MEC COMPANY LTD. Patent applications |
Patent application number | Title | Published |
20150115196 | MICROETCHING SOLUTION FOR COPPER, REPLENISHMENT SOLUTION THEREFOR AND METHOD FOR PRODUCTION OF WIRING BOARD - Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount. | 04-30-2015 |
20120312784 | SURFACE ROUGHENING AGENT FOR ALUMINUM, AND SURFACE ROUGHENING METHOD USING SAID SURFACE ROUGHENING AGENT - Provided are a surface roughening agent for aluminum and a surface roughening method using said surface roughening agent wherein it is possible to easily reduce costs for the surface roughening step and to improve the adhesiveness between aluminum and a resin. Specifically, provided is a surface roughening agent for aluminum comprising an aqueous solution containing: an alkali source, an amphoteric metal ion, a nitrate ion, and a thio compound. Moreover, provided is a surface roughening method for aluminum which involves a surface roughening step in which the surface of aluminum is treated with the aforementioned surface roughening agent. | 12-13-2012 |
20120260821 | COATING-FORMING LIQUID COMPOSITION AND COATING-FORMING METHOD THEREWITH - Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25° C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating. | 10-18-2012 |
20100236690 | METHOD FOR FORMING A LAMINATE - The method for forming a laminate of the present invention is a method for forming a laminate, comprising a silane coupling agent treatment step of applying an aqueous solution of a silane coupling agent onto a surface of a metal layer, and drying the resultant applied film to form a silane coupling agent coating, and a lamination step of laminating a resin layer on the silane coupling agent coating, these steps being continuously performed, wherein when the formed silane coupling agent coating is analyzed in the silane coupling agent treatment step by FT-IR with a reflection absorption spectrometry and then the peak area of Si—O is turned to a value less than a predetermined threshold value, at least one part of the aqueous solution of the silane coupling agent is renewed, thereby conducting the silane coupling agent treatment while the peak area is controlled into a predetermined range. | 09-23-2010 |
20100108531 | ADHESIVE LAYER FORMING LIQUID AND ADHESIVE LAYER FORMING PROCESS - The object of the invention is to provide an adhesive layer forming liquid capable of maintaining the performance of forming an adhesive layer easily and keeping adhesive property to a resin certainly, and an adhesive layer forming process using the liquid. The adhesive layer forming liquid of the invention is an adhesive layer forming liquid for forming an adhesive layer for bonding a copper and a resin to each other, which is an aqueous solution comprising an acid, a stannous salt, a stannic salt, a complexing agent, and a stabilizer, and which is prepared to set the value of B/A to 0.010 or more and 1.000 or less at the time of the preparation, wherein A represents the concentration (unit: % by mass) of the stannous salt as the concentration of bivalent tin ions, and B represents the concentration (unit: % by mass) of the stannic salt as the concentration of tetravalent tin ions. | 05-06-2010 |
20100029969 | COPPER COMPOUND AND METHOD FOR PRODUCING COPPER THIN FILM USING THE SAME - The present invention provides a copper compound having a decomposition temperature in a range of 100° C. to 300° C. and including one unit or a plurality of connected units represented by the following Formula (1): | 02-04-2010 |
20100000971 | ADHESIVE LAYER FORMING LIQUID - An object of the present invention is to provide an adhesive layer forming liquid about which deterioration in adhesive-layer-forming capability with the passage of time can be restrained and further the smoothness of an adhesive layer surface can be certainly kept. The adhesive layer forming liquid of the present invention is an adhesive layer forming liquid, which is a liquid for forming an adhesive layer for bonding copper and a resin to each other, and which is an aqueous solution comprising an acid, a stannic salt, a complexing agent, a stabilizer, and a complexing restrainer for restraining a complexing reaction between the complexing agent and copper. | 01-07-2010 |
20090197109 | ELECTROCONDUCTIVE LAYER, LAMINATE USING THE SAME, AND PRODUCING PROCESSES THEREOF - The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 μm. | 08-06-2009 |
20080261020 | Adhesive layer for resin and a method of producing a laminate including the adhesive layer - An adhesive layer for resin according to the present invention is formed of copper or a copper alloy for adhering a resin to a layer of copper or a copper alloy. The adhesive layer is formed of a metal layer of a coralloid structure made of an aggregation of a number of particles of copper or a copper alloy with gaps between the particles, and a plurality of micropores are present on the surface. The micropores have an average diameter in a range of 10 nm to 200 nm, and at least two micropores in average are present per 1 μm | 10-23-2008 |