FOXCONN ADVANCED TECHNOLOGY INC. Patent applications |
Patent application number | Title | Published |
20130092420 | EMBEDDED MULTILAYER PRINTED CIRCUIT BOARD AND METHOD - An embedded multilayer printed circuit board includes first, second and third circuit substrates, and a flexible circuit substrate. The first circuit substrate includes a first base layer and a first electrically conductive layer. The second circuit substrate includes a second base layer and a second circuit layer. The second circuit substrate also defines a receiving hole. The third circuit substrate includes a third circuit layer, a third base layer, a fourth circuit layer, and an electronic element mounted on the third circuit layer. The third circuit layer and the fourth circuit layer are formed on the opposite sides of the third base layer. The electronic element is received in the receiving hole. | 04-18-2013 |
20120146277 | CLAMPING APPARATUS - A clamping apparatus includes a receiving frame, a guide plate, two drive assemblies, and two clamping assemblies. The receiving frame includes two parallel securing arms and a connection arm. The securing arms and the connection arm define a first receiving space. Each of the securing arms defines a slot. The guide plate is configured for mounting of a workpiece thereon. The drive assemblies are configured for cooperatively moving the guide plate between a first position and a second position. When the guide plate is located at the first position, the workpiece is loaded on the guide plate and distant from the connection arm. When the guide plate is located at the second position, the workpiece is adjacent to the connection arm and entirely received in the first receiving space and the slots. The clamping assemblies are configured for cooperatively clamping the workpiece. | 06-14-2012 |
20120067848 | APPARATUS AND METHOD FOR WET PROCESSING SUBSTRATE - An exemplary wet processing apparatus includes a tank, a conveyor configured for conveying a substrate, and a spraying system. The tank receives a wet processing liquid. The conveyor includes a first conveying portion, a second conveying portion, and a third conveying portion. The first conveying portion is in the tank and conveys the substrate in the wet processing liquid. The second conveying portion is obliquely interconnected between the first and third conveying portions. The third conveying portion conveys the substrate above the wet processing liquid in the tank. The spraying system is above the third conveying portion, sprays the wet processing liquid onto the substrate on the third conveying portion. | 03-22-2012 |
20120055356 | METHOD FOR SCREEN PRINTING PRINTED CIRCUIT BOARD SUBSTRATE - A method for screen printing a printed circuit board substrate comprises the following steps. A printed circuit board substrate including a copper foil layer is provided. Pluralities of marks are formed on the copper foil layer. A plurality of printing screens are provided, each includes an screen pattern and an opening corresponding to a respective mark. Printing material is applied on the ith screen Si to form an ith printing pattern and cover the ith mark at the ith opening, the ith printing pattern conforms to the ith screen pattern; checking whether the ith mark is covered by the printing material when i is less than N. Printing material is applied on the (i+1)th screen S | 03-08-2012 |
20120031873 | ETCHING DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD USING SAME - In a method for manufacturing a printed circuit board, a substrate, including a number of plated through holes (PTHs) is provided. Each of the PTHs has an electrically conductive layer plated on its inner wall and includes an electrically connecting portion and a stub. A protective layer is formed on a surface of the substrate adjacent to the stub. An etching device, including an upper plate and a number of spray tubes corresponding to the PTHs, is provided. Each of the spray tubes includes a protruding portion beyond the upper plate. The substrate is arranged in such a manner that the protective layer is in contact with the upper plate and the protruding portions are received in the stubs. After that, the protruding portions spray an etchant to etch and remove the electrically conductive layer of the stubs, and the protective layer is removed. | 02-09-2012 |
20120018299 | ELECTROPLATING APPARATUS - An electroplating apparatus includes an electroplating tank, a first anode plate, a first cathode plate, a second cathode plate, a number of first and second elastic elements, a number of pairs of clamping assemblies, a first drive member, and a second drive member. The electroplating tank holds an electrolyte solution. The first elastic elements are interconnected between the first anode plate and the first cathode plate. The second elastic elements are interconnected between the first anode plate and the second cathode plate. Each pair of clamping assemblies are used to clamp opposite ends of a plated-shaped workpiece. The first drive member and the second drive member are used to cooperatively move the clamping assemblies. | 01-26-2012 |
20120011713 | METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD - In a method for manufacturing multilayer PCBs having n circuit layers, a flexible substrate strip is provided. The strip comprises a number of PCB units, each comprising n segmental portions. The strip is treated in a reel to reel process to form traces in n−2 segmental portions of each of the PCB units, the other two segmental portions are left untreated without traces. Then the strip is cut to obtain a number of separated PCB units. The PCB unit is folded in such a manner that the n−2 segmental portions having traces are arranged between the other two segmental portions without traces. The folded PCB unit is laminated to form a multilayer substrate and traces are formed in the two segmental portions. | 01-19-2012 |
20110308082 | METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD WITH PLATED THROUGH HOLES - A method for manufacturing multilayer printed circuit board includes steps below. A first copper clad laminate includes a central portion and a peripheral portion is provided. A group of concentric copper annular collars is formed by etching the peripheral portion. A second copper clad laminate and an adhesive layer is laminated on to the first copper clad laminate in a manner that the adhesive is sandwiched between the first copper clad laminate and the second copper clad laminate to form a multilayer substrate. A detection hole is formed run through the multilayer substrate. An offset distance is determined and plated through holes in the central portion of the multilayer substrate is formed based on the offset distance. | 12-22-2011 |
20110302775 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - A method for manufacturing a printed circuit board with cavity includes following steps. First, a first substrate is provided. The first substrate includes a first electrically conductive layer defining an exposed portion and a laminating portion. Second, a second substrate is provided. The second substrate includes an unwanted portion corresponding to the exposed portion and a preserving portion. Third, a first annular bump surrounding the exposed portion is formed. Fourth, a second annular bump surrounding the unwanted portion is formed. Fifth, a first adhesive layer defining an opening is provided. Sixth, the first and second substrates are laminated to the first adhesive layer, the exposed portion and the unwanted portion are exposed in the opening, and the second annular bump is in contact with the first annular bump. Seventh, the unwanted portion is removed and a cavity is defined, the exposed portion is exposed in the cavity. | 12-15-2011 |
20110297644 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD WITH CAVITY - A method for manufacturing printed circuit board includes steps below. An inner substrate including a first electrically conductive layer is provided. A first electrically conductive pattern is formed in the first electrically conductive layer. The first electrically conductive pattern includes an exposed region and an attaching region. A protective layer is formed on the entire exposed region. A first adhesive layer and a second electrically conductive layer are laminated on a surface of the first electrically conductive pattern in the attaching region and a surface of the protective layer. A slit along a boundary of the exposed region passing through the second electrically conductive pattern and the first adhesive layer is defined. The second electrically conductive layer corresponding to the exposed region, the first adhesive layer corresponding to the exposed region and the protective layer is removed. | 12-08-2011 |
20110297437 | ELECTRONIC COMPONENT DEVICE AND CONNECTOR ASSEMBLY HAVING SAME - An electronic component device for electrically and mechanically connecting to a lead wire includes a base and a cover. The base includes a receiving body, at least one electronic component, and two spaced stripping connectors. The receiving body defining an installation groove. The at least one electronic component and the stripping connectors are received in the receiving body. Each stripping connector is in electrically connected with the at least one electronic component. The stripping connector defines a stripping slot for extension of the core therethrough, which has a size smaller than or equal to the diameter of the core. The cover includes a pressing surface and an electrically insulating cutting body. The cutting body is used for cutting off the lead wire. The pressing surface is configured for pressing the lead wire into the stripping slot, thus making the core in electrical connection with the at least one electronic component. | 12-08-2011 |
20110284162 | APPARATUS FOR WET PROCESSING SUBSTRATE - An exemplary apparatus for wet processing a substrate includes a conveyor configured for conveying the substrate along a conveying direction and parallel spray pipes. The spray pipes are substantially parallel with the conveyor and substantially perpendicular to the conveying direction. Each spray pipe consisting of at least one spray nozzle faces the conveyor, and the number of the at least one nozzle of each spray pipe increases along the conveying direction. | 11-24-2011 |
20110283534 | METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD - A method for manufacturing multilayer printed circuit board includes step below. A metal substrate is provide, the metal substrate includes a number of substrate unit. A first insulating layer is formed on one surface of the metal substrate. The first insulating layer has a number of first through holes. An electrically conductive circuit is formed in each substrate unit. A second insulating layer is formed on the other surface of the metal substrate. The second insulating layer has a number of second through holes. A first metal cylinder is formed in a first through hole and a second metal cylinder is formed in a second through hole. The number of substrate units are folded and laminated, the connected and aligned first metal cylinder and the second metal cylinder communicates the electrically conductive circuits. | 11-24-2011 |
20110274866 | INNER SUBSTRATE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS - An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. Each of the folding portions defines at least one groove in at least one side thereof along the at least one line of weakness. | 11-10-2011 |
20110269319 | PRINTED CIRCUIT BOARD MODULE - A PCB module includes a first rigid PCB having a first edge connector, a second rigid PCB having a second edge connector, and a connecting mechanism. The connecting mechanism includes a flexible connecting board, an elastic member, and a fixing member. The flexible connecting has a number of connecting circuit traces isolated from each other. The flexible connecting board is bent in such a manner that a first end portion is in contact with the first edge connector, and a second end portion is in contact with the second edge connector. Thus, the first edge connector is electrically connected with the second edge connector by the traces. The elastic member is compressed between the end portions of the flexible connecting board. The fixing member is configured to fix the first rigid PCB to the second rigid PCB and compress the elastic member. | 11-03-2011 |
20110253423 | PRINTED CIRCUIT BOARD WITH FINS AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes an insulating layer, a signal trace, a ground trace, and a fin. The insulating layer has a first surface and an opposite second surface. The signal trace and the ground trace are formed on the first surface of the insulating layer. The first fin is directly formed on the ground trace. Also provided is a method for manufacturing the printed circuit board. | 10-20-2011 |
20110247207 | METHOD FOR MANUFACTURING MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD - A method for manufacturing a multilayer FPCB which includes providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit being created so as to align with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas. | 10-13-2011 |
20110240215 | METHOD FOR MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD - A method for manufacturing a rigid-flexible printed circuit boards includes following steps. First, a first rigid substrate is attached to a first adhesive layer. Second, a first opening through the combined first rigid substrate and the first adhesive layer is defined. Third, the first rigid substrate is laminated to a flexible substrate, the flexible substrate includes an exposed portion exposed via the first opening. Fourth, a second rigid substrate is attached to a second adhesive, a glass transition temperature of the second adhesive layer being lower than that of the first adhesive layer. Fifth, a second opening through the combined first rigid substrate and the first adhesive layer is defined. Sixth, the second rigid substrate is laminated to the flexible substrate in such a manner that the flexible substrate is sandwiched between the first and second adhesive layers, the exposed portion is exposed in the first and the second openings. | 10-06-2011 |
20110239222 | SYSTEM AND METHOD OF DETERMINING APPLICABLE INSTALLATION INFORMATION OF APPARATUS - A computer and method obtains user input from an input device to determine applicable installation information of an apparatus according to resource consumption of the apparatus. The computer and method are capable of obtaining resource consumption information of an apparatus according to the installation material from an input device and operable to perform transformation processing to obtain installation data according to resource consumption information of the apparatus. Differences between the installation data and standard specifications are calculated and the specified standard specification corresponding to a difference which is the smallest number in the differences is found. The specified standard specification is outputted. | 09-29-2011 |
20110233052 | ELECTROPLATING APPARATUS - An electroplating apparatus includes an electroplating tank, a first supporting bar, a first holding element, two second supporting bars, a number of spaced crossbars, a number of second holding elements, and a power supply. The first holding element is suspended in the tank from the first supporting bar, and the first holding element is configured for holding a plate-shaped workpiece in a manner that the workpiece is oriented along the first supporting bar. The second holding elements are suspended from the corresponding crossbars, each of the second holding elements arranged between the first and one of the second supporting bars and configured for holding a metal block. The power supply includes a cathode for electrical connection to the workpiece through the first supporting bar and the first holding element and an anode for electrically connection to the metal blocks through the second supporting bars and the second holding elements. | 09-29-2011 |
20110230997 | SYSTEM AND METHOD FOR CUTTING SUBSTRATE INTO WORKPIECES - A computer obtains user input from an input to control a cutter and a conveyor to cut a substrate. The control module of the computer calculates a total number of cuts of the substrate and a distance that the substrate moves before each cut of the substrate according to user input. A conveyer control module of the computer controls the conveyer to move the substrate, where a reminder signal is sent out after the substrate has moved the distance. A cutter control module of the computer controls the cutter to cut the substrate. | 09-22-2011 |
20110226290 | APPARATUS FOR WET PROCESSING SUBSTRATE - An exemplary apparatus for wet processing a substrate includes a wet processing system and a water supplying system. The wet processing system includes a preliminary rinsing device, a final rinsing device, and a conveyor. The preliminary rinsing device includes a first tank and a first spraying system above the first tank. The final rinsing device includes a second tank and a second spraying system above the second tank. The conveyor is configured for conveying a substrate from the preliminary rinsing device to the final rinsing device. The water supplying system includes a supply pipe configured for supplying water to the second spraying system, a connecting system communicating the second tank and the first spraying system, and a drain pipe communicating with the first tank. | 09-22-2011 |
20110215069 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD WITH THICK TRACES - A method for manufacturing printed circuit board includes steps below. A first electrically conductive layer including a first surface and a second surface at an opposite side thereof to the first surface is provided. A number of first traces directly formed on the second surface. A first insulating layer is formed on the second surface of the first electrically conductive layer and the surface of the first traces. The electrically conductive layer is etched to form a number of second traces, the second traces superpose the first traces, the first traces and the second traces constitute a circuit pattern. | 09-08-2011 |
20110186423 | ELECTROPLATING APPARATUS - An exemplary electroplating apparatus includes an electroplating tank containing an electroplating solution and including a first side and a second side, a pay out reel arranged adjacent to the first side, a plurality of parallel anode plates in the electroplating solution, a plurality of first conveying rollers in the electroplating solution and adjacent to the first side of the electroplating tank, a plurality of second conveying rollers in the electroplating solution and adjacent to the second side of the electroplating tank, the conveying rollers arranged in a staggered fashion and aligned with the respective anode plates and being electrifiable to allow a current to flow through the flexible substrate, and a take up reel arranged adjacent to the second side. The conveying rollers cooperate to convey the flexible substrate from the pay out reel to the take up reel along a zigzag path. | 08-04-2011 |
20110186339 | PRINTED CIRCUIT BOARD WITH CARBON NANOTUBE BUNDLE - A printed circuit board includes a composite layer, a first electrically conductive pattern, and a second electrically conductive pattern. The composite layer includes a polymer matrix and an electrically conductive pin embedded therein. The polymer matrix has a first surface and an opposite second surface. The pin includes a catalyst block and a carbon nanotube bundle grown on the catalyst block. The catalyst block is exposed at the first surface, and the carbon nanotube bundle is exposed at the second surface. The first pattern is formed on the first surface, and includes a first electrical contact, which is electrically coupled to the catalyst block. The second pattern is formed on the second surface, and includes a second electrical contact, which is electrically coupled to the carbon nanotube bundle. | 08-04-2011 |
20110185871 | APPARATUS FOR CUTTING FOIL - An apparatus for cutting foil strip from a spool includes a holding device, a pulling unit, a cutting unit, a brake unit, a detection unit, and a controller. The supporting is configured for receiving the spool. The pulling unit, the cutting unit, the brake unit are fixed on the holding device. The pulling unit is configured for pulling the foil apart from the spool to the cutting unit. The cutting unit is configured for cutting the foil into pieces. The brake unit is mechanically coupled to the reel and configured for applying a resistance to the spool. The detection unit is mechanically connected with to the reel and configured for sensing the rotation number of the spool. The controller is electronically connected to the sensor and the brake unit and configured for controlling the resistance the brake unit applying to the spool according signal of the detection unit. | 08-04-2011 |
20110095464 | FLEXIBLE PRINTED CIRCUIT BOARD HOLDER - A holder for holding a flexible printed circuit board includes a main body and at least one securing member. The main body includes a hook portion and a holding member, wherein one of the securing member and the holding member comprises at least one magnet, and the other comprises at least one magnetic portion, at least one magnet or combination thereof such that the securing member capable of being magnetically attached to the holding member. | 04-28-2011 |
20110024042 | APPARATUS FOR WET PROCESSING SUBSTRATE - An exemplary wet processing apparatus includes a conveyor, a spraying system, and a suction system. The conveyor is configured for conveying a substrate. The spraying system includes an upper spraying conduit above the conveyor and an upper spraying nozzle mounted on the upper spraying conduit. The suction system includes a suction conduit and a suction nozzle connected to the suction conduit. The suction nozzle is adjacent to the conveyor and configured for suction the wet processing liquid sprayed on the substrate. The suction conduit is connected to the spraying conduit in such a manner that the flowing of the wet processing liquid in the upper spraying conduit can create a negative pressure in the suction conduit to enable the suction nozzle to suck the wet processing liquid on the substrate. | 02-03-2011 |
20100170639 | APPARATUS FOR WET PROCESSING SUBSTRATE - An exemplary apparatus for wet processing a substantially rectangular substrate includes a conveyor, a supporting mechanism, an adjusting mechanism, a processing module and a dosing system. The conveyor is configured for conveying the substrate to a wet process work station. The supporting mechanism is configured for supporting the substrate away from the conveyor. The adjusting mechanism is configured for adjusting the orientation of the substrate. The processing module is configured for obtaining an area of a surface of the substrate. The dosing system communicates with the processing unit, and is configured for dispensing a corresponding amount of wet processing liquid to the substrate to wet process the substrate according to the area of the surface of the substrate from the processing module. | 07-08-2010 |
20100139966 | INNER SUBSTRATE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS - An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. | 06-10-2010 |
20100129532 | METHOD FOR FORMING ELECTRICAL TRACES ON SUBSTRATE - A method for forming electrical traces on a substrate includes the steps of: providing a substrate; printing an ink pattern using an ink on the substrate, the ink including a aqueous medium containing silver ions and a heat sensitive reducing agent; heating the ink pattern to reduce silver ions into silver particles thereby forming an semi-finished traces; and forming a metal overcoat on the semi-finished traces by electroless plating thereby obtaining patterned electrical traces. | 05-27-2010 |
20100059910 | APPARATUS FOR RECYCLING METAL FROM METAL IONS CONTAINING WASTE SOLUTION - An apparatus for recycling metals from metal ions containing waste solution includes a conveying device, a reducing agent supplier and a solution supplier. The conveying device includes a first ferromagnetic conveyor belt, a first roller, and a second roller. The first and second rollers are substantially horizontally arranged, and the second roller is arranged at a lower position relative to the first roller and spaced from the first roller. The ferromagnetic conveyor belt is wrapped around the first and second rollers. The reducing agent supplier is used for supplying a reducing agent onto the first conveyor belt, the ferromagnetic conveyor belt is capable of conveying the reducing agent from the second roller to the first roller. The solution supplier is configured for supplying the waste solution onto the first conveyor belt. | 03-11-2010 |
20100051332 | CIRCUIT SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE ASSEMBLY HAVING SAME - A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer. | 03-04-2010 |
20100051331 | CIRCUIT SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE ASSEMBLY HAVING SAME - A circuit substrate for mounting electronic components includes a metal base layer, an electrically conductive layer having electrically conductive traces, and a composite layer disposed between the metal base layer and the electrically conductive layer. The composite layer includes a polymer matrix and a number of carbon nanotubes embedded in the polymer matrix. The composite layer has a first surface in contact with the metal substrate and an opposite second surface. Each of the carbon nanotubes extends from the first surface to the second surface inclined at an angle of from 80° to 100° relative to the first surface. | 03-04-2010 |
20100044237 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS - A method for manufacturing a PCB is related. The method includes providing a substrate with two opposite conductive layers and defining a through hole passing through the two conductive layers; forming a first electrically conductive metal layer on an inner surface of the substrate in the through hole using an electro-less plating process; forming a second electrically conductive metal layer on the first electrically conductive metal layer using an electro-plating process till the through hole being filled. | 02-25-2010 |
20100038116 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure. | 02-18-2010 |
20100035187 | METHOD FOR SMOOTHING PRINTED CIRCUIT BOARDS - A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a smooth region and a plurality of dimples; applying a liquid photoresist layer onto the second outer surface of the PCB to fill the dimples; solidifying the liquid photoresist in the dimples to obtain a solidified photoresist layer; polishing the solidified photoresist layer until a surface thereof being coplanar with the smooth region; and polishing the entire second outer surface until the solidified photoresist layer is removed, thereby obtaining a plain outer surface parallel to the first smooth outer surface. | 02-11-2010 |
20100021653 | METHOD OF FORMING ELECTRICAL TRACES ON SUBSTRATE - An exemplary method for forming electrical traces on a substrate includes flowing steps. Firstly, a circuit pattern is formed on the substrate by printing a silver ions-containing ink. The ink comprises an aqueous carrier medium, and a silver halide emulsion soluble in the aqueous carrier medium. Secondly, an irradiation ray irradiates the circuit pattern to reduce the silver ions into silver to form a silver particle circuit pattern comprised of silver particles. Thirdly, a metal overcoat layer is electroless-plated on the silver particle circuit pattern thereby obtaining electrical traces. | 01-28-2010 |
20100021652 | METHOD OF FORMING ELECTRICAL TRACES - A method of forming electrical traces includes the steps of: providing a substrate; printing an ink pattern using a silver containing ink on the substrate, the ink comprising an aqueous carrier medium having dissolved therein a water-soluble light sensitive silver salt; irradiating the ink pattern to reduce silver salt therein to silver particles thereby forming an underlayer; and electroless plating a metal overcoat layer on the underlayer thereby obtaining electrical traces. | 01-28-2010 |
20100018638 | METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD - A method for manufacturing a flexible printed circuit sheet (FPCB), comprising: providing a flexible copper clad laminate (FCCL), the FCCL comprising an insulating layer and a copper layer disposed thereon; providing a reinforcing sheet, the reinforcing sheet comprising a base and a binder layer attached thereon; attaching the FCCL onto the binder layer of the reinforcing sheet with the copper layer exposed; forming electrical traces in the copper layer, thus obtaining a FPCB substrate; and removing the FPCB substrate from the reinforcing sheet. | 01-28-2010 |
20100003784 | METHOD FOR MOUNTING ELECTRONIC COMPONENT ON PRINTED CIRCUIT BOARD - A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed. | 01-07-2010 |
20090314739 | WET PROCESSING SYSTEM AND WET PROCESSING METHOD - An exemplary system for processing a workpiece comprises a conveyor, a first liquid spraying device, a second liquid spraying device, and a substrate positioning device. The conveyor is configured for conveying the workpiece along a conveying direction. The first and second liquid spraying devices for spraying liquid onto the workpiece transported on the conveyor face the conveyor and are arranged along the conveying direction. The substrate positioning device for reorienting the workpiece on the conveyor is installed between the first and second liquid spraying devices and faces the conveyor. | 12-24-2009 |
20090304911 | METHOD OF FORMING CIRCUITS ON CIRCUIT BOARD - A method of forming a circuit on a circuit board includes the following steps. Firstly, a surface of an insulating substrate is hydrophilically treated. Secondly, a first circuit layer having a number of electrical traces is formed on the hydrophilically treated surface, the first circuit layer is comprised of a soluble palladium salt. Thirdly, the soluble palladium salt of the first circuit layer is reduced into metallic palladium, thereby obtaining a second circuit layer comprised of metallic palladium. Lastly, an electrically conductive layer is formed on the second circuit layer. | 12-10-2009 |
20090301763 | INK, METHOD OF FORMING ELECTRICAL TRACES USING THE SAME AND CIRCUIT BOARD - An exemplary ink for forming electrical traces includes a plurality of noble-metal-coated diacetylene vesicles formed by combining a noble-metal-ions-containing aqueous solution with diacetylenic monomers each including a hydrophilic group and a lipophilic group. The noble metal ions are attracted to an external surface of each of the diacetylene vesicles. | 12-10-2009 |
20090291230 | INK AND METHOD OF FORMING ELECTRICAL TRACES USING THE SAME - A silver-containing ink includes an aqueous carrier medium having both a silver salt and an amine sensitizer for the silver salt dissolved therein, and a light sensitive reducing agent dispersed in the aqueous carrier medium. The amine sensitizer includes at one or more amine group; and the light sensitive reducing agent is capable of reducing the silver in the silver-containing ink to silver particles when irradiated. | 11-26-2009 |
20090286006 | INK AND METHOD OF FORMING ELECTRICAL TRACES USING THE SAME - An exemplary ink for forming electrical traces includes an aqueous carrier medium, a palladium salt and a reducing agent. The palladium salt is capable of being dissolved in the aqueous carrier medium. The reducing agent is configured for reducing the palladium ions into palladium particles under an irradiation ray. | 11-19-2009 |
20090277680 | INSULATING FILM, PRINTED CIRCUIT BOARD SUBSTRATE AND PRINTED CIRCUIT BOARD INCLUDING SAME - An insulating film includes a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer. The electromagnetic shielding layer includes a number of carbon nanotube films that are substantially parallel to the first and second polymer layer. Each of the carbon nanotube films includes a number of carbon nanotubes that are substantially parallel to each other. The insulating film can provide anti-EMI effect in printed circuit boards without employing additional electromagnetic shielding layers. | 11-12-2009 |
20090260867 | PRINTED CIRCUIT BOARD SUBSTRATE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS USING SAME - A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the circuit substrates is oriented 360/N degrees with respect to a neighboring printed circuit board. | 10-22-2009 |
20090246357 | METHOD OF FORMING CIRCUITS ON CIRCUIT BOARD - A method of forming a circuit on a circuit board includes the steps of: forming a first circuit pattern made of a nano-scale metal oxide material on a surface of an insulating substrate; reducing the nano-scale metal oxide material into a nano-scale deoxidized metal material, thus obtaining a second circuit pattern; and forming an electrically conductive metal layer on the second circuit pattern. | 10-01-2009 |
20090242246 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles. | 10-01-2009 |
20090241333 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD HAVING DIFFERENT THICKNESSES IN DIFFERENT AREAS - A method for manufacturing a printed circuit board (PCB) having different thicknesses in different areas includes: providing a first substrate having two lateral unwanted portions bounded two imaginary boundary lines, a binder layer having a through opening and a second substrate having a mounting area for mounting electronic elements; forming two slots bounded the imaginary boundary lines in an intermediated unwanted portion of the first substrate corresponding to the mounting area; laminating the first and second substrates, and the binder layer with the mounting area exposed via the through opening; filling the two slots and the through opening with a filling material, thereby obtaining a semifinished PCB board; cutting the semifinished PCB board along the imaginary boundary lines to remove the two lateral unwanted portions and a portion of the second substrate corresponding to the two lateral unwanted portions; and removing the intermediate unwanted portion and the filling material. | 10-01-2009 |
20090217520 | METHOD FOR FORMING SOLDER LUMPS ON PRINTED CIRCUIT BOARD SUBSTRATE - In this present invention, a method for forming solder lumps on printed circuit board (PCB) substrate is provided. A PCB substrate including a number electrical traces and solder pads formed on a substrate surface thereof is provided. A liquid photoresist is applied onto the PCB substrate such that a photoresist layer defining a number of openings thereof is formed and each of the solder pads is exposed via each of the openings. A solder masses are filled into each of the openings. The solder masses are reflowed and the photoresist layer is removed. | 09-03-2009 |
20090205855 | STIFFENER SHEET AND FLEXIBLE PRINTED CIRCUIT BOARD USING THE SAME - A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: | 08-20-2009 |
20090183823 | METHOD FOR MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD - A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained. | 07-23-2009 |
20090176080 | STIFFENER AND STRENGTHENED FLEXIBLE PRINTED CIRCUIT BOARD HAVING THE SAME - An exemplary stiffener includes at least one polyethylene naphthalate layer. The at least one polyethylene naphthalate layer is represented by the following formula: | 07-09-2009 |
20090175713 | BOARD INVERTER - The present invention relates to a board inverter and a boarding inverting system. The board inverter includes a support, a first board picking device, an second board picking device and a controller. Each of the first board picking device and the second board picking device includes a driving mechanism and a first board picking device. The driving mechanism comprises a first linear driving means mounted on the support, a second linear driving means mechanically coupled to the first linear driving means, and a rotary driving means attached to the second linear driving means. The controller is connected to all the power supply members. The controller controls the motion of the first board picking device and the second board picking device such that the first board picking device and the second board picking device cooperatively inverting workpieces transmitted on a production line. The board inverter can be installed on a production line without altering the arrangement of existing production line. | 07-09-2009 |
20090166063 | STIFFENER AND STRENGTHENED FLEXIBLE PRINTED CIRCUIT BOARD HAVING THE SAME - An exemplary stiffener includes at least one polyimide layer and at least one polyetherimide layer adhered to the at least one polyimide layer. The at least one polyetherimide layer is represented by the following general formula: | 07-02-2009 |
20090159559 | METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD HAVING BURIED HOLES - A method for manufacturing a multilayer printed circuit board includes the following steps. A number of laminate units are provided. Each of the laminate units includes an electrically conductive layer with a circuit pattern defined therein, and a release layer releasably attached to the electrically conductive layer. A number of insulation layers are provided. Each of the insulation layers definies a metalized through hole therein. The electrically conductive layers and the insulation layers are stacked alternately one on another such that adjacent electrically conductive layers are insulated by one insulation layer and the metalized through holes electrically connects the circuit patterns of the adjacent electrically conductive layers. In the stacking step, the release layer is removed from the laminate unit after the electrically conductive layer is stacked onto the respective insulation layer, thereby obtaining a pre-laminated multilayer printed circuit board. The stacked electrically conductive layers and the insulation layers are laminated together to achieve a multilayer printed circuit board. | 06-25-2009 |
20090159452 | ELECTROPLATING METHOD - An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer. | 06-25-2009 |
20090159317 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - An exemplary method for manufacturing printed circuit boards is provided. In the method, a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface is provided. A number of through holes in the substrate between the first surface and the second surface are formed. An electrically conductive paste is applied to the substrate to fill the through holes defined in the substrate to form a plurality of filling members and be printed on at least one of the first surface and the second surface of the substrate to form a number of electrical traces. The filling members located in the through hole in the substrate and the electrical traces printed on the substrate are cured. | 06-25-2009 |
20090139086 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - The present invention relates to a method for manufacturing printed circuit boards. A substrate including a base and two conductive layers on two opposite surfaces of the base is provided. A through-hole passing through the base and the conductive layers is defined in the substrate. A metal layer is formed on the substrate. The metal layer has a first portion on an outer surface of the substrate and a second portion on an inner surface in the through-hole thereof. A protecting material is applied onto the metal layer in the through-hole, an unwanted section of the first portion of the metal layer is removed. Electrical traces in each of the conductive layers are formed. | 06-04-2009 |
20090120671 | FPCB SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A flexible printed circuit board substrate includes an electrically conductive layer, an insulation layer, and a hook. The electrically conductive layer has a first surface and a second surface at an opposite side thereof to the first surface. The insulation layer having a third surface and a fourth surface at an opposite side thereof to the third surface. The third surface of the insulation layer combines with the second surface of the electrically conductive layer. A through hole is defined in the electrically conductive layer and the insulation layer extending from the first surface of the electrically conductive layer to the fourth surface of the insulation layer. The hook extends from the electrically conductive layer and passes through the through hole to protrude from the fourth surface of the insulation layer. | 05-14-2009 |
20090107706 | MULTILAYER PRINTED CIRCUIT BOARD - A multilayer printed circuit board includes a first printed circuit board, a second printed circuit board, an adhesive film, and a function layer. The adhesive film is sandwiched between the first printed circuit board and the second printed circuit board. The function layer is disposed between the first printed circuit board and the second printed circuit board for blocking water from passing therethrough and for screening electromagnetic interference between the first printed circuit board and the second printed circuit board. | 04-30-2009 |
20090088881 | SIMULATION SYSTEM AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - An exemplary simulation system for manufacturing a printed circuit board is provided. The simulation system includes at least one simulation sub-system. The simulation sub-system includes an input module, a storing module, a processing module, and an output module. The input module is configured for acquiring a number of processing parameters associated with steps of a process for manufacturing the printed circuit board. The storing module is configured for storing a number of simulation functions relating to the steps of the process for manufacturing the printed circuit board. The processing module is configured for selecting and performing the corresponding simulation function according to the acquired parameters, thereby obtaining a simulation result. The output module is configured for output the simulation result. | 04-02-2009 |
20090056624 | FLUID CIRCULATING SYSTEM FOR MANUFACTURING PRINTED CIRCUIT BOARD - An exemplary fluid circulating system includes a return pipe, a reservoir, a suction pipe, a supply pipe, a circulating pump, and a processing device. The reservoir is configured for containing a work fluid. The processing device is configured for processing a semi-finished printed circuit board using the work fluid. The circulating pump is configured for transferring the work fluid from the reservoir to the processing device. The suction pipe and the supply pipe are respectively coupled to an inlet and the outlet of the circulating pump. An inner diameter of the suction pipe is larger than that of the supply pipe. The return pipe is coupled to the processing device for delivering the work fluid from the processing device to the reservoir. The fluid circulating system can improve quality of the circulated work fluid. | 03-05-2009 |
20090050677 | METHOD OF WELDING ELECTRONIC COMPONENTS ON PCBS - An exemplary method of welding electronic components on PCBs is disclosed. Firstly, a metal tray including a number of supporting areas is provided. At least one through hole is formed in each of the supporting areas. Secondly, solder pastes are applied onto welding pads of PCBs. Thirdly, electronic components are mounted on the welding pads. Fourthly, PCBs are placed on the metal tray in a manner that each printed circuit board is placed in a corresponding supporting area and the welding pads being above the through hole. Finally, the solder pastes are heated to weld the electronic components on the printed circuit board. By doing so, the heat can pass through the through holes in each supporting area directly and fully melt the solder paste. As a result, welding defects can be reduced. | 02-26-2009 |
20090050600 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS - An exemplary method for manufacturing printed circuit boards is provided. In the method, a copper clad substrate having a copper layer thereon is provided. A surface of the copper layer is roughened by applying an atmospheric pressure plasma thereto. A photoresist layer is formed on the roughened surface of the copper layer. The photoresist layer is exposed. The photoresist layer is developed to form a patterned photoresist layer, thereby exposing portions of the copper layer. The exposed portions of the copper layer exposed are removed so that the remaining portions of the copper layer form electrical traces. The patterned photoresist layer is removed. | 02-26-2009 |
20090050354 | PRINTED CIRCUIT BOARD SUBSTRATE AND PRINTED CIRCUIT BOARD HAVING THE SAME - A printed circuit board substrate includes an insulation matrix and a waterproof layer. The insulation matrix includes a first surface and a second surface at an opposite side thereof to the first surface. The waterproof layer is formed in the insulation matrix and is arranged between the first surface and the second surface for blocking water from passing therethrough in a thicknesswise direction of the insulation matrix. | 02-26-2009 |
20090047421 | METHOD FOR PLATING FLEXIBLE PRINTED CIRCUIT BOARD - A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board. | 02-19-2009 |
20090045151 | APPARATUS FOR HOLDING PRINTED CIRCUIT BOARDS - In one embodiment, a holder for holding printed circuit boards includes a base plate with a plurality of holding unit formed thereon. Each of the holding units includes a spring member, a securing member, and a blocking structure. The spring member includes a first end and a second end. The first end is attached to the base plate. The securing member is slideably mounted on the base plate. The securing member includes a connecting end and a securing end. The connecting end is connected with the second end of the spring member. The blocking structure is located on the base plate. The spring member is configured for pressing the securing member to move toward the blocking structure such that a printed circuit board is retainable between the securing end of the securing member and the blocking structure on the base plate. The holder is capable of holding printed circuit boards in batches. | 02-19-2009 |
20090042370 | METHOD OF CUTTING PCBS - The present invention relates to a method of cutting PCB module using a laser. The method includes steps of: providing a coverlay film, the coverlay film including at least one opening defined therein; attaching the coverlay film onto the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting area thereof is exposed via the at least one opening; applying a laser beam to the exposed laser cutting area of the PCB module to cutt the PCB module; and removing the coverlay film. A high positioning precision of the PCB module and better cutting result can be obtained. | 02-12-2009 |
20090039895 | METHOD OF DETECTING FAULTY VIA HOLES IN PRINTED CIRCUIT BOARDS - A method of detecting faulty via holes of a printed circuit board. The printed circuit board including a number of electric trace segments. The method includes steps of: providing a testing system, the testing system comprising a processor, a storing means and a resistance measuring device, the storing means for storing a function Y | 02-12-2009 |
20090039053 | METHOD FOR MANUFACTURING ELECTRICAL TRACES OF PRINTED CIRCUIT BOARDS - An exemplary method for manufacturing a printed circuit board is provided. Firstly, a copper clad substrate comprising a base film, a copper layer and intermediate layer interposed between the base film and the copper layer is provided. The intermediate layer is comprised of nickel, chromium, or alloy of nickel and chromium. A patterned photoresist layer is formed on the copper layer with portions of the copper layer are exposed from the photoresist pattern layer. Exposed portions of the copper layer are removed using a copper etchant to form a number of electrical traces, thereby exposing portions of the intermediate layer from the patterned photoresist layer. Exposed portions of the intermediate layer are removed using a chromium-nickel etchant. The method can prevent a bottom of each of electrical traces from enlarging, thereby improving quality of printed circuit board. | 02-12-2009 |
20090038828 | FLEXIBLE PRINTED CIRCUIT BOARD SUBSTRATE AND FLEXIBLE PRINTED CIRCUIT BOARD FABRICATED USING THE SAME - The present invention relates to a flexible printed circuit board substrate and FPCB made from the flexible printed circuit board substrate. In one embodiment, a flexible printed circuit board substrate includes a dielectric layer, a rolled copper foil and an electroplated copper foil disposed on two opposite surfaces of the dielectric layer respectively. The contact fingers are made from electroplated copper foil, as a result, the contact fingers are stronger than that made from rolled copper foil. Furthermore, electroplated copper foils are cheaper than rolled copper foils. | 02-12-2009 |
20090035566 | ADHESIVE LAYER AND PRINTED CIRCUIT BOARD ASSEMBLY HAVING THE SAME - An exemplary adhesive layer includes an adhesive main body having a first adhesive surface and a second adhesive surface on an opposite side of the adhesive main body to the first adhesive surface. The adhesive main body defines a number of through-holes between the first adhesive surface and the second adhesive surface therein. The through-holes are filled with an inner adhesive that has a higher adhesion than the adhesive main body. Adhesiveness of the first adhesive surface and the second adhesive surface of the adhesive main body can be improved, thereby preventing a printed circuit board having the adhesive layer from distortion. | 02-05-2009 |
20090033925 | VISUAL INSPECTION APPARATUS FOR FLEXIBLE PRINTED CIRCUIT BOARDS - An exemplary visual inspection apparatus for a flexible printed circuit board includes a frame, an inspection station, a control system, a roller system and a power system. The inspection station is disposed on the frame. The inspection station has an inspection surface for placing the flexible printed circuit board thereon for visual inspection. The roller system includes a first roller for unwinding a flexible printed circuit board therefrom and a second roller for winding up the flexible printed circuit board therearound. The power system includes a driving device and a braking device. The driving device includes a torque motor engaging with the second roller to drive the second roller to roll. The braking device includes a detent engaging with the first roller to stop rolling of the first roller. The control system electrically connects to the power system for controlling the power system. | 02-05-2009 |
20090032290 | FLEXIBLE PRINTED CIRCUIT BOARD BASE FILM, FLEXIBLE LAMINATES AND FLEXIBLE PRINTED CIRCUIT BOARDS INCLUDING SAME - A flexible printed circuit board base film for flexible printed circuit boards includes a sheet of flexible polymer matrix and a number of carbon nanotube bundles embedded in the polymer matrix. Each of the nanotubes bundles are spaced apart from each other. The flexible polymer matrix includes a first surface and a second surface. Due to the high thermal conductivity of carbon nanotubes, heat can be efficiently conducted from the first surface to the second surface of the flexible printed circuit board base film. The present invention also provides a flexible laminate made from the flexible printed circuit board base film and a flexible printed circuit boards made from the flexible laminate. | 02-05-2009 |
20090031561 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - A method for manufacturing a hollowed printed circuit board includes steps of: providing an electrically conductive layer; laminating a first dielectric layer having a first through opening defined therein on a first surface of the electrically conductive layer; forming a protecting layer on the first surface of the electrically conductive layer in the first opening; creating an electrically conductive pattern in the conductive layer; removing the protecting layer; and laminating a second dielectric layer having a second through opening defined therein on an opposite second surface of the electrically conductive layer in a manner that the first through opening is aligned with the second through opening, thereby a portion of the electrically conductive layer is exposed to exterior through the first through opening and the second through opening. | 02-05-2009 |
20090027072 | APPARATUS FOR TESTING CHIPS WITH BALL GRID ARRAY - An exemplary an apparatus for testing chips with ball grid array comprised of a number of solder balls is provided. The apparatus includes a main printed circuit board, a supporting board and a testing device. The main printed circuit board has a edge connector. The supporting board defines a number of electrically conductive through holes arranged in an array corresponding to the ball grid array. One end of each of the electrically conductive through holes is configured for electrically connection to the main printed circuit board, the other end of the electrically through holes is configured for receiving and electrically connecting the corresponding solder ball of the ball grid array. The testing device has a socket connector for insertion of the edge connector therein. The testing device is configured for testing the chip. | 01-29-2009 |
20090025582 | SCREEN PRINTING METHOD FOR PRINTING A PRINTED CIRCUIT BOARD - An exemplary screen printing method for printing a printed circuit board is provided. The printed circuit board includes a number of parallel electrical traces. In the method, firstly, a screen printing stencil is disposed on a side of the printed circuit board having the electrical traces and a squeegee is disposed on the screen printing stencil. Secondly, the squeegee is drawn across the screen printing stencil in a manner such that an angle between a blade of the squeegee and the electrical traces is in a range from 20 degrees to 70 degrees so as to print an ink on the printed circuit board. The method can improve quality of the printed circuit board. | 01-29-2009 |
20090014204 | FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board includes a base and a coverlay. The base includes a main portion and a distal portion connecting with the main portion. The distal portion has a first part and a second exposed part. The coverlay is formed on the base and covers the main portion and the first part of the distal portion. The second exposed part of the distal portion is uncovered by the coverlay. The coverlay includes a curved edge serving as an interface between the first part and second part of the distal portion. | 01-15-2009 |
20090014031 | CLEANING APPARATUS - The present invention relates to a cleaning apparatus for printed circuit board. The cleaning apparatus includes a base, a clamping plate fixed to the base, at least one holding member, at least one cleaning roller, and a driving mechanism. The holding member is elastically supported on the base. The at least one cleaning roller is pivotably disposed on the at least one holding member respectively. The cleaning roller includes a cleaning layer attached to a surface of the cleaning roller. The clamping plate is opposite to and departs from the cleaning roller at a distance. The driving mechanism is coupled to the cleaning roller and configured for driving the cleaning roller to rotate. The cleaning apparatus can clean printed circuit board high efficiently. | 01-15-2009 |
20090013929 | PLATING APPARATUS - A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material. | 01-15-2009 |
20090013526 | INNER SUBSTRATE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS AND METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS USING THE SAME - An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. An exemplary method for manufacturing multilayer printed circuit boards using the inner substrate is also provided. The method can improve efficiency of manufacturing multilayer printed circuit boards. | 01-15-2009 |
20090011186 | FLEXIBLE BASE FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARDS - A flexible base includes a main region configured for forming flexible printed circuit board units; and two conveying regions respectively arranged on two sides of the main region. Each of the conveying regions includes an insulating substrate, a plurality of sprocket holes, and a patterned supporting layer. The sprocket holes are defined along a lengthwise direction of the insulating substrate. The patterned supporting layer is formed on the insulating substrate. The patterned supporting layer extends from an edge of each sprocket hole towards a periphery region of the corresponding sprocket. | 01-08-2009 |
20090007421 | METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARDS - An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form. | 01-08-2009 |
20090001641 | FLEXIBLE PRINTED CIRCUIT BOARD HOLDER - In one embodiment, a holder for holding a flexible printed circuit board includes a main body and at least one securing member. The main body includes a hook portion and a holding member, wherein one of the securing member and the holding member comprises at least one magnet, and the other comprises at least one magnetic portion, at least one magnet or combination thereof such that the securing member capable of being magnetically attached to the holding member. | 01-01-2009 |
20090000115 | SURFACE MOUNTING APPARATUS AND METHOD - An exemplary method for surface mounting an electronic component onto a pad of a printed circuit board is provided. The electronic component and the printed circuit board are located onto a platform. An outline image of the electronic component is captured using a first image sensing device. Coordinates of a geometrical center of the electronic component are determined using a central processing device. An outline image of the pad is captured using a second image sensing device. Coordinates of a geometrical center of the pad are determined using the central processing device. The electronic component is moved onto the pad using a picking-up/placing device according to the coordinate of the geometrical center of the electronic component and the coordinate of the geometrical center of the pad. The electronic component can be registered with the pad exactly using the method. | 01-01-2009 |
20080314719 | COVERLAY PROCESSING SYSTEM - A coverlay processing system includes a processing device and a conveyance device. The conveyance device is configured for moving the coverlay to the process device. The conveyance device includes a pulling member, a first securing member, a detector and a controller. The pulling member is configured for driving the coverlay. The first securing member is configured for stopping moving the coverlay. The detector is configured for detecting a moving state of the coverlay and is connected to the controller. The controller is connected to the processing device for managing the operation of the processing device. | 12-25-2008 |
20080308042 | APPARATUS FOR PLASMA-PROCESSING FLEXIBLE PRINTED CIRCUIT BOARDS - The present invention relates to an apparatus for plasma-processing of flexible printed circuit boards (FPCBs). The apparatus includes a plasma-discharging chamber, two electrodes arranged in the chamber for generating plasma in the chamber, a frame, and two elongated holding arms disposed on the frame. The frame includes a number of spaced parallel first bars and a number of spaced parallel second bars. The first bars intersecting with the second bars. The elongated holding arms are substantially parallel with each other. Each of the arms has an inner sidewall. The inner sidewalls of the elongated holding arms are opposite to each other. An elongated recess is defined in each of the inner sidewalls proximate to the frame. The apparatus can ensure uniform plasma-processing and protect FPCBs from being burned. | 12-18-2008 |
20080302258 | SCREEN PRINTING STENCIL AND METHOD FOR MANUFACTURING THE SAME - An exemplary screen printing stencil includes a frame, a screen mesh and a metal foil. The screen mesh is stretched tightly in the frame. The metal foil is attached on a surface of the screen mesh. A screen printing pattern is defined on the metal foil by a laser machining process. A machining tolerance of the screen printing pattern is either in a range from 0.005 to 0.02 millimeters or in a range from −0.02 to −0.005 millimeters. The screen printing stencil can be used in a screen printing process of manufacturing a printed circuit board, thereby improving quality of the printed circuit board. | 12-11-2008 |
20080302257 | LEGEND PRINTING STENCIL AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS USING THE SAME - An exemplary legend printing stencil for printing a circuit substrate for manufacturing a number of printed circuit board is provided. The stencil includes at least a first printing portion, at least a second printing portion and a junction portion between the first printing portion and the second printing portion. The first printing portion and the second printing portion each define a number of legend holes therein. The first printing portion and the second portion are configured for attaching on and covering the corresponding circuit board unit of the circuit substrate to print legends on the circuit board unit. The junction portion defines a slot therein and is configured for attaching on and covering the corresponding connection portion of the circuit substrate to print a legend ink layer on the connection portion. A method for manufacturing a number of printed circuit boards using the stencil is also provided. | 12-11-2008 |
20080286122 | GAS-DRIVEN LIQUID PUMP - A gas-driven liquid pump includes a gas source, a tank, a pumping pipe, at least one gas conveying pipe, and at least one liquid conveying pipe. The pumping pipe includes a gas input end, a liquid output end and a suction portion located between the gas input end and the liquid output end. An inner diameter of the pumping pipe gradually decreases from the gas input end to the suction portion, and the inner diameter of the pumping pipe gradually increases from the suction portion to the liquid output end. At least one gas conveying pipe is configured for connecting the gas source and the gas input end of the pumping pipe. One end of the liquid conveying pipe is connected to the tank, and another end is engaged with the suction portion of the pumping pipe. | 11-20-2008 |
20080285241 | FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed on the flexible base. The working trace is formed by a number of working traces. In the flexible base, the at least one reinforcement trace is disposed at a periphery of the working trace region. | 11-20-2008 |
20080283289 | PRINTED CIRCUIT BOARDS - The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a first end and a second end. The first end is connected to the first conductive portion; the second end is connected to the second conductive portion. A width of the connecting portion gradually decreases from the first end to the second end. Reflection and cross talk of signals transmitted in the presented printed circuit board can be reduced. | 11-20-2008 |
20080266819 | MOUNTING SUPPORT FOR A FLEXIBLE PRINTED CIRCUIT BOARD AND RETAINING APPARATUS HAVING THE SAME - An exemplary mounting support for a flexible printed circuit board is provided. The flexible printed circuit board has a side surface and at least one electronic component mounted on the side surface. The mounting support includes a first surface for contacting with the side surface of the flexible printed circuit board and a second surface on an opposite side of the mounting support to the first surface. The mounting support has at least one first recess defined in the first surface for receiving the at least one electronic component therein and at least one through-hole defined through the first surface and the second surface. The mounting support has at least one second recess defined in the second surface. The mounting support can fix a double surface mounted flexible printed circuit board flatly, thereby enhancing laser processing precision. | 10-30-2008 |
20080264675 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - An exemplary method for manufacturing a printed circuit board is provided. In the method, firstly, a circuit substrate having a substrate and a number of soldering pads is provided. Secondly, a protective layer is formed onto the circuit substrate in a manner such that the soldering pads are entirely covered by the protective layer. Fourthly, a laser beam is applied onto portions of the protective layer spatially corresponding to the soldering pads in a manner such that the portions of the protective layer is removed, thereby exposing the soldering pads to an exterior. A printed circuit board having a protective layer with high precision of resolution is also provided. | 10-30-2008 |
20080250637 | METHOD FOR MANUFACTURING MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD - A method for manufacturing a multilayer FPCB includes the steps of: providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit is configured to be aligned with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas. | 10-16-2008 |
20080248258 | MOUNTING SUPPORT FOR RETAINING A FLEXIBLE PRINTED CIRCUIT BOARD - An exemplary mounting support for retaining a flexible printed circuit board is provided. The flexible printed circuit board has a first portion and a second portion. A thickness of the first portion is greater than that of the second portion. The mounting support includes a supporting platform and an adhesive layer disposed on the supporting platform. The adhesive layer includes a first adhesive portion mating with the first portion, and a second adhesive portion mating with the second portion. A thickness of the first adhesive portion is less than that of the second adhesive portion. A thickness difference between the first adhesive portion and the second adhesive portion is equal to a thickness difference between the first portion and the second portion. | 10-09-2008 |
20080230168 | LAMINATOR AND LAMINATING METHOD - A laminator is configured for laminating a film sheet on a respective surface of a plurality of substrates. The laminator includes a pressure roller, a first conveyance device, a second conveyance device, and a distance measuring system. The first conveyance device is provided for controllably conveying substrates to the pressure roller. The second conveyance device is provided for controllably conveying substrates to the first conveyance device. The distance measuring system is provided for measuring a space between the substrate on the first conveyance device and the sequential substrate on the second conveyance device, adjacent to the first substrate. | 09-25-2008 |