APPLIED MATERIALS ISRAEL, LTD. Patent applications |
Patent application number | Title | Published |
20150356719 | METHOD OF DESIGN-BASED DEFECT CLASSIFICATION AND SYSTEM THEREOF - There is provided an inspection method capable of classifying defects detected on a production layer of a specimen. The method comprises: obtaining input data related to the detected defects; processing the input data using a decision algorithm associated with the production layer and specifying two or more classification operations and a sequence thereof; and sorting the processed defects in accordance with predefined bins, wherein each bin is associated with at least one classification operation, wherein at least one classification operation sorts at least part of the processed defects to one or more classification bins to yield finally classified defects, and wherein each classification operation, excluding the last one, sorts at least part of the processed defects to be processed by one or more of the following classification operations. | 12-10-2015 |
20150332451 | SYSTEM, A METHOD AND A COMPUTER PROGRAM PRODUCT FOR FITTING BASED DEFECT DETECTION - A system configured to detect defects in an inspection image generated by collecting signals arriving from an article, the system comprising a tangible processor which includes: (i) a distribution acquisition module, configured to acquire a distribution of comparison values, each of the comparison values being indicative of a relationship between a value associated with a pixel of the inspection image and a corresponding reference value; (ii) a fitting module, configured to fit to the distribution an approximation function out of a predefined group of functions; and (iii) a defect detection module, configured to: (a) set a defect detection criterion based on a result of the fitting; and to (b) determine a presence of a defect in the inspection image, based on the defect detection criterion. | 11-19-2015 |
20150287841 | METHOD AND DEVICE FOR CONTROL OF AVALANCHE PHOTO-DIODE CHARACTERISTICS FOR HIGH SPEED AND HIGH GAIN APPLICATIONS - A device that may include A DC power supply coupled to a fixed current source; an avalanche photo-diode (APD); a DC voltage regulator that comprises a regulating transistor; wherein the DC voltage regulator is arranged to (a) maintain a regulated voltage at a fixed value, and (b) output the regulated voltage; and a temperature control module that is arranged to maintain a portion of the temperature control module at a fixed temperature; wherein the DC voltage regulator and the APD are electrically coupled in parallel to each other, so that a sum of currents that pass through the APD and the regulating transistor equals a fixed current supplied by the fixed current source; and wherein the portion of the temperature control module is thermally coupled to the DC voltage regulator and to the APD, and wherein APD and the regulating transistor are thermally coupled to each other. | 10-08-2015 |
20150287178 | METHOD, SYSTEM, AND COMPUTER PROGRAM PRODUCT FOR DETECTION OF DEFECTS BASED ON MULTIPLE REFERENCES - A system includes a memory and a processor device operatively coupled to the memory to obtain an inspected noise-indicative value representative of an analyzed pixel of an inspected image of an inspected object, and a reference noise-indicative value representative for each of multiple reference pixels of the inspected image. The processor device computes a representative noise-indicative value based on the inspected noise-indicative value and multiple reference noise-indicative values, calculates a defect-indicative value based on an inspected value representative of the analyzed pixel and determines a presence of a defect in the analyzed pixel based on the representative noise-indicative value and the defect-indicative value. | 10-08-2015 |
20150278597 | SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR DEFECT DETECTION BASED ON MULTIPLE REFERENCES - A system including an interface for receiving inspection image data of an inspection image of an inspection object. The inspection image data includes information of an analyzed pixel of the inspected image and of reference pixels of the inspected image. The system further includes a memory and a processor device operatively coupled to the interface and the memory to obtain an inspected value representative of the analyzed pixel of the inspected image, and a reference value for each of the reference pixels of the inspected image. For each reference pixel, the processor devices calculates a difference between the reference value of a respective reference pixel and the inspected value of the analyzed pixel, computes a representative difference value based on the differences and determines a presence of a defect in the analyzed pixel based on the representative difference value. | 10-01-2015 |
20150200071 | INSPECTION OF REGIONS OF INTEREST USING AN ELECTRON BEAM SYSTEM - A system for scanning a plurality of regions of interest of a substrate using one or more charged particle beams, the system may include: an irradiation module having charged particle optics; a stage for introducing a relative movement between the substrate and the charged particle optics; an imaging module for collecting electrons emanating from the substrate in response to a scanning of the regions of interest by the one or more charged particle beams; and wherein the charged particle optics is arranged to perform countermovements of the charged particle beam during the scanning of the regions of interest thereby countering relative movements introduced between the substrate and the charged particle optics during the scanning of the regions of interest. | 07-16-2015 |
20150198648 | DETECTING OPEN AND SHORT OF CONDUCTORS - A system and a method for evaluating a conductor, the method may include: illuminating a first area of a conductor by a first electron beam thereby charging the first area; illuminating by a second electron beam a second area of the conductor; and wherein an aggregate size of the first and second areas is a fraction of an overall size of the conductor; detecting, by a detector, detected emitted electrons that were emitted substantially from the second area and generating detection signals indicative of the detected emitted electrons; and processing, by a processor, the detection signals to provide information about a conductivity of the conductor. | 07-16-2015 |
20150193926 | INSPECTION HAVING A SEGMENTED PUPIL - A method and an apparatus that may include optics that is arranged to illuminate a surface of a sample with radiation and to collect reflected radiation from the surface of the sample; wherein the optics includes a pupil that has multiple pupil segments that correspond to different angular regions of collection or illumination; and a detection module arranged to receive the reflected radiation and generate, for each pupil segment, pupil segment detection signals. | 07-09-2015 |
20150192868 | CLEANING AN OBJECT WITHIN A NON-VACUUMED ENVIRONMENT - A system that may include a mechanical stage that is arranged to move an object along a predetermined path in relation to an optical module during an illumination of the object by the optical module; a structural support element that is arranged to support at least a part of the optical module; a gas flow module that is arranged to direct clean gas towards the object through gas flow module openings that define a coverage area that is (a) bigger than the object and (b) is positioned directly above at least a majority of the object when the object is positioned anywhere along the predetermined path. | 07-09-2015 |
20150145090 | SYSTEM AND METHOD FOR REDUCING DARK CURRENT DRIFT IN A PHOTODIODE BASED ELECTRON DETECTOR - A sensing element that may include (a) a PIN diode that may include an anode that is coupled to an anode contact; a cathode that is coupled to a cathode contact; a semiconductor portion that has a sensing region; and an insulator that is positioned between the cathode contact and the anode contact; and (b) a shielding element. The insulator, the cathode contact and the anode contact are positioned between the shielding element and the semiconductor portion. The shielding element is shaped and positioned to facilitate radiation to impinge onto the sensing region of the semiconductor portion while at least partially shielding the insulator from electrons that are emitted from the sensing region. | 05-28-2015 |
20150028203 | INSPECTION OF A LITHOGRAPHIC MASK THAT IS PROTECTED BY A PELLICLE - A system and a method for evaluating a lithography mask, the system may include: (a) electron optics for directing primary electrons towards a pellicle that is positioned between the electron optics and the lithography mask; wherein the primary electrons exhibit an energy level that allows the primary electrons to pass through the pellicle and to impinge on the lithographic mask; (b) at least one detector for detecting detected emitted electrons and for generating detection signals; wherein detected emitted electrons are generated as a result of an impingement of the primary electrons on the lithographic mask; and (c) a processor for processing the detection signals to provide information about the lithography mask | 01-29-2015 |
20150022654 | CLOSED-LOOP AUTOMATIC DEFECT INSPECTION AND CLASSIFICATION - Inspection apparatus includes an imaging module, which is configured to capture images of defects at different, respective locations on a sample. A processor is coupled to process the images so as to automatically assign respective classifications to the defects, and to autonomously control the imaging module to continue capturing the images responsively to the assigned classifications. | 01-22-2015 |
20140299790 | INSPECTION METHOD AND AN INSPECTION SYSTEM EXHIBITING SPECKLE REDUCTION CHARACTERISTICS - A method and an inspection system that exhibiting speckle reduction characteristics includes a light source arranged to generate input light pulses, and diffuser-free speckle reduction optics that include a beam splitter, for splitting an input light pulse from the light source into multiple light pulses that are oriented at angles in relation to each other when exiting the beam splitter, and at least one optical element for directing the multiple light pulses to impinge on an inspected object at different angles. | 10-09-2014 |
20140285877 | CALIBRATABLE BEAM SHAPING SYSTEM AND METHOD - A beam shaping system including: a first and second optical modules that are accommodated in a spaced-apart relationship in an optical path of light through the system to sequentially apply beam shaping to light incident thereon. The beam shaping system includes first and second alignment modules respectively carrying the first and second optical modules and operable for laterally positioning the optical modules with respect to the optical path. A calibration module of the beam shaping system is connectable to the first and second alignment modules and is operable to sequentially calibrate and align the respective lateral positions of the first and second optical modules with respect to the optical path. The system thereby enables shaping of an incoming light beam of given predetermined wave-front and lateral intensity distribution to form an output light beam having desired wave-front and desired lateral intensity distribution. | 09-25-2014 |
20140278227 | SYSTEM, A METHOD AND A COMPUTER PROGRAM PRODUCT FOR SIZE ESTIMATION - A computerized method for estimating a size of a nanometric part of an inspected article, the method including: (a) acquiring inspection results generated by processing an inspection image which was generated by collecting signals arriving from a portion of the article which includes the part by an inspection system; (b) fitting to the inspection results an approximation function from a group of functions which is related to a response pattern of the inspection system; and (c) determining an estimated size of the part, based on at least one parameter of the approximation function. | 09-18-2014 |
20140270470 | SYSTEM, METHOD AND COMPUTER READABLE MEDIUM FOR DETECTING EDGES OF A PATTERN - A system, a non-transitory computer readable medium and a method for detecting a parameter of a pattern, the method comprises: obtaining an image of the pattern; wherein the image is generated by scanning the pattern with a charged particle beam; processing the image to provide an edge enhanced image; wherein the processing comprises computing an aggregate energy of first n spectral components of the image, wherein n exceeds two; and further processing the edge enhanced image and determining a parameter of the pattern. | 09-18-2014 |
20140270468 | DETECTION OF WEAK POINTS OF A MASK - An inspection system, and a computer program product that stores instructions for: obtaining an aerial image of an area of the mask; wherein the aerial image represents an expected image to be formed on a photoresist of an object during a lithography process that involves illuminating the area of the mask, by a lithography tool; wherein the photoresist has a printability threshold; wherein the lithography process exhibits a process window that introduces allowable changes at pixels of the expected image that do not exceed an intensity threshold; and searching for at least one weak point at the area of the mask, each weak point is a local extremum point of the aerial image that is spaced apart from the printability threshold by a distance that does not exceed the intensity threshold or is a crossing point of the printability threshold and being of a slope that is below a predefined threshold. | 09-18-2014 |
20140238438 | METHOD AND SYSTEM FOR CLEANING A VACUUM CHAMBER - A system and method are described, for use in cleaning of a vacuum chamber. The method comprising connecting a vacuum chamber to a plasma generating unit via a plasma connection port and connecting the vacuum chamber to a high vacuum pumping unit via a pumping port. A flow conductance through the plasma connection port to the vacuum chamber is controlled to limit passage of charged particles and cleaning substances produced in the plasma generating unit, to thereby maintain a working pressure inside the vacuum chamber while cleaning the vacuum chamber by said cleaning substances. | 08-28-2014 |
20140233844 | SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR DEFECT DETECTION BASED ON MULTIPLE REFERENCES - A defect detection system for computerized detection of defects, the system including: an interface for receiving inspection image data including information of an analyzed pixel and of a plurality of reference pixels; and a processor, including: a differences analysis module, configured to: (a) calculate differences based on an inspected value representative of the analyzed pixel and on multiple reference values, each of which is representative of a reference pixel among the plurality of reference pixels; wherein the differences analysis module is configured to calculate for each of the reference pixels a difference between the reference value of the reference pixel and the inspected value; and (b) compute a representative difference value based on a plurality of the differences; and a defect analysis module, configured to determine a presence of a defect in the analyzed pixel based on the representative difference value. | 08-21-2014 |
20140233838 | METHOD, SYSTEM, AND COMPUTER PROGRAM PRODUCT FOR DETECTION OF DEFECTS BASED ON MULTIPLE REFERENCES - A defect detection system for computerized detection of defects in an inspected object based on processing of an inspection image generated by collecting signals arriving from the inspected object, the system including: an interface for obtaining an inspected noise-indicative value and multiple reference noise-indicative values, the inspected noise-indicative value representative of an analyzed pixel and each of the reference noise-indicative values representative of a reference pixel among a plurality of reference pixels; and a processor, including: a noise analysis module, configured to compute a representative noise-indicative value based on a plurality of noise-indicative values which includes the inspected noise-indicative value and the multiple reference noise-indicative values; and a defect analysis module, configured to calculate a defect-indicative value based on an inspected value representative of the analyzed pixel, and to determine a presence of a defect in the analyzed pixel based on the representative noise-indicative value and the defect-indicative value. | 08-21-2014 |
20140231632 | SYSTEM AND METHOD FOR INSPECTING A SAMPLE USING LANDING LENS - An evaluation system that includes a miniature module that comprises a miniature objective lens and a miniature supporting module; wherein the miniature supporting module is arranged, when placed on a sample, to position the miniature objective lens at working distance from the sample; wherein the miniature objective lens is arranged to gather radiation from an area of the sample when positioned at the working distance from the sample; a sensor arranged to detect radiation that is gathered by the miniature objective lens to provide detection signals indicative of the area of the sample. | 08-21-2014 |
20140212022 | METHOD OF DESIGN-BASED DEFECT CLASSIFICATION AND SYSTEM THEREOF - There is provided an inspection method capable of classifying defects detected on a production layer of a specimen. The method comprises: obtaining input data related to the detected defects; processing the input data using a decision algorithm associated with the production layer and specifying two or more classification operations and a sequence thereof; and sorting the processed defects in accordance with predefined bins, wherein each bin is associated with at least one classification operation, wherein at least one classification operation sorts at least part of the processed defects to one or more classification bins to yield finally classified defects, and wherein each classification operation, excluding the last one, sorts at least part of the processed defects to be processed by one or more of the following classification operations. | 07-31-2014 |
20140212021 | SYSTEM, A METHOD AND A COMPUTER PROGRAM PRODUCT FOR PATCH-BASED DEFECT DETECTION - A system capable of inspecting an article for defects, the system including: a patch comparator, configured to determine with respect to each of a plurality of reference patches in a reference image a similarity level, based on a predefined patch-similarity criterion and on a source patch defined in the reference image; an evaluation module, configured to rate each inspected pixel out of multiple inspected pixels of the inspection image with a representative score which is based on the similarity level of a reference patch associated with a reference pixel corresponding to the inspected pixel; a selection module, configured to select multiple selected inspected pixels based on the representative scores of the multiple inspected pixels; and a defect detection module, configured to determine a presence of a defect in the candidate pixel based on an inspected value of the candidate pixel and inspected values of the selected inspected pixels. | 07-31-2014 |
20140197322 | MULTI-SPOT COLLECTION OPTICS - Apparatus for detecting optical radiation emitted from an array of spots on an object. The apparatus includes a plurality of light guides having respective input ends and output ends, with the input ends ordered in a geometrical arrangement corresponding to the array of the spots. Relay optics collect and focus the optical radiation from the object onto the input ends such that each input end receives the optical radiation from a corresponding one of the spots. Multiple detectors and each coupled to receive the optical radiation from an output end of a respective one of the light guides. | 07-17-2014 |
20140158902 | Particle-Optical Systems and Arrangements and Particle-Optical Components for such Systems and Arrangements - A particle-optical arrangement comprises a charged-particle source for generating a beam of charged particles; a multi-aperture plate arranged in a beam path of the beam of charged particles, wherein the multi-aperture plate has a plurality of apertures formed therein in a predetermined first array pattern, wherein a plurality of charged-particle beamlets is formed from the beam of charged particles downstream of the multi-aperture plate, and wherein a plurality of beam spots is formed in an image plane of the apparatus by the plurality of beamlets, the plurality of beam spots being arranged in a second array pattern; and a particle-optical element for manipulating the beam of charged particles and/or the plurality of beamlets; wherein the first array pattern has a first pattern regularity in a first direction, and the second array pattern has a second pattern regularity in a second direction electron-optically corresponding to the first direction, and wherein the second regularity is higher than the first regularity. | 06-12-2014 |
20140098211 | SYSTEM, METHOD AND COMPUTED READABLE MEDIUM FOR EVALUATING A PARAMETER OF A FEATURE HAVING NANO-METRIC DIMENSIONS - A non-transitory computer readable medium, a system and a method. The method may include obtaining, by an image obtaining module, an image of a measurement site, the measurement site comprise the feature, the image of the measurement site comprises an image of the feature; processing, by an image processor, the image of the measurement site to provide an artificial image, the artificial image comprise a artificial image of an artificial feature, the artificial feature differs from the feature; measuring a parameter of the artificial feature to provide a measurement result, wherein the measuring comprises applying a measurement algorithm that is inadequate for measuring the parameter of the feature; and determining a value of the parameter of the feature in response to the measurement result. | 04-10-2014 |
20140079311 | SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR CLASSIFICATION - A computerized system for classification of pixels in an inspection image into noise-indicative populations, the system including: an interface operable to obtain an inspection image and to provide information of the inspection image to a processor connected thereto which includes: a noise estimation module and a classification module configured to and provide a classification of the plurality of pixels of the inspection image into noise-indicative population types. | 03-20-2014 |
20140074419 | THREE-DIMENSIONAL MAPPING USING SCANNING ELECTRON MICROSCOPE IMAGES - A method includes irradiating a surface of a sample, which is made-up of multiple types of materials, with a beam of primary electrons. Emitted electrons emitted from the irradiated sample are detected using multiple detectors that are positioned at respective different positions relative to the sample, so as to produce respective detector outputs. Calibration factors are computed to compensate for variations in emitted electron yield among the types of the materials, by identifying, for each material type, one or more horizontal regions on the surface that are made-up of the material type, and computing a calibration factor for the material type based on at least one of the detector outputs at the identified horizontal regions. The calibration factors are applied to the detector outputs. A three-dimensional topographical model of the surface is calculated based on the detector outputs to which the calibration factors are applied. | 03-13-2014 |
20140036942 | METHOD AND SYSTEM FOR COHERENCE REDUCTION - An optical system having coherence reduction capabilities includes a light source for generating a first light pulse; an asymmetrical pulse stretcher arranged to receive the first light pulse and to generate multiple light pulses, during a pulse sequence generation period, wherein the asymmetrical pulse stretcher includes multiple optical components which define a loop and a condenser lens is located between the asymmetrical pulse stretcher and an object, for directing the multiple pulses toward an area on the object At least two optical components of the multiple optical components are positioned in an almost symmetrical manner in relation to each other and introduce a coherence-related difference between at least two pulses of the multiple pulses. The pulse sequence generation period does not exceed a response period of a detector. | 02-06-2014 |
20130336575 | SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR DETECTION OF DEFECTS WITHIN INSPECTION IMAGES - An analysis system for detection of defects within an inspection image of an inspected object, the inspection image comprising a plurality of pixels, the system including: a computerized segmentation module configured to segmentize the inspection image based on multiple anchor locations and on a mask which defines multiple mask-segments, by assigning each part out of multiple parts of the inspection image to a respective image-segment selected out of a multiple image segments, wherein the multiple image segments correspond to at least one mask-segment of said multiple mask-segments; and a defect detection processor configured to determine a presence of a defect in the inspection image based on the segmentation at least by assessing each pixel out of a plurality of pixels of the inspection image. | 12-19-2013 |
20130336573 | APPARATUS AND METHOD FOR DEFECT DETECTION INCLUDING PATCH-TO-PATCH COMPARISONS - A system receives, based on processing of an inspected frame of an inspected image generated by collecting signals indicative of a pattern on an article, at least one candidate defect location in the inspected frame. The system defines a candidate patch within the inspected frame. The candidate patch is associated with the candidate defect location. The system identifies at least one similar patch in the inspected frame using a predefined similarity criterion and determines whether a defect exists at the candidate defect location based on a comparison of at least a portion of the candidate patch with at least a corresponding portion of the at least one similar patch. | 12-19-2013 |
20130326443 | METHOD OF GENERATING A RECIPE FOR A MANUFACTURING TOOL AND SYSTEM THEREOF - There is provided a computer-implemented method of creating a recipe for a manufacturing tool and a system thereof. The method comprises: upon obtaining data characterizing periodical sub-arrays in one or more dies, generating candidate stitches; identifying one or more candidate stitches characterized by periodicity characteristics satisfying, at least, a periodicity criterion, thereby identifying periodical stitches among the candidate stitches; and aggregating the identified periodical stitches and the periodical sub-arrays into periodical arrays, said periodical arrays to be used for automated recipe creation. | 12-05-2013 |
20130279796 | CLASSIFIER READINESS AND MAINTENANCE IN AUTOMATIC DEFECT CLASSIFICATION - A method for classification includes receiving inspection data associated with a plurality of defects found in one or more samples and receiving one or more benchmark classification comprising a class for each of the plurality of defects. a readiness criterion for one or more of the classes is evaluated based on the one or more benchmark classification results, wherein the readiness criterion comprises for each class, a suitability of the inspection data for training an automatic defect classifier for the class. A portion of the inspection data is selected corresponding to one or more defects associated with one or more classes that satisfy the readiness criterion. One or more automatic classifiers are trained for the one or more classes that satisfy the readiness criterion using the selected portion of the inspection data. | 10-24-2013 |
20130279795 | OPTIMIZATION OF UNKNOWN DEFECT REJECTION FOR AUTOMATIC DEFECT CLASSIFICATION - A method for defect classification includes storing, in a computer system, a definition of a region in a feature space. The definition is associated with a class of defects and comprises a kernel function comprising a parameter. The parameter determines a shape of the region. A confidence threshold for automatic classification of at least one defect associated with the class is received. A value of the parameter associated with the confidence threshold is selected. Inspection data for a plurality of defects detected in one or more samples under inspection is received. The plurality of defects for the class are automatically classified using the kernel function and the selected value of the parameter. | 10-24-2013 |
20130279794 | INTEGRATION OF AUTOMATIC AND MANUAL DEFECT CLASSIFICATION - A method for defect classification includes storing definitions of defect classes in terms of a classification rules in a multi-dimensional feature space. Inspection data associated with defects detected in one or more samples under inspection is received. A plurality of first classification results is generated by applying an automatic classifier to the inspection data based on the definitions, the plurality of first classification results comprising a class label and a corresponding confidence level for a defect. Upon determining that a confidence level for a defect is below a predetermined confidence threshold, a plurality of second classification results are generated by applying at least one inspection modality to the defect. A report is generated comprising a distribution of the defects among the defect classes by combining the plurality of first classification results and the plurality of second classification results. | 10-24-2013 |
20130279791 | DEFECT CLASSIFICATION USING TOPOGRAPHICAL ATTRIBUTES - A method for classification includes receiving an image of an area of a semiconductor wafer on which a pattern has been formed, the area containing a location of interest. At least one value for one or more attributes of the location of interest are computed based upon topographical features of the location of interest in a three-dimensional (3D) map of the area. | 10-24-2013 |
20130279790 | DEFECT CLASSIFICATION USING CAD-BASED CONTEXT ATTRIBUTES - A method for classification includes receiving an image of an area of a semiconductor wafer on which a pattern has been formed, the area containing an image location of interest, and receiving computer-aided design (CAD) data relating to the pattern comprising a CAD location of interest corresponding to the image location of interest. At least one value for one or more attributes of the image location of interest is computed based on a context of the CAD location of interest with respect to the CAD data. | 10-24-2013 |
20130204569 | SYSTEM, A METHOD AND A COMPUTER PROGRAM PRODUCT FOR CAD-BASED REGISTRATION - A system for generating calibration information usable for wafer inspection, the system including: (I) a displacement analysis module, configured to: (a) calculate a displacement for each target out of multiple targets selected in multiple scanned frames which are included in a scanned area of the wafer, the calculating based on a correlation of: (i) an image associated with the respective target which was obtained during a scanning of the wafer, and (ii) design data corresponding to the image; and (b) determining a displacement for each of the multiple scanned frames, the determining based on the displacements calculated for multiple targets in the respective scanned frame; and (II) a subsequent processing module, configured to generate calibration information including the displacements determined for the multiple scanned frames, and a target database that includes target image and location information of each target of a group of database targets. | 08-08-2013 |
20130202187 | SYSTEM, A METHOD AND A COMPUTER PROGRAM PRODUCT FOR CAD-BASED REGISTRATION - A system for location based wafer analysis, the system comprising: (i) a first input interface; (ii) a second input interface; (iii) a correlator; and (iv) a processor, configured to generate inspection results for the inspected wafer, with the help of at least one frame run-time displacement. | 08-08-2013 |
20130200255 | THREE-DIMENSIONAL MAPPING USING SCANNING ELECTRON MICROSCOPE IMAGES - A method includes irradiating a surface of a sample, which is made-up of multiple types of materials, with a beam of primary electrons. Emitted electrons emitted from the irradiated sample are detected using multiple detectors that are positioned at respective different positions relative to the sample, so as to produce respective detector outputs. Calibration factors are computed to compensate for variations in emitted electron yield among the types of the materials, by identifying, for each material type, one or more horizontal regions on the surface that are made-up of the material type, and computing a calibration factor for the material type based on at least one of the detector outputs at the identified horizontal regions. The calibration factors are applied to the detector outputs. A three-dimensional topographical model of the surface is calculated based on the detector outputs to which the calibration factors are applied. | 08-08-2013 |
20130187046 | Particle-Optical Systems and Arrangements and Particle-Optical Components for such Systems and Arrangements - The present invention concerns a charged-particle multi-beamlet system that comprises a source of charged particles ( | 07-25-2013 |
20130075605 | CONDUCTIVE ELEMENT FOR ELECTRICALLY COUPLING AN EUVL MASK TO A SUPPORTING CHUCK - A coupling module may include an upper portion that defines an aperture, mask contact elements, chuck contact elements and an intermediate element that is connected between the mask contact elements and the upper portion. A shape and a size of the aperture may correspond to a shape and size of a pattern transfer area of an extreme ultra violet (EUVL) mask. The coupling module may be shaped and sized so that once the mask contact elements contact the upper portion of the EUVL mask, the chuck contact elements contact a chuck that supports the mask. The coupling module may further provide at least one conductive path between the upper portion of the EUVL mask and the chuck when the EUVL mask is positioned on the chuck. | 03-28-2013 |
20120104252 | Particle-Optical Systems and Arrangements and Particle-Optical Components for such Systems and Arrangements - A particle-optical arrangement comprises a charged-particle source for generating a beam of charged particles; a multi-aperture plate arranged in a beam path of the beam of charged particles, wherein the multi-aperture plate has a plurality of apertures formed therein in a predetermined first array pattern, wherein a plurality of charged-particle beamlets is formed from the beam of charged particles downstream of the multi-aperture plate, and wherein a plurality of beam spots is formed in an image plane of the apparatus by the plurality of beamlets, the plurality of beam spots being arranged in a second array pattern; and a particle-optical element for manipulating the beam of charged particles and/or the plurality of beamlets; wherein the first array pattern has a first pattern regularity in a first direction, and the second array pattern has a second pattern regularity in a second direction electron-optically corresponding to the first direction, and wherein the second regularity is higher than the first regularity. | 05-03-2012 |
20110163229 | HIGH THROUGHPUT SEM TOOL - A scanning charged particle beam device ( | 07-07-2011 |
20100320382 | HIGH THROUGHPUT SEM TOOL - A multi-beam scanning electron beam device ( | 12-23-2010 |
20090256075 | Charged Particle Inspection Method and Charged Particle System - The present invention relates to a charged particle system comprising: a charged particle source; a first multi aperture plate; a second multi aperture plate disposed downstream of the first multi aperture plate, the second multi aperture plate; a controller configured to selectively apply at least first and second voltage differences between the first and second multi aperture plates; wherein the charged particle source and the first and second multi aperture plates are arranged such that each of a plurality of charged particle beamlets traverses an aperture pair, said aperture pair comprising one aperture of the first multi aperture plate and one aperture of the second multi aperture plate, wherein plural aperture pairs are arranged such that a center of the aperture of the first multi aperture plate is, when seen in a direction of incidence of the charged particle beamlet traversing the aperture of the first multi aperture plate, displaced relative to a center of the aperture of the second multi aperture plate. The invention further pertains to a a particle-optical component configured to change a divergence of a set of charged particle beamlets and a charged particle inspection method comprising inspection of an object using different numbers of charged particle beamlets. | 10-15-2009 |
20090240466 | METHOD AND SYSTEM FOR EVALUATING AN OBJECT THAT HAS A REPETITIVE PATTERN - A method for evaluating placement errors within a lithographic mask, the method includes: providing or receiving a reference result that represents a distance between a reference pair of points of a reference element; measuring, for each pair of points out of multiple pairs of points that are associated with multiple spaced apart elements of the lithographic mask, the distance between the pair of points to provide multiple measurement results; wherein differences between a measurement result and the reference result are indicative of relative placement errors; and determining relative placement errors in response to relationships between the reference result and each of the measurement results. | 09-24-2009 |
20090196487 | METHOD AND SYSTEM FOR EVALUATING A VARIATION IN A PARAMETER OF A PATTERN - A method and system are presented for evaluating a variation of a parameter of a pattern, the method includes: processing data indicative of an aerial intensity image of at least a portion of a patterned article, and determining values of a certain functional of the aerial image intensity for predetermined regions within said at least portion of the patterned article, said values of the aerial image intensity functional being indicative of a variation of at least one parameter of the pattern within said at least portion of the patterned article or of a variation of at least one parameter of a pattern manufactured by utilizing the patterned article. | 08-06-2009 |
20090114818 | Particle-Optical Component - The present invention relates to a particle-optical component comprising a first multi-aperture plate, and a second multi-aperture plate forming a gap between them; wherein a plurality of apertures of the first multi-aperture plate is arranged such that each aperture of the plurality of apertures of the first multi-aperture plate is aligned with a corresponding aperture of a plurality of apertures of the second multi-aperture plate; and wherein the gap has a first width at a first location and a second width at a second location and wherein the second width is by at least 5% greater than the first width. In addition, the present invention pertains to charged particle systems and arrangements comprising such components and methods of manufacturing multi aperture plates having a curved surface. | 05-07-2009 |
20080272280 | Cascaded image intensifier - A cascaded image intensifier device is presented. In one embodiment the device comprises: at least two sections in cascade, each of a first section and a last section out of the at least two sections including a photocathode unit adapted to convert photons to electrons and a screen unit adapted to convert electrons to photons; wherein the first section includes a reducing element adapted to: (i) reduce ion-caused degradation of a photocathode unit of the first section, and (ii) reduce a number of photons exiting from the first section from a first value to a second value; and wherein the last section outputs a number of photons that equals or exceeds the first value. Also disclosed are methods and systems using the disclosed cascaded image intensifier device. | 11-06-2008 |