Hitachi High-Tech Instruments Co., Ltd Patent applications |
Patent application number | Title | Published |
20150143693 | METHOD FOR MOUNTING ELECTRONIC COMPONENT AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT - A control unit determines whether or not confirmation of a type of a tape processing unit is necessary, and performs identification processing of the type of the tape processing unit when confirmation of the type of the tape processing unit is determined as necessary. Then, this identification processing of the type is performed and the control unit determines whether or not an electronic component handleable by this tape processing unit coincides with an electronic component of a component arrangement number in a feeder base, to perform control for performing an extraction operation for an electronic component in a storage tape with an adsorption nozzle when the electronic component is determined as coinciding. | 05-28-2015 |
20150127707 | TERMINAL COMMUNICATION APPARATUS, AND DISTRIBUTED CONTROL SYSTEM - A terminal communication apparatus has a terminal communication control portion rendering an immediate communication control portion sequentially transmitting serial data to another terminal communication apparatus bitwise when receiving a packet as bitwise serial data and a normal communication control portion performing processing on the packet after accumulating the serial data until the serial data reaches a packet length when receiving the bitwise serial data switchable, performing processing with the immediate communication control portion in a case of receiving a time adjustment packet containing time adjustment data posting a timing of synchronization in the other terminal communication apparatus and performing processing with the normal communication control portion in a case of receiving a packet other than the time adjustment packet. Thus, synchronization of control object devices can be enabled without previously investigating communication delay times. | 05-07-2015 |
20150115093 | COMPONENT SUPPLY DEVICE AND COMPONENT MOUNTING DEVICE - A component supply device loaded with a component supply tape for exposing and supplying an electronic component from the component supply tape with respect to a component mounting device mounting the electronic component on a substrate includes a replenishing unit performing replenishment of a new component supply tape when a preceding component supply tape is exhausted and a sensor senses exhaustion of the preceding component supply tape while a confluent portion where a channel for the preceding component supply tape and a channel for the new component supply tape join with each other is formed between the sensor and the replenishing unit. A buckling prevention mechanism moves in response to an operation of the preceding component supply tape or the new component supply tape for preventing buckling when the new component supply tape is transported to the component supply device by the replenishing unit is arranged on the confluent portion. | 04-30-2015 |
20150110588 | FEEDER, FEEDER CONTROL METHOD AND ELECTRONIC COMPONENT MOUNTING DEVICE - A feeder and a feeder control method, as well as an electronic component device, reliably engaging a supply tape in a loading operation even if there is an accumulated pitch error between sprocket holes. Third, second and first sprockets are arranged successively from an insertion port. The sprocket hole on a forward end portion of the inserted supply tape is fitted with a third tooth of the third sprocket in the loading operation. The supply tape is rotated by rotation of the third sprocket until fitting with a second tooth of the second sprocket, and the rotation of the third sprocket is stopped after the second tooth fits with the sprocket hole on the forward end portion. | 04-23-2015 |
20140265094 | DIE BONDER AND BONDING HEAD DEVICE OF THE SAME, AND ALSO COLLET POSITION ADJUSTING METHOD - For providing a die bonder, a bonding head device and a collet position adjusting method for enabling an automatic correction (adjustment) of errors, including height and inclination thereof, when exchanging a collet, with a simple structure thereof, in the bonding head device, having a holder | 09-18-2014 |
20140251535 | Collet Cleaning Method and Die Bonder Using the Same - An object of the present invention is to provide a collet cleaning method and a die bonder using the same in which a collet can be cleaned without adding a new unit, and foreign substances with high adhesive power can be reliably removed without scattering the foreign substances. | 09-11-2014 |
20140078289 | Die Bonder and Method of Position Recognition of Die - A die bonder comprises a storage unit which stores the image of the wafer taken by an imaging unit, a recognition pattern included the outline of a die formed on the wafer, and a recognition program, and a monitor-processing unit which gets the position on the wafer, of the die whose map data indicates normal, in the way that the die is matched with the recognition pattern by executing the recognition program, and that the center position of the die is gotten. | 03-20-2014 |
20140074280 | Horizontal Axis Drive Mechanism, Two-Axis Drive Mechanism, and Die Bonder - A horizontal axis drive mechanism includes a first linear motor including a first fixed section and a first movable section fixing a load section and moving the load section in the horizontal direction, a support body supporting the first fixed section, a first linear guide arranged between the support body and the first fixed section and moving the first fixed section, a rotation conversion type counter including a rotating body rotatably supported by the support body and a converting means converting movement of the first fixed section in the horizontal direction into rotation of the rotating body, and a control section controlling the position of the first movable section in the horizontal direction. | 03-13-2014 |
20140069564 | Die Bonder And Bonding Method - The present invention provides a bonding device and a bonding method with a high operation ratio by solving the problems of conventional techniques. | 03-13-2014 |
20140060751 | Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up Method - A die bonding apparatus includes a work supply/transfer portion for transferring a substrate; a bonding portion for conducting bonding of a die on the substrate; a wafer supply portion for supplying a wafer having the die thereon; and a controller portion for controlling equipment, wherein the wafer supply portion has a push-up unit for pushing up a dicing tape from a lower part, for separating the die from the dicing tape, and the push-up unit has a suction opening portion, which is configured to suck the dicing tape with vacuum, a push-up portion, which is made of an elastic body, sealing a fluid or a power therein, and is configured to push up the dicing tape, a cylinder, which is configured to apply pressure to the push-up portion, and an air supply means for supplying an air for changing the pressure within the cylinder through control of the controller portion. | 03-06-2014 |
20130221764 | Two-Shaft Drive Mechanism and Die Bonder - A two-shaft drive mechanism includes a processing unit, a first linear motor provided with a first movable portion and a first fixed portion, which elevates the processing unit along a first linear guide, and a second linear motor provided with a second movable portion and a second fixed portion, which moves the processing unit in a horizontal direction vertical to the direction for elevating the processing unit, a support body that fixes the first fixed portion, a second linear guide that is provided between the support body and the second fixed portion, and allows the second fixed portion to freely move, and a control unit that controls a position of the first movable portion in the horizontal direction based on an output of the linear sensor that detects a position of the first movable portion in a horizontal direction with respect to the support body. | 08-29-2013 |
20130071956 | Die Bonder and Bonding Method - With a die bonder or a bonding method, the die is adsorbed by the collet, the dicing tape to which the die is adsorbed is thrust up, the die adsorbed by the collet, and thrust up is peeled from the dicing tape, and the peeled die is bonded to the substrate. When the decrease in the air leak flow rate through the gap between the collet and the die upon the thrust up is smaller than the decrease in the normal peel by a predetermined amount, it is judged that a deflection occurs in the die. | 03-21-2013 |
20130068826 | Die Bonder and Bonding Method - A die bonder includes a die supply stage, which is configured to hold a wafer; a first head having a first collet, which is configured to pick up a die from the wafer and to attach the die, provisionally, on a target to be conducted with mounting thereon, on the attach stage; a second head having a second collet, which is configured to conduct main compression of the die, which is provisionally attached on the attach stage, on the target to be conducted with mounting; and a controller apparatus, wherein the controller apparatus controls the first head to pick up a next die from the die supply stage, during when the second head conducts the main compression on the die onto the target to be conducted with mounting, thereby achieving the die bonder and the die bonding method being stable in quality. | 03-21-2013 |
20130068824 | Die Bonder and Bonding Method - A bonding method of a die bonder with a single conveyance lane and a single bonding head, or a plurality of conveyance lanes and a plurality of bonding heads includes the steps of generating a classification map of class dies with different electric properties on the wafer, which are classified in accordance with a plurality of grades, picking up the die from the wafer, bonding the die onto a substrate or the die using a bonding head, conveying a class substrate corresponding to the class die on the conveyance lane in a unit of the class substrate, and further bonding the class die to the corresponding class substrate based on the classification map. | 03-21-2013 |
20130068823 | Die Bonder and Bonding Method - A die bonder and a bonding method are disclosed which make it possible to provide high-quality products, particularly even if a die is rotated through predetermined degrees relative to an already-bonded die and then laminated. | 03-21-2013 |
20130017040 | Frame Feeding System and Frame Feeding MethodAANM OHKUBO; TatsuyukiAACI KumagayaAACO JPAAGP OHKUBO; Tatsuyuki Kumagaya JPAANM Yoda; MitsuoAACI KumagayaAACO JPAAGP Yoda; Mitsuo Kumagaya JP - In recent years, frames have gotten larger in size and thinner, and warping of the frames has posed a problem. If a warp of a frame is large, there is a high possibility that fetching the frame may fail. If fetching the frame fails, that is, if the frame cannot be fetched, the lead time of mounting gets longer. Further, the frame that cannot be fetched has to be manually removed by an operator. Therefore, a man-hour increases. According to the present invention, before a loader feeder fetches a frame from a frame magazine, a loader lifter is moved in a Y direction. Thereafter, the loader feeder fetches the frame from the frame magazine. | 01-17-2013 |
20130016205 | Die BonderAANM MAKITA; YoshiakiAACI KumagayaAACO JPAAGP MAKITA; Yoshiaki Kumagaya JPAANM Fukasawa; ShingoAACI KumagayaAACO JPAAGP Fukasawa; Shingo Kumagaya JP - A die bonder that eliminates the need for moving a recognition camera for capturing an image related to adhesive application and achieves high reliability with high throughput is disclosed. The die bonder includes a lead frame; a syringe located above the lead frame and enclosing therein a paste adhesive; a recognition camera lateral to the syringe; an illumination lamp disposed in the vicinity of the recognition camera; and a reflector plate disposed opposite the illumination lamp. The reflector plate is adapted to reflect light from the illumination lamp onto the lead frame at an application surface of the paste adhesive. The recognition camera, illumination lamp, and reflector plate are arranged in a manner that the reflector plate is disposed on −Y side and the recognition camera and the illumination lamp are disposed on +Y side with respect to the syringe located above the lead frame transported in X direction. | 01-17-2013 |
20130014904 | Biaxial Drive Mechanism and Die BonderAANM HOSAKA; KojiAACI KumagayaAACO JPAAGP HOSAKA; Koji Kumagaya JPAANM Fukasawa; ShingoAACI KumagayaAACO JPAAGP Fukasawa; Shingo Kumagaya JP - A biaxial drive mechanism including a Z axis capable of realizing a high speed elevation axis without an increment in torque on a horizontal drive axes and a die bonder using the biaxial drive mechanism is disclosed. The biaxial drive mechanism includes a handling part; a first linear motor having a first movable part that moves up/down the handling part and a first stationary part; a second linear motor having a second movable part and a second stationary part; a connecting part that directly or indirectly connects the first movable part to the second movable part via the first linear guide; a second linear guide that moves the first movable part; and a support body that fixes the first stationary part and the second stationary part with a predetermined length in parallel to each other in the horizontal direction. | 01-17-2013 |
20130014881 | Biaxial Drive Mechanism, Die Bonder and Die Bonder Operating MethodAANM FUKASAWA; ShingoAACI KumagayaAACO JPAAGP FUKASAWA; Shingo Kumagaya JPAANM Hosaka; KojiAACI KumagayaAACO JPAAGP Hosaka; Koji Kumagaya JP - A highly reliable biaxial drive mechanism and a die bonder operating method capable of preventing fall of an elevation axis of a linear motor upon loss of power are disclosed. The biaxial drive mechanism includes a handling part; a biaxial drive axes provided with a first linear motor unit having a first movable part that moves up and down the handling part along a first linear guide and a first stationary part, and a second linear motor unit having a second movable part that moves the handling part in a horizontal direction vertical to a direction of up and down movement and a second stationary part; a main power source that supplies a power source to the biaxial drive axes; and an elevation axis fall prevention unit that prevents fall of a handling part upon loss of power at the main power source. | 01-17-2013 |
20120244647 | Pick-Up Method of Die Bonder and Die Bonder - The present invention provides a die bonder capable of stripping a die without fail, or a highly reliable die bonder or pick-up method using the die bonder. | 09-27-2012 |
20120241096 | Foreign Substance Removing Device and Die Bonder Equipped with the Same - The invention has an object to provide a foreign substance removing device that is capable of quickly and efficiently cleaning substrate surfaces regardless of the size thereof and preventing readhesion of once removed foreign substances as well as to provide a die bonder equipped with the same. | 09-27-2012 |
20120214258 | Die Bonder and Semiconductor Manufacturing Method - The present invention provides a reliable die bonder that can accurately bond a die and a semiconductor manufacturing method. The present invention is provided with a bonding head that adsorbs a die from a wafer and bonds it to a substrate, a positioning mechanism that is provided with a first adjustment mechanism that positions a position of the die at predetermined accuracy, and positions the bonding head, a positioning controller that controls the positioning mechanism and a second adjustment mechanism that is provided to the bonding head, and adjusts a position of the die at higher accuracy than the first adjustment mechanism. | 08-23-2012 |
20120212171 | Motor Control System and Motor Control Method - There is provided a motor control system and motor control method which can shorten settling time by restraining vibration and deviation relative to an advancing direction during operation. Moreover, according to the present invention, it is possible to cause a motor to be operated with an ideal track and, since it is possible to always monitor a present position, it is made easy to cause a plurality of axes to be synchronously operated. The motor control system is provided with a unit generating command waveforms from a jerk data which has significant effects on the vibration relative to the advancing direction, and a unit performing a real time real position control of regenerating future command waveforms according to a deviation amount, while always performing jerk-limit, whereby the vibration and the deviation relative to the advancing direction when the motor operates at high speed are restrained. | 08-23-2012 |
20120075079 | Tool Management Method of Die Bonder and Die Bonder - RFID tags are attached to tools of a preform head, a bonding head, and a push-up unit, and information related to each tool such as a dimension of a processing-target die is stored into the RFID tags. When a tool is mounted, an operator inputs manufacturing conditions related to the tool. On the other hand, when the information related to the tool read from the RFID tag by an RFID reader/writer and the manufacturing conditions related to the tool do not match each other, a message about wrong mounting of the tool is displayed on a monitor. | 03-29-2012 |
20110072654 | Electronic Component Mounting Apparatus, Component Supply Apparatus, and Electronic Component Mounting Method - There is a need for providing an electronic component mounting apparatus, a component supply apparatus, and an electronic component mounting method capable of reducing inadvertent insertion of component supply tape and ensuring high reliability or capable of reducing wrong insertion of component supply tape, supplying new electronic component tape, and ensuring a high operation rate. Supply tape is inserted into an insertion entry of a component supply apparatus. An electronic component mounted on the supply tape is absorbed and is mounted on a printed board. Information about the electronic component mounted on the supply tape is read. Based on the read information, the component supply apparatus for inserting the supply tape is selected. The insertion entry is opened while it is closed when no supply tape is mounted. | 03-31-2011 |
20110030203 | ELECTRONIC COMPONENT MOUNTING APPARATUS - The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively. | 02-10-2011 |
20100186223 | ELECTRONIC COMPONENT MOUNTING APPARATUS - The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component. | 07-29-2010 |
20090211086 | ELECTRONIC COMPONENT MOUNTING METHOD AND ELETRONIC COMPONENT AND MOUNTING APPARATUS - The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board. | 08-27-2009 |
20090119912 | ELECTRONIC COMPONENT MOUNTING APPARATUS - This invention is directed to prevention of reduction of a pickup rate of an electronic component when a component feeding unit is dismounted from a feeder base and mounted back thereon. A CPU sends a feeding command to a component feeding unit feeding an electronic component belonging to a first step number, and drives a servomotor and a drive motor of the feeding unit to perform a component feeding operation and so on. After then, when the CPU judges that the feeding unit is dismounted from the feeder base and mounted back thereon, the CPU drives a X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing to the image. A correction value based on this recognition result is stored in a RAM, the X axis drive motor and the Y axis drive motor are driven taking this correction value into account, a vertical axis drive motor is driven, and a suction nozzle lowers and picks up the electronic component. | 05-14-2009 |
20090031559 | ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD OF MOUNTING ELECTRONIC COMPONENTS - The invention is directed to manufacturing a divided board without wasting an electronic component by judging whether or not a shortage of electronic components of a given type to be mounted on divided board portions will occur during the mounting before mounting electronic components on the divided board. A printed board having three board portions is carried onto an XY table from a supply conveyer and positioned by positioning means. Then, for each of component feeding units, a CPU judges whether or not the number of remaining electronic components is smaller than the number of necessary electronic components for manufacturing all the divided board portions. When the number is judged smaller, for example, when the number of remaining electronic components of Fdr. No. “102” is judged to be two that is less than three, the CPU calculates that the number of manufacturable divided board portions is two. The CPU then decides that the divided board portions on the left side and in the middle are to be manufactured, adds “S” to a skip code space of a step number | 02-05-2009 |
20080263858 | METHOD OF MOUNTING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MOUNTING APPARATUS - The invention realizes setting of measurement positions suitable for a warping state of a printed board and an easy work of setting the measurement positions. A printed board as a measurement sample is positioned three-dimensionally in X, Y and vertical directions on a positioning portion, and then a backup base is lifted up to apply backup pins to the back surface of the board and support the board horizontally. Then, the warping state of the board is measured by a height level detection device, and based on the measurement result the CPU displays the board on a monitor three-dimensionally or by contour lines. Once an operator sets measurement positions on the screen, the CPU converts each of the set positions into coordinates on the board, writes the coordinates of the set positions in the top of mounting data, and stores the data in the RAM. Then, in a manufacturing operation with a board, the height level detection device measures the height levels of the board in the set measurement positions according to the mounting data where the coordinates of the set positions are added and stores the measurement values in the RAM. The measurement values are used when electronic components are mounted on the board. | 10-30-2008 |
20080201940 | APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT - The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an image of an electronic component held by a suction nozzle, and a recognition processing device performs recognition processing. When a positional shifting amount calculated by CPU based on the recognition processing result is more than α, a board recognition camera takes an image of a storage portion of a storage tape storing a next electronic component to be picked up. When a positional shifting amount of the storage portion calculated based on the recognition processing result is more than β, the CPU enables seam passage processing. Based on the image taking of the storage portion by the board recognition camera and the recognition processing by the recognition processing device which are performed each time the storage tape is fed N times, the CPU controls correction of a pickup position. | 08-28-2008 |