ATOTECH DEUTSCHLAND GMBH Patent applications |
Patent application number | Title | Published |
20160024683 | APPARATUS AND METHOD FOR ELECTROLYTIC DEPOSITION OF METAL LAYERS ON WORKPIECES - The present invention is related to an apparatus and a method for the electrolytic deposition of a zinc or zinc alloy layer on a workpiece, the apparatus comprising a container to hold the metal plating bath divided into at least two compartments with an electrode assembly in the container, the assembly comprises in a first compartment a soluble anode to provide ions of the at least one metal to be deposited and a cathode corresponding to the workpiece to be metal plated and in an anolyte compartment separated from the first compartment by an ion exchange membrane comprises an insoluble anode and wherein the electrode assembly in the compartments are connected by an adjustable power supply. | 01-28-2016 |
20160002804 | PROCESS FOR CORROSION PROTECTION OF IRON CONTAINING MATERIALS - The present invention relates to a process for corrosion protection of an iron-containing substrate wherein a first zinc-nickel alloy layer, a second zinc-nickel alloy layer and a black passivate layer are deposited onto the substrate. The nickel concentration in the second zinc-nickel alloy layer is higher than the nickel concentration in the first zinc-nickel alloy layer. The substrate surface obtained is homogenously black with an appealing decorative appearance and both resistance against white rust and red rust are improved. | 01-07-2016 |
20150349152 | METHOD FOR METALLIZATION OF SOLAR CELL SUBSTRATES - The present invention relates to a metallization method for solar cell substrates by electroplating wherein i) a resist is deposited onto at least one surface of a solar cell substrate and patterned, ii) a conductive seed layer is deposited onto the patterned resist and into the openings formed by the resist pattern, iii) a first metal or metal alloy is electroplated onto the conductive seed layer, and iv) those portions of the first metal or metal alloy layer deposited onto the patterned resist are removed. | 12-03-2015 |
20150329985 | DEVICE FOR VERTICAL GALVANIC METAL, PREFERABLY COPPER, DEPOSITION ON A SUBSTRATE AND A CONTAINER SUITABLE FOR RECEIVING SUCH A DEVICE - The present invention is related to a device for vertical galvanic metal, preferably copper, deposition on a substrate, a container suitable for receiving such a device and a substrate holder, which is suitable for receiving a substrate to be treated, and the use of such a device inside of such a container for galvanic metal, in particular copper, deposition on a substrate. | 11-19-2015 |
20150307999 | AQUEOUS COMPOSITION FOR ETCHING OF COPPER AND COPPER ALLOYS - The present invention relates to an aqueous composition for and a process for etching copper and copper alloys applying said aqueous composition. The aqueous composition comprises a source for Fe | 10-29-2015 |
20150287898 | METHOD FOR MANUFACTURE OF WIRE BONDABLE AND SOLDERABLE SURFACES ON NOBLE METAL ELECTRODES - The present invention relates to a method for manufacture of wire bondable and solderable surfaces on noble metal electrodes. The noble metal electrodes are activated by depositing a seed layer of palladium or a palladium alloy layer by electroless plating at 60 to 90° C. Next, an intermediate layer is deposited onto the seed layer followed by deposition of the wire bondable and/or solderable surface finish layer(s) onto the intermediate layer. This method is particularly suitable in the production of optoelectronic devices such as light emitting diodes (LEDs). | 10-08-2015 |
20150110965 | PLATING BATH FOR ELECTROLESS DEPOSITION OF NICKEL LAYERS - The present invention relates to aqueous plating bath compositions for deposition of nickel and nickel alloys utilizing novel stabilising agents possessing a carbon-carbon triple bond and a functional group to enhance the bath performance. | 04-23-2015 |
20150096895 | METHOD AND APPARATUS FOR ELECTROLYTICALLY DEPOSITING A DEPOSITION METAL ON A WORKPIECE - For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus | 04-09-2015 |
20150017331 | PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES - The present invention relates to a process for metallizing nonconductive plastics using etching solutions free of hexavalent chromium. The etching solutions are based on permanganate solutions. After the treatment of the plastics with the etching solutions, the plastics are metallized by means of known processes. | 01-15-2015 |
20150009638 | METHOD FOR ELECTROLESS NICKEL-PHOSPHOROUS ALLOY DEPOSITION ONTO FLEXIBLE SUBSTRATES - The present invention relates to a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is deposited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel-phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable. | 01-08-2015 |
20140373878 | COMPOSITION AND METHOD FOR REMOVAL OF ORGANIC PAINT COATINGS FROM SUBSTRATES - The invention relates to a non-aqueous stripping composition for removing cured organic paint from substrates comprising
| 12-25-2014 |
20140284218 | CHROME-PLATED PART AND MANUFACTURING METHOD OF THE SAME - An nickel plating layer ( | 09-25-2014 |
20140261897 | Methods of Treating Metal Surfaces and Devices Formed Thereby - Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications. | 09-18-2014 |
20140251502 | Methods of Treating Metal Surfaces and Devices Formed Thereby - Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications. | 09-11-2014 |
20140242265 | ELECTROLESS PALLADIUM PLATING BATH COMPOSITION - The present invention concerns an aqueous plating bath composition for electroless deposition of palladium and/or palladium alloys and a method which utilises such aqueous plating bath compositions. The aqueous plating bath comprises a source of palladium ions, a reducing agent, a nitrogenated complexing agent which is free of phosphorous and at least one organic stabilising agent comprising 1 to 5 phosphonate residues. The aqueous plating bath and the method are particularly useful if the aqueous plating bath comprises copper ions. | 08-28-2014 |
20140242264 | FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION - The invention relates to an electroless aqueous copper plating solution, comprising a source of copper ions, a source of glyoxylic acid as reducing agent, and at least one polyamino disuccinic acid or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid as complexing agent, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates. | 08-28-2014 |
20140150689 | ELECTROLESS NICKEL PLATING BATH COMPOSITION - The present invention relates to an aqueous plating bath composition for depositing a nickel phosphorous alloy having a phosphorous content in the range of 5 to 12 wt. %. The plating bath comprises a sulfur-containing organic stabilizing agent. | 06-05-2014 |
20140141169 | METHOD FOR PROVIDING ORGANIC RESIST ADHESION TO A COPPER OR COPPER ALLOY SURFACE - The present invention relates to a method for increasing the adhesion of organic resist materials on copper or copper alloy surfaces. The copper or copper alloy surface is contacted with an aqueous adhesion promoting solution comprising at least one organic acid, a peroxide compound and optionally one or more substances selected from the group consisting of urea, derivatives thereof and water-soluble polymers. | 05-22-2014 |
20140138252 | Aqueous Acidic Bath for Electrolytic Deposition of Copper - The invention relates to an aqueous acidic bath for electrolytic deposition of copper, comprising, at least one source of copper ions, at least one acid, at least one brightener compound, and at least one leveler for copper-deposition, wherein at least one leveler is a ruthenium compound, and to a process for the electrolytic deposition of copper, in particular for filling a blind micro Vertical Interconnect Access (VIA), through hole VIA, trench and similar structures on printed circuit boards, chip carriers and semiconductor wafers. | 05-22-2014 |
20140124376 | PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER-TIN ALLOYS - A pyrophosphate-containing bath for the cyanide-free deposition of copper alloys on substrate surfaces, comprising a reaction product of a secondary monoamine with a diglycidyl ether, is described. The electrolyte bath is suitable for the galvanic deposition of glossy white, even and uniform copper-tin alloy coatings. | 05-08-2014 |
20140116950 | Device and Method for Recovering a Recovering Material from a Recovering Fluid Containing the Recovering Material - To achieve high efficiency in regeneration of waste fluid from metal plating electrolytes for example, a device and a method for recovering a recovering material from a recovering fluid containing the recovering material are provided. | 05-01-2014 |
20140113158 | METHOD FOR ELECTROLESS PLATING - The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy. | 04-24-2014 |
20140110844 | WIRE BONDABLE SURFACE FOR MICROELECTRONIC DEVICES - The present invention concerns thin diffusion barriers in metal and metal alloy layer sequences of contact area/barrier layer/first bonding layer type for metal wire bonding applications. The diffusion barrier is selected from Co-M-P. Co-M-B and Co-M-B—P alloys wherein M is selected from Mn, Zr, Re, Mo, Ta and W having a thickness in the range 0.03 to 0.3 μm. The first bonding layer is selected from palladium and palladium alloys. | 04-24-2014 |
20140102910 | METHOD FOR COPPER PLATING - A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to said heterocyclic core by a spacer is disclosed. Said method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates. | 04-17-2014 |
20140076461 | SOLUTION AND PROCESS FOR THE PRE-TREATMENT OF COPPER SURFACES USING AN N-ALKOXYLATED ADHESION-PROMOTING COMPOUND - The invention concerns a solution for pretreating copper surfaces, and a method for pre-treating copper surfaces allowing the formation of a tight bond to plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound, said compound comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, connected at one or more of its nitrogen atoms with at least one residue of formula (I). | 03-20-2014 |
20140042033 | ELECTROPLATING BATH AND METHOD FOR PRODUCING DARK CHROMIUM LAYERS - The invention relates to methods and plating baths for electrodepositing a dark chromium layer on a workpiece. The trivalent chromium electroplating baths comprise sulphur compounds and the methods for electrodepositing a dark chromium layer employ these trivalent chromium electroplating baths. The dark chromium deposits and workpieces carrying dark chromium deposits are suited for application for decorative purposes. | 02-13-2014 |
20140000650 | PROCESS FOR ETCHING A RECESSED STRUCTURE FILLED WITH TIN OR A TIN ALLOY | 01-02-2014 |
20130316190 | ZINC-IRON ALLOY LAYER MATERIAL - The invention discloses a zinc-iron alloy layer material having a body centred cubic crystal structure of the Γ-phase, a (330) texture and an iron content of 12 to 20 wt.-% deposited from an alkaline aqueous plating bath. The zinc alloy layer material provides a high corrosion protection to metallic substrates, has a high hardness and a bright appearance. | 11-28-2013 |
20130309404 | AUTOCATALYTIC PLATING BATH COMPOSITION FOR DEPOSITION OF TIN AND TIN ALLOYS - An autocatalytic tin plating bath containing Sn | 11-21-2013 |
20130288475 | METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BONDING ON PRINTED CIRCUIT BOARDS AND IC-SUBSTRATES - The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly. | 10-31-2013 |
20130277226 | IMMERSION TIN OR TIN ALLOY PLATING BATH WITH IMPROVED REMOVAL OF CUPROUS IONS - The invention concerns an immersion tin plating bath which comprises at least one aromatic sulfonic acid, at least one first precipitation additive and at least one second precipitation additive. The at least one first precipitation additive is an aliphatic poly-alcohol compound, an ether thereof or a polymer derived thereof having an average molecular weight in the range of 62 g/mol and 600 g/mol. The at least one second precipitation additive is a polyalkylene glycol compound having an average molecular weight in the range of 750 to 10,000 g/mol. | 10-24-2013 |
20130199832 | COMPOSITE BUILD-UP MATERIALS FOR EMBEDDING OF ACTIVE COMPONENTS - Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding active components such as micro chips. The composite build-up materials comprise a carrier layer ( | 08-08-2013 |
20130199825 | COMPOSITE BUILD-UP MATERIAL FOR EMBEDDING OF CIRCUITRY - Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads. The composite build-up materials comprise a carrier layer ( | 08-08-2013 |
20130168438 | METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES - Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate that includes at least one inner contact area, ii) contact the entire substrate area including the at least one inner contact area with a solution suitable to provide a conductive layer on the substrate surface, iii) form a patterned resist layer, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the inner contact area, v) remove the patterned resist layer, vi) form a solder resist layer having solder resist openings on the substrate surface. | 07-04-2013 |
20130112566 | METHOD FOR ETCHING OF COPPER AND COPPER ALLOYS - The present invention is concerned with improved means for etching circuit structures on printed circuit board or wafer substrates of copper or copper alloys in a manner effectively removing unwanted copper from such circuit structures leaving behind a smooth copper surface applying an etching solution containing an Fe(II)/Fe(III) redox system and sulfur containing organic additives. It is an advantage of the present invention that the solution can also applied for plating of copper prior to etching. | 05-09-2013 |
20130105329 | METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON SUBSTRATES | 05-02-2013 |
20130082091 | METHOD TO FORM SOLDER ALLOY DEPOSITS ON SUBSTRATES - Method of forming a solder alloy deposit on a substrate comprising i) provide a substrate including a surface bearing electrical circuitry that includes at least one inner layer contact area, ii) form a solder mask layer on the substrate surface and patterned to expose at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution to provide a metal seed layer on the substrate surface, iv) form a structured resist layer on the metal seed layer, v) electroplate a first solder material layer containing tin onto the conductive layer, vi) electroplate a second solder material layer onto the first solder material layer, vii) remove the structured resist layer and etch away an amount of the metal seed layer sufficient to remove the metal seed layer from the solder mask layer area and reflow the substrate. | 04-04-2013 |
20130078382 | PROCESS FOR FORMING CORROSION PROTECTION LAYERS ON METAL SURFACES - The invention relates to a process for producing a corrosion-inhibiting coating for substrates having a surface consisting of zinc, magnesium, aluminium or one of their alloys, wherein the surface to be treated is brought into contact in direct succession with two aqueous treatment solutions containing chromium(III) ions, metal ions of the substrate surface to be treated and at least one complexing agent. The first treatment solution has a pH in the range from 1.0 to 4.0, while the second treatment solution has a pH of from 3.0 to 12.0. The process of the invention produces a smaller amount of wastewater polluted with heavy metals. | 03-28-2013 |
20130056438 | COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS - Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of ≦100 μm. | 03-07-2013 |
20120305406 | Method for Metallising Objects Which Have at Least Two Different Plastics on the Surface - The following method is to improve selectivity during metallisation of surface areas to be metallised on objects | 12-06-2012 |
20120298515 | METHOD AND DEVICE FOR THE WET-CHEMICAL TREATMENT OF MATERIAL TO BE TREATED | 11-29-2012 |
20120298509 | Membrane Electrolysis Stack, Electrodialysis Device Including the Stack and Method for the Regeneration of an Electroless Plating Bath - To prevent biological fouling in an electrodialysis device, an electrodialysis device including a membrane electrolysis stack are created. Every membrane electrolysis stack comprises membranes stacked on top of each other and respectively dilute and concentrate compartments arranged therebetween, at least one first and at least one second membrane alternating in succession in the membrane electrolysis stack. At least one first membrane is selected from a group comprising an anion exchange membrane and a bipolar membrane, and at least one second membrane is selected from a group comprising a monoselective anion exchange membrane, a monoselective cation exchange membrane and a proton-selective exchange membrane, with the proviso that the membranes are respectively selected independently of each other and that at least one first membrane in the membrane electrolysis stack is a bipolar membrane. | 11-29-2012 |
20120186702 | TREATMENT SOLUTION FOR PRODUCING CHROME AND COBALT-FREE BLACK CONVERSION COATINGS - The invention relates to chromium- and cobalt-free treatment solutions for producing black coatings which afford corrosion protection. The treatment solution of the invention contains oxo cations or complex halogen ions or mixtures of oxo cations and complex halogen ions, an oxidant and an organic sulphur compound. | 07-26-2012 |
20120160698 | POLYMERS HAVING TERMINAL AMINO GROUPS AND USE THEREOF AS ADDITIVES FOR ZINC AND ZINC ALLOY ELECTRODEPOSITION BATHS - Additives for electrolyte baths for the electrodeposition of zinc or zinc alloy layer are described. The additives are polymers with terminal amino groups. These polymers are obtainable by reaction of at least one diamino compound (having two tertiary amino groups) with at least one di(pseudo)halogen compound, wherein the diamino compound is used in stoichiometric excess. The additives effect, in particular, a very little formation of bubbles and only few burnings as well as a uniform distribution of layer thickness in the electrodeposition of zinc or zinc alloy layers. | 06-28-2012 |
20120160697 | PROCESS FOR APPLYING A METAL COATING TO A NON-CONDUCTIVE SUBSTRATE - Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt comprising an organic material having a cumulative formation constant log K of from about 0.73 to about 21.95 for an ion of the metal of said metal salt, characterised in that the composition according to step (b) is treated with an electrical current for a period of time prior to and/or during contacting said solution with the substrate. | 06-28-2012 |
20120148733 | METHOD FOR ELECTROLESS PLATING OF TIN AND TIN ALLOYS - The invention relates to a method for electroless (immersion) plating of tin and tin alloys having a thickness of≧1 μm as a final finish in the manufacture of printed circuit boards, IC substrates, semiconductor wafers and the like. The method utilizes an electroless plated sacrificial layer of copper between the copper contact pad and the electroless plated tin layer which is dissolved completely during tin plating. The method compensates the undesired loss of copper from a contact pad during electroless plating of thick tin layers. | 06-14-2012 |
20120118753 | Method of Manufacturing a Circuit Carrier Layer and a Use of Said Method for Manufacturing a Circuit Carrier - In order to be able to produce high density circuits on a dielectric substrate wherein the conductor lines of said circuit have a good adhesion to the dielectric substrate surface, a method is provided which comprises the following method steps: a) providing an auxiliary substrate having two sides, at least one of said sides having an electrically conductive surface; b) treating at least one of the at least one electrically conductive surface with at least one release layer forming compound, the at least one release layer forming compound being a heterocyclic compound having at least one thiol group, c) forming a patterned resist coating on at least one of said at least one electrically conductive surface which has been treated with said at least one release layer forming compound, the patterned resist coating having at least one resist opening thereby exposing the electrically conductive surface; d) forming an electrically conductive pattern in the at least one resist opening by electrodepositing a metal on the exposed electrically conductive surface; e) embedding each electrically conductive pattern into a dielectric material by forming a respective dielectric material layer on the respective side of the auxiliary substrate; and f) separating each dielectric material layer comprising the respective embedded electrically conductive pattern and the auxiliary substrate from each other. | 05-17-2012 |
20120111365 | METHOD AND ASSEMBLY FOR TREATING A PLANAR MATERIAL TO BE TREATED AND DEVICE FOR REMOVING OR HOLDING OFF TREATMENT LIQUID - In order to remove treatment liquid ( | 05-10-2012 |
20120107074 | METHOD, HOLDING MEANS, APPARATUS AND SYSTEM FOR TRANSPORTING A FLAT MATERIAL TO BE TREATED AND LOADING OR UNLOADING APPARATUS - In order to transport a flat material to be treated ( | 05-03-2012 |
20120080322 | METHOD, TREATMENT STATION AND ASSEMBLY FOR TREATING A PLANAR MATERIAL TO BE TREATED - In order to remove treatment liquid ( | 04-05-2012 |
20110293823 | METHOD AND DEVICE FOR PRODUCING A PLASTIC COATING - Method for producing a plastic layer having a layer thickness of less than 200 μm on an upper side of a substrate, comprising the following steps:
| 12-01-2011 |
20110215003 | Method of Inspecting a Metal Coating and a Method for Analytical Control of a Deposition Electrolyte Serving to Deposit Said Metal Coating - For fast and secure determination of the quality of a metal coating as well as of an electrolyte for depositing a metal, in particular for electrolytic deposition of nickel such as of semi-gloss nickel and bright nickel and for analytical control of the deposition electrolyte, a method of inspecting a metal coating is provided, which involves the following method steps: a) depositing the metal coating from a deposition electrolyte onto a working electrode; b) electrolytically dissolving the metal coating through anodic polarisation of the working electrode with respect to a counter electrode, which is in electrolytic contact with the working electrode; c) recording an electrical dissolution potential at the working electrode over time, said potential occurring during a dissolution of the metal coating; and d) determining a time-averaged vale of the dissolution potential. | 09-08-2011 |
20110200842 | STRESS-REDUCED NI-P/PD STACKS FOR BONDABLE WAFER SURFACES - The invention relates to a substrate having a bondable metal coating comprising, in this order, on an Al or Cu surface: (a) a Ni—P layer, (b) a Pd layer and, optionally, (c) an Au layer, wherein the thickness of the Ni—P layer (a) is 0.2 to 10 m, the thickness of the Pd layer (b) is 0.05 to 1.0 m and the thickness of the optional Au layer (c) is 0.01 to 0.5 m, and wherein the Ni—P layer (a) has a P content of 10.5 to 14 wt.-%. The deposit internal stress of the resulting Ni—P/Pd stack is not higher than 34.48 M−Pa (5,000 psi). Further, a process for the preparation of such a substrate is described. | 08-18-2011 |
20110195278 | METAL PLATING ADDITIVE, AND METHOD FOR PLATING SUBSTRATES AND PRODUCTS THEREFROM - The present invention is directed to the fabrication of rigid memory disks, including a metal plating composition which impedes deposition of non-metallic particles during a plating process. The plating composition includes at least one sulfated fatty acid ester additive, or mixtures or salts thereof, of formula: wherein R1 is selected from the group consisting of OH, OCH2, OCH2CH3, C1-C7 alkyl, linear or branched; R2 selected from H and C1-C7 alkyl, linear or branched; m=1 to about 5; n=2 to about 30; o=0 to about 10; M+ is a metal or pseudo metal ion or H+. The additive has a zeta potential which impedes deposit of non-metallic particles. The invention is further directed to a method for electroless plating utilizing the additive composition in a bath with at least a stabilizing agent, complexing agent and reducing agent and source of metal ions. | 08-11-2011 |
20110132766 | Method for Electrochemically Depositing a Metal on a Substrate - To electroplate a metal layer which has silica particles dispersed therein, a method for electrochemically depositing a metal on a substrate, more specifically a method of forming a corrosion-resistant nickel multilayer on a substrate, are provided, wherein the method comprises the following method steps: (a) depositing a first nickel layer having a first electric potential, (b) depositing a second nickel layer having a second electric potential which is more negative than the first electric potential over the first nickel layer and (c) depositing a third nickel layer over the second nickel layer using a solution for electrochemically depositing a metal on a substrate, said solution containing ions of the metal to be deposited and silica particles, wherein at least one silicon containing organic moiety is provided to said silica particles, said silicon containing organic moiety comprising at least one functional group selected from the group comprising amino, quaternized ammonium, quaternized phosphonium and quaternized arsonium which imparts the silica particles a positive electric charge while being in contact with said solution. | 06-09-2011 |
20110094583 | ELECTROPLATING ADDITIVE FOR THE DEPOSITION OF METAL, A BINARY, TERNARY, QUATERNARY OR PENTANARY ALLOY OF ELEMENTS OF GROUP 11 (IB)-GROUP 13 (IIIA)-GROUP 16 (VIA) - The invention relates to electroplating additives for the deposition of a group IB metal/binary or ternary group IB-group IIIA/ternary, quaternary or pentanary group IB-group IIIA-group VIA alloy on substrates useful for thin film solar cells. The additives have the general formula (A): | 04-28-2011 |
20110011746 | Aqueous, Acid Bath and Method for the Electrolytic Deposition of Copper - To generate a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches, an aqueous, acid bath for the electrolytic deposition of copper is provided, said bath containing at least one copper ion source, at least one acid ion source, at least one brightener compound and at least one leveler compound, wherein at least one leveler compound is selected from the group comprising synthetically produced non-functionalized peptides and synthetically produced functionalized peptides and synthetically produced functionalized amino acids. | 01-20-2011 |
20100326838 | PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER-TIN ALLOYS - A pyrophosphate-containing bath for the cyanide-free deposition of copper alloys on substrate surfaces, comprising a reaction product of a secondary monoamine with a diglycidyl ether, is described. The electrolyte bath is suitable for the galvanic deposition of glossy white, even and uniform copper-tin alloy coatings. | 12-30-2010 |
20100326713 | NI-P LAYER SYSTEM AND PROCESS FOR ITS PREPARATION - The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness ≦3.0 μm, (ii) a Ni—P layer having a thickness ≦1.0 μm, (iii) a Au layer having a thickness ≦1.0 μm. | 12-30-2010 |
20100323099 | Non-Etching Non-Resist Adhesion Composition and Method of Preparing a Work Piece - To achieve good adherence of a resist coating, more specifically a photo imageable resist coating, to a copper base while ensuring that the copper base being very thin is not compromised, a non-etching non-resist composition for the treatment of the copper base is provided, said composition comprising at least one adhesion agent selected from the group comprising (i) heterocyclic compounds comprising at least one thiol moiety and (ii) quaternary ammonium polymers having the following general chemical formula: {N | 12-23-2010 |
20100310849 | SOLID POWDER FORMULATIONS FOR THE PREPARATION OF RESIN-COATED FOILS AND THEIR USE IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS - The invention relates to solid thermosetting resin compositions and resin-coated foils, glass cloth reinforced resin-coated foils using the same and their use in the manufacturing of printed circuit boards. | 12-09-2010 |
20100300890 | PYROPHOSPHATE-BASED BATH FOR PLATING OF TIN ALLOY LAYERS - An aqueous cyanide-free electrolyte bath for plating of tin alloy layers on substrate surfaces comprising (i) a tin ion source and a source for another alloy element, characterised in that it further contains (ii) N-methyl pyrrolidone is described. | 12-02-2010 |
20100236936 | Aqueous,alkaline,cyanide-free bath for the galvanic deposition of zinc and zinc alloy coatings - The invention relates to an aqueous, alkaline cyanide-free electrolyte bath for de-positing zinc and zinc alloy coatings on substrate surfaces comprising (a) a source for zinc ions and optionally a source for further metal ions, (b) hydroxide ions, (c) a polymer of general formula I which is soluble in the bath and (d) at least one pyridinium compound of general formula II or III. The electrolyte bath is suitable for the galvanic deposition of bright and even zinc and zinc alloy coatings. | 09-23-2010 |
20100196727 | SOLUTION AND PROCESS FOR INCREASING THE SOLDERABILITY AND CORROSION RESISTANCE OF METAL OR METAL ALLOY SURFACE - Described is a new a solution comprising a phosphorous compound and a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface. | 08-05-2010 |
20100187121 | PROCESS FOR THE PREPARATION OF ELECTRODES FOR USE IN A FUEL CELL - A process for the preparation of electrodes for use in a fuel cell comprising a membrane electrode assembly with a negative and a positive electrode is described, said process comprising the following steps: (i) providing an electrode substrate and (ii) coating said substrate electrolytically from a plating bath with a metal layer, said metal being selected from Ag, Au, Pd and its alloys. | 07-29-2010 |
20100180793 | ANTI-CORROSION TREATMENT FOR CONVERSION LAYERS - The invention relates to a method for producing a coating layer protecting against corrosion wherein a surface which is to be treated is brought into contact with an aqueous treatment solution containing chromium(III) ions and at least one phosphate compound, wherein the ratio of the molar concentration of the chromium(III) ions to the molar concentration of the at least one phosphate compound (calculated as orthophosphate) lies between 1:1.5 and 1:3. The method improves the corrosion protection of metallic, in particular, zinc-containing, surfaces provided with conversion layers. The decorative and functional properties of the surface are maintained or improved. Furthermore, the known problems resulting from the use of chromium(VI)-containing compounds or from post-treatments with polymer dispersions are avoided. | 07-22-2010 |
20100176088 | APPARATUS AND METHOD FOR THE WET CHEMICAL TREATMENT OF A PRODUCT AND METHOD FOR INSTALLING A FLOW MEMBER INTO THE APPARATUS - To ensure a uniform flow over the surface of a product W, an apparatus is provided for the wet chemical treatment of the product W that is disposed in the apparatus | 07-15-2010 |
20100176004 | APPARATUS AND METHOD FOR THE ELECTROLYTIC TREATMENT OF A PLATE-SHAPED PRODUCT - An apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes: devices for retaining | 07-15-2010 |
20100155257 | Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings - An aqueous, alkaline, cyanide-free electrolyte bath for deposition of zinc alloy layers on substrate surfaces is described, which contains cationic pyridinium compounds as brighteners and polyamines as complexing agents. The electrolyte bath is suitable for electroplating bright and even zinc alloy coatings. | 06-24-2010 |
20100133113 | CHROMIUM(VI)-FREE BLACK PASSIVATION OF SURFACES CONTAINING ZINC - The invention relates to a treatment solution for producing substantially chromium(VI)-free black conversion layers on alloy layers containing zinc, the solution comprising the following: (i) at least one first carboxylic acid having 1 to 8 carbon atoms, the acid containing no polar groups with exception of the carboxyl group and being a monocarboxylic acid, (ii) at least one second carboxylic acid having 1 to 8 carbon atoms, comprising at least one further polar group that is selected from —OH, —SO | 06-03-2010 |
20100126633 | Agent for the Production of Anti-Corrosion Layers on Metal Surfaces - An agent for the production of anti-corrosion layers on metal surfaces, produced by the following steps:
| 05-27-2010 |
20100119713 | PROCESS FOR APPLYING A METAL COATING TO A NON-CONDUCTIVE SUBSTRATE - Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt, wherein an iminosuccinic acid or a derivative thereof is used as said complexing agent. | 05-13-2010 |
20100059384 | Electrodeposition method with analysis of the electrolytic bath by solid Phase Extraction - A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous. | 03-11-2010 |
20100035435 | Composition and Method for Improved Adhesion of Polymeric Materials to Copper or Copper Alloy Surfaces - The present invention relates to a method for treating copper or copper alloy surfaces for tight bonding to polymeric substrates, for example solder masks found in multilayer printed circuit boards. The substrate generally is a semiconductor-device, a lead frame or a printed circuit board. | 02-11-2010 |
20090301889 | Electrolytic Method For Filling Holes and Cavities With Metals - Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system. | 12-10-2009 |
20090250379 | Process for Manufacturing a Microreactor and Its Use as a Reformer - For manufacturing micro-structured reactors with passageways loaded with catalyst using the pre-coat method, a method is provided which comprises the following method steps: a) producing reactor layers having bonding areas as well as passageway areas in which the passageways are formed, b) applying at least one bonding layer onto the reactor layers in the bonding areas, c) loading the reactor layers in the passageway areas with the catalyst and d) bonding the reactor layers, the bonding layer being applied and masked before the reactor layers are loaded with the catalyst. As a result, it is ensured that the efficiency of the catalyst will not be affected during manufacturing. The reactor may be used as a methane and methanol reformer in particular. | 10-08-2009 |
20090202858 | METHOD FOR BONDING WORK PIECES MADE OF STAINLESS STEEL, NICKEL OR NICKEL ALLOYS, USING A BONDING LAYER CONSISTING OF NICKEL-PHOSPHOROUS, METHOD FOR PRODUCING A MICRO-STRUCTURED COMPONENT USING SUCH METHOD; MICRO-STRUCTURED COMPONENT OBTAINED BY SUCH METHOD - To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate. | 08-13-2009 |
20090200263 | METHOD FOR METALLIZING INSULATING SUBSTRATES WHEREIN THE ROUGHENING AND ETCHING PROCESSES ARE CONTROLLED BY MEANS OF GLOSS MEASUREMENT - The invention relates to a control of etching processes of insulating substrates by means of gloss measurement. By this method a surface roughness can be achieved which leads to good adhesion of metals layers deposited in subsequent metallization steps. This method is particularly suited for the production of printed circuit boards. | 08-13-2009 |
20090130315 | Method for Continuously Operating Acid or Alkaline Zinc or Zinc Alloy Baths - The invention provides a process for depositing metallic layers from acidic or alkaline zinc or zinc alloy baths containing organic additives selected from brighteners, surfactants and complexing agents, a soluble zinc salt and optionally further metal salts selected from Fe, Ni, Co, Sn salts, wherein the bath can be purified continuously so that the process can be operated without interruption, as well as apparatus for carrying out this process. | 05-21-2009 |
20090107845 | Alkaline Electroplating Bath Having A Filtration Membrane - There is described an alkaline electroplating bath for depositing zinc alloys on substrates having an anode and a cathode, wherein the anode region and the cathode region are separated from each other by a filtration membrane. | 04-30-2009 |
20090081370 | METHOD FOR COATING SUBSTRATES CONTAINING ANTIMONY COMPOUNDS WITH TIN AND TIN ALLOYS - The present invention relates to a method for depositing tin or tin alloy layers on substrates containing antimony compounds as flameproofing agents or for improving the stampability, wherein the antimony compound is removed from the surface of the substrate material by an acid solution prior to metallization. Particularly preferred, pretreatment solutions containing hydrochloric acids are used for this purpose. The method is particularly suitable for producing joinable tin final layers on printed circuit boards containing antimony compounds, the tin final layers being applied onto copper portions of the conductor pattern which are not covered by the solder stop mask. | 03-26-2009 |
20090032146 | Aqueous Reaction Solution and Method of Passivating Workpieces Having Zinc or Zinc Alloy Surfaces and Use of a Heteroaromatic Compound - For producing corrosion resistant yellow passivate layers on zinc and zinc alloy surfaces, an aqueous reaction solution is utilized that contains trivalent chromium ions, at least one acid as well as at least one heteroaromatic compound selected from the group comprising nicotinic acid, the salts and derivatives thereof. | 02-05-2009 |
20080268166 | Process for the Transfer of Powders and Powder Coatings to Substrates - The invention relates to a process for the mixing and gentle transport and the transfer of powders to substrates wherein the powder particles are first charged by friction in the presence of magnetic particles and then transported by means of a fluidized bed and optionally one or more mixing rolls and then transferred and applied to a substrate by means of an electric field between a brush drum and a substrate drum carrying said substrate, characterized in that the mixing and the transport of the powder particles and the magnetic particles are carried out by means of a boiling bed. | 10-30-2008 |
20080217381 | Method for Bonding Work pieces and Micro-Structured Component - For forming very strong bond joints suited for manufacturing micro-structured components consisting of plurality of individual layers, a bonding method is proposed by which a bonding arrangement of the work pieces is formed that comprises at least one metallic bonding layer interposed therein between and by which the bonding arrangement is heated to a bonding temperature below the melting temperature of the at least one bonding layer. In accordance with the invention, the at least one bonding layer is deposited using a chemical or electrolytic method. | 09-11-2008 |
20080200360 | Aqueous Solution and Method for Removing Ionic Contaminants from the Surface of a Workpiece - To reduce ionic contaminants on printed circuit boards that are at least partially covered with a solder resist mask and are provided with top layers on the copper structures, an aqueous cleaning solution is used, which contains at least one ethanolamine compound and/or the salt thereof, at least one alcoholic solvent and, at need, at least one guanidine compound and/or the salt thereof. | 08-21-2008 |
20080196875 | Micro-Structured Cooler and Use Thereof - For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils ( | 08-21-2008 |