multiple pillar-shaped honeycomb fired bodies successively. A placing position where a primary honeycomb fired body is to be placed is determined. A position of an end face of at least one secondary honeycomb fired body is fixed by applying force to the end face of the at least one secondary honeycomb fired body. The primary honeycomb fired body is placed on the placing position with the position of the end face of the at least one secondary honeycomb fired body being fixed. The fixing further includes first positioning or second positioning based on a number of the at least one secondary honeycomb fired body before the fixing. | 12-04-2014 |
20140347837 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes multiple insulation layers including an outermost insulation layer, a first conductive pattern formed between the insulation layers, a wiring structure positioned in the outermost insulation layer and having multiple first pads such that the first pads are positioned to connect multiple terminals of a first electronic component, respectively, and multiple second pads formed on the outermost insulation layer such that the second pads are positioned to connect terminals of a second electronic component, respectively, and are set at intervals which are greater than intervals of the first pads. | 11-27-2014 |
20140338965 | PRINTED WIRING BOARD - A printed wiring board includes an insulative resin substrate having a penetrating hole, a first conductive layer formed on first surface of the substrate, a second conductive layer formed on second surface of the substrate, and a through-hole conductor formed in the hole such that the conductor is connecting the first and second conductive layers. The conductor has a seed layer on inner wall of the hole, a laminated plated layer on the seed layer and a filled plated layer on the laminated layer, the laminated layer is formed such that the laminated layer is closing center portion of the hole and forming recess at end of the hole, the filled layer is formed such that the filled layer is filling the recess, and the laminated layer includes multiple electrolytic plated films laminated along the seed layer and each having thickness which is less at edge than at center. | 11-20-2014 |
20140318848 | WIRING BOARD AND FABRICATION METHOD THEREFOR - A wiring board includes a wiring sub board having a conductive pattern, a board positioned alongside of the wiring sub board such that the board forms a boundary portion between the board and the wiring sub board, and an insulating layer made of an insulating material and continuously extending from the board to the wiring sub board such that the insulating layer is covering the boundary portion between the board and the wiring sub board. The boundary portion between the board and the wiring sub board is filled with the insulating material of the insulating layer such that the insulating material of the insulating layer is connecting the board and the wiring sub board. | 10-30-2014 |
20140314988 | METHOD FOR MANUFACTURING ALUMINUM-TITANATE-BASED CERAMIC HONEYCOMB STRUCTURE - A method for manufacturing a ceramic honeycomb structure includes kneading titania particles, alumina particles and binder ingredient such that raw material paste including the titania particles, alumina particles and binder ingredient is prepared, forming a body made of the raw material paste and having a honeycomb structure such that the body has the honeycomb structure having through-holes extending in the longitudinal direction of the body and partition portions between the through-holes, positioning the body on a base such that one end surface of the body in the longitudinal direction faces the base and a space is formed between the base and the end surface of the body, and sintering under oxygen atmosphere the body on the base with the space between the base and the body such that a ceramic body having the honeycomb structure is formed on the base. | 10-23-2014 |
20140314987 | METHOD FOR MANUFACTURING ALUMINUM-TITANATE-BASED CERAMIC HONEYCOMB STRUCTURE - A method for manufacturing a ceramic honeycomb structure includes kneading titania particles, alumina particles and binder ingredient such that raw material paste including the titania particles, alumina particles and binder ingredient is prepared, forming a body made of the raw material paste and having a honeycomb structure such that the body has the honeycomb structure having through-holes extending in the longitudinal direction of the body and partition portions between the through-holes, positioning on a base having zirconia granules the body made of the raw material paste and having the honeycomb structure such that the zirconia are interposed between the body and the base, and sintering the body made of the raw material paste and having the honeycomb structure on the base with the zirconia granules interposed between the body and the base such that a ceramic body having the honeycomb structure is formed on the base with the zirconia granules. | 10-23-2014 |
20140311780 | ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE SAME AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - An electronic component includes an insulation layer, an alignment mark positioned on a first surface of the insulation layer, and an adhesive layer including an optically opaque agent and formed on the first surface of the insulation layer or a second surface of the insulation layer on the opposite side with respect to the first surface of the insulation layer. The adhesive layer has an opening portion formed at the position corresponding to the alignment mark such that the opening portion exposes the alignment mark directly or through the insulation layer. | 10-23-2014 |
20140311772 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER CORE SUBSTRATE - A printed wiring board includes: a multilayer core substrate including first and second insulation layers and a double-sided board between the first and second insulation layers. The core substrate has a cylindrical through-hole structure including a cylindrical conductor through the insulation layers and the board, a resin filler filling inside the cylindrical conductor and covering circuits covering the filler at the ends of the cylindrical conductor, respectively. The core substrate includes a conductive layer including a through-hole land around end of the structure such that the land is directly connected to the cylindrical conductor, the land includes a first electroless film, a first electrolytic film, a second electroless film and a second electrolytic film, and the cylindrical conductor includes the second electroless and electrolytic films such that the second electroless film is in contact with the side walls of the first electroless and electrolytic films. | 10-23-2014 |
20140311616 | STRUCTURE AND METHOD OF MANUFACTURING STRUCTURE - A structure includes a base material made of metal to be in a form of a tube and a surface coating layer provided on an inner face of the tube. The surface coating layer includes a first layer provided on the inner face and a second layer provided directly or indirectly on the first layer as an outermost layer of the surface coating layer. The first layer contains an amorphous inorganic material. The second layer contains a crystalline inorganic material having a softening point of about 950° C. or higher. | 10-23-2014 |
20140290228 | HOLDING SEALING MATERIAL FOR EXHAUST GAS PURIFYING APPARATUS, METHOD FOR MANUFACTURING HOLDING SEALING MATERIAL, EXHAUST GAS PURIFYING APPARATUS, AND METHOD FOR MANUFACTURING EXHAUST GAS PURIFYING APPARATUS - A holding sealing material for an exhaust gas purifying apparatus includes a mat and a heater. The mat includes inorganic fibers. The heater is disposed on either one of main surfaces of the mat. An exhaust gas purifying apparatus includes a casing, an exhaust gas treating body, and a holding sealing material. The exhausted gas treating body is canned in the casing. The holding sealing material is wound around the exhaust gas treating body and disposed between the exhaust gas treating body and the casing. The holding sealing material includes a mat including inorganic fibers, and a heater disposed between the mat and the exhaust gas treating body. | 10-02-2014 |
20140290227 | HOLDING SEALING MATERIAL, METHOD FOR MANUFACTURING HOLDING SEALING MATERIAL, EXHAUST GAS PURIFYING APPARATUS, AND METHOD FOR MANUFACTURING EXHAUST GAS PURIFYING APPARATUS - A holding sealing material includes a mat and at least one pair of electrodes. The mat contains inorganic fibers and has a rectangular shape in a plan view. The at least one pair of electrodes are arranged on a main surface of the mat. An exhaust gas purifying apparatus includes an exhaust gas treating body, the holding sealing material, and a casing. The exhaust gas treating body has a pillar-shape and electric conductivity. The holding sealing material is wound around the exhaust gas treating body, with the main surface of the mat in contact with the exhaust gas treating body. The casing houses the exhaust gas treating body. | 10-02-2014 |
20140284820 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A substrate for mounting a semiconductor includes a first insulation layer having first and second surfaces on the opposite sides and having a penetrating hole penetrating through the first insulation layer, an electrode formed in the penetrating hole in the first insulation layer and having a protruding portion protruding from the second surface of the first insulation layer, a first conductive pattern formed on the first surface of the first insulation layer and connected to the electrode, a second insulation layer formed on the first surface of the first insulation layer and the first conductive pattern and having a penetrating hole penetrating through the second insulating layer, a second conductive pattern formed on the second insulation layer and for mounting a semiconductor element, and a via conductor formed in the penetrating hole in the second insulation layer and connecting the first and second conductive patterns. | 09-25-2014 |
20140262447 | MULTILAYER PRINTED WIRING BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT - A multilayer printed wiring board for mounting a semiconductor element includes a core substrate, a first laminated structure on first surface of the substrate and including a conductive circuit layer on the first surface of the substrate, a resin insulating layer and the outermost conductive circuit layer, and a second laminated structure on second surface of the substrate and including a conductive circuit layer on the second surface of the substrate, a resin insulating layer and the outermost conductive circuit layer. The outermost conductive layer in the first structure has solder pads positioned to mount a semiconductor element and solder bumps formed on the pads, respectively, the outermost conductive layer in the second structure has solder pads positioned to mount a wiring board, and the outermost conductive layers in the first and second structures have thicknesses formed greater than thicknesses of the conductive layers on the surfaces of the substrate. | 09-18-2014 |
20140251656 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a core structure including a core substrate, and a buildup structure formed on the core structure and including an interlayer insulating layer and a conductive layer. The interlayer insulating layer does not contain inorganic fiber and includes a resin and an inorganic filler, and the conductive layer is formed on the interlayer insulating layer such that the inorganic filler in the interlayer insulating layer is not in contact with the conductive layer. | 09-11-2014 |
20140247572 | PRINTED CIRCUIT BOARD - A printed circuit board includes an accommodating layer, chip capacitor devices accommodated in the accommodating layer, and a buildup structure formed on the accommodating layer such that the buildup structure covers the chip capacitor devices in the accommodating layer. The buildup structure has mounting conductor structures positioned to mount an IC chip device on a surface of the buildup structure such that the IC chip device is mounted directly over the chip capacitor devices, each of the chip capacitor devices has a dielectric body having a surface facing the buildup structure, a first electrode formed on the dielectric body and extending on the surface of the dielectric body, and a second electrode formed on the dielectric body and extending on the surface of the dielectric body, and the dielectric body is interposed between the first electrode and the second electrode. | 09-04-2014 |
20140247571 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole such that the second conductive pattern is formed along an outline of the periphery of the penetrating hole. | 09-04-2014 |
20140247561 | PRINTED WIRING BOARD - A printed wiring board includes a first resin insulation layer, a second resin insulation layer formed on the first insulation layer and having an opening portion, a mounting conductive layer formed on the first resin insulation layer in the opening portion of the second resin insulation layer such that the mounting conductive layer has a surface exposed by the opening portion, an electronic component positioned in the opening portion of the second resin insulation layer such that the electronic component is mounted on the surface of the mounting conductive layer, and a heat-dissipating via conductor formed in the first resin insulation layer such that the heat-dissipating via conductor is connected to the mounting conductive layer formed on the first resin insulation layer. | 09-04-2014 |
20140246765 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup layer laminated on first surface of the substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the first buildup layer, and a second buildup layer laminated on second surface of the substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the second buildup layer. The outermost interlayer resin insulation layer of the first buildup layer has thermal expansion coefficient which is set lower than thermal expansion coefficient of the outermost interlayer resin insulation layer of the second buildup layer. | 09-04-2014 |
20140231990 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a semiconductor chip and a wiring board formed on the semiconductor chip. The wiring board includes a first insulation layer, first conductive patterns on the first layer, first via conductors formed in the first layer and connecting the first patterns and electrode pads of the chip, respectively, a second insulation layer on the first layer, second conductive patterns on the second layer, and second via conductors formed in the second layer and connecting the first conductive patterns and the second patterns, respectively, each second via conductors has a side surface extending through the second layer such that the side surface has a bent portion which changes inclination of the side surface in depth direction of each second via conductor, and the second patterns are positioned to fan in or out with respect to the electrode pads. | 08-21-2014 |