CREE, INC. Patent applications |
Patent application number | Title | Published |
20160096296 | APPARATUS AND METHOD FOR FORMATION OF MULTI-REGION ARTICLES - An injection-molding apparatus for article formation. The injection-molding apparatus includes a single mold base supporting at least one grouping of a plurality of shape-forming configuration sets. Each set includes at least one cavity and is shaped for forming one of first-formed, intermediate-formed and last-formed regions of the article in the cavities by a corresponding one of injection-molding shots. Each cavity retains each article region formed by the preceding injection-molding shot(s). The single mold base includes a movable part which moves internally within the single mold base with respect to a stationary part such that relative positions of the shape-forming configurations are advanced for each set to form a subsequent article region in the cavities. Each subsequent injection-molding shot may at least partially over-mold the article region formed in the preceding shot. Each subsequent shot may be prior to full cooling of the article region formed in the previous shot. | 04-07-2016 |
20160061416 | ONE-PIECE MULTI-LENS OPTICAL MEMBER WITH ULTRAVIOLET INHIBITOR AND METHOD OF MANUFACTURE - An LED light fixture includes a heat-sink, a circuit board thereon with a plurality of spaced LED light sources, and a one-piece optical member with a plurality of secondary lenses over corresponding LED light sources and having a lens flange surrounding the lenses and integral with each lens. The optical member includes a polymeric carrier portion surrounding the lenses, overlapping with and molded onto the lens flanges across such overlapping, and extending therefrom to a peripheral edge portion. The optical member has an outer surface infused with an ultraviolet inhibitor to increase long-term weathering performance. The infused outer surface includes an outer layer of each lens and extends to form an outer layer of the lens flanges and therebeyond to form an outer layer of the carrier portion. The invention also includes a method of manufacturing such infused optical member. | 03-03-2016 |
20160047528 | LED LENS - A lens for primarily forward distribution of light from a light emitter which has an emitter axis in a front-to-back centerplane. The lens has a base surface which is adjacent the emitter and forms a light-entrance opening, an inner surface which defines a light-receiving cavity and includes front and back regions extending from the light-entrance opening, and an outer surface which has front and back regions adjoined by a middle region. The back region includes a back portion configured for forward total internal reflection (TIR) of rearward light received from the inner surface. The back portion extends transverse to the front-to-back centerplane away from the base surface from positions which are closer to the base surface than the innermost cavity region and terminates with a distal end which is closer to the base surface than outermost positions of the front region. The back portion terminates laterally at positions closer to the front-to-back centerplane than lateral edges of the light-entrance opening and, in the front-to-back centerplane, the emitter axis is no farther from the back portion of the outer surface than from a back edge of the light-entrance opening. | 02-18-2016 |
20150351191 | WALL CONTROLLER CONTROLLING CCT - A wall controller that is used for controlling CCT is disclosed. A user input interface allows a user to provide a CCT parameter by pressing a button, entering a value, or the like. The user output interface can provide the user with an indication of a CCT level, which may represent an actual or current CCT level, a maximum or minimum CCT level setting, or the like for an associated lighting fixture. The communication interface facilitates communications with the associated lighting fixture. The control circuitry is configured to receive user input via the user interface; send a signal based on the user input toward the lighting fixture via the communication interface; and control the user output interface to provide the indication of the CCT level. The signal based on the user input may be indicative of an increase or decrease in CCT level, a specific CCT level, or the like. | 12-03-2015 |
20150351187 | LIGHTING FIXTURE PROVIDING VARIABLE CCT - The present disclosure relates to a lighting fixture that is capable of providing white light over an extended range of correlated color temperatures. | 12-03-2015 |
20150351169 | DIGITALLY CONTROLLED DRIVER FOR LIGHTING FIXTURE - The present disclosure relates to a lighting fixture that is capable of providing white light over an extended range of correlated color temperatures. | 12-03-2015 |
20150349727 | BANDWIDTH LIMITING METHODS FOR GAN POWER TRANSISTORS - A transistor package includes a transistor and one or more bandwidth limiting matching networks. The one or more bandwidth limiting matching networks are coupled to one of a control contact and an output contact of the transistor in order to limit the gain response of the transistor outside of a predetermined frequency band. Specifically, the transistor package has a gain roll-off greater than 0.5 dB within 200 MHz of the predetermined frequency band, while providing signal losses less than 1.0 dB inside the predetermined frequency band at a power level greater than 240 W. By providing the bandwidth limiting matching networks in the transistor package, the gain response of the transistor may be appropriately limited in order to comply with the spectral masking requirements of one or more wireless communications standards, for example, Long Term Evolution (LTE) standards. | 12-03-2015 |
20150348948 | MULTIPLE DIE LIGHT EMITTING DIODE (LED) COMPONENTS AND METHODS OF FABRICATING SAME - A Light Emitting Diode (LED) component includes discrete LED dies that are spaced apart from one another. An electrical connection element is provided adjacent the LED dies and configured to electrically connect the discrete LED dies in series and/or in parallel. A unitary optically transparent structure is provided on the second faces of the LED dies remote from the anode and cathode contacts, that spans the plurality of LED dies. The LED component is unsupported by a submount that spans adjacent ones of the LED dies. The electrical connection element may be a patterned metal sheet that is patterned to electrically connect the discrete LED dies in series and/or in parallel. The electrical connection element may also be wire bonds adjacent the LED dies that are arranged to electrically connect the discrete LED dies in series and/or in parallel. | 12-03-2015 |
20150348886 | OVER-MOLD PLASTIC PACKAGED WIDE BAND-GAP POWER TRANSISTORS AND MMICS - A transistor package includes a lead frame, a wide band-gap transistor attached to the lead frame, and an over-mold surrounding the lead frame and the wide band-gap transistor. The wide band-gap transistor has a peak output power greater than 150 W when operated at a frequency up to 3.8 GHz. Using an over-mold along with a wide band-gap transistor in the transistor package allows the transistor package to achieve an exceptionally high efficiency, gain, and bandwidth, while keeping the manufacturing cost of the transistor package low. | 12-03-2015 |
20150348885 | OVER-MOLD PACKAGING FOR WIDE BAND-GAP SEMICONDUCTOR DEVICES - A transistor package includes a lead frame and a gallium nitride (GaN) transistor attached to the lead frame. The lead frame and the GaN transistor are surrounded by an over-mold with a glass transition temperature greater than about 135° C. and a flexural modulus less than about 20 GPa. Using an over-mold with a glass transition temperature greater than about 135° C. and a flexural modulus less than about 20 GPa allows the over-mold to handle the heat produced by the GaN transistor while preventing damage to the GaN transistor due to thermal expansion and/or contraction of the over-mold. | 12-03-2015 |
20150345762 | DIRECTIONAL LIGHTING - A lighting fixture is disclosed. In one embodiment, the lighting fixture includes a motorized pan-tilt mechanism having a head unit. The head unit either includes a light source or a receptacle for receiving and powering a light source. The motorized pan-tilt mechanism is capable of moving the head unit to control the direction in which light emitted from the light source is directed. | 12-03-2015 |
20150342004 | LIGHTING APPARATUS WITH INDUCTOR CURRENT LIMITING FOR NOISE REDUCTION - A lighting apparatus includes a lighting circuit (e.g., an LED lighting circuit) and a driver circuit having an output coupled to the lighting circuit and an input configured to be coupled to a power source, such as a phase cut dimmer, that provides a varying voltage waveform. The driver circuit includes an electromagnetic interference (EMI) suppression inductor configured to be coupled in series with the power source and a bypass circuit configured to divert current from the EMI filter inductor to limit a current in the EMI filter inductor. | 11-26-2015 |
20150330580 | LED LAMP WITH BASE ELECTRICAL INTERCONNECT - A LED lamp includes an at least partially optically transmissive enclosure and a base. A LED assembly includes at least one LED, where the LED is located in the enclosure and is operable to emit light when energized through an electrical path from the base. An electronics board is in the electrical path where the electronics board is coupled to the base by an electrical interconnect comprising at least one base-side contact that is biased into engagement with the base. | 11-19-2015 |
20150325759 | OPTICAL ELEMENT WITH INTEGRATED INDICATOR - Solid state fixtures and packages are disclosed that include an optical element, such as an encapsulant, having an integrated indicator which indicates one or more characteristics of the package to a user, such as package orientation, polarity, chip-type, etc. The host optical element can be substantially symmetrical but for the indicator. Indicators can be additive, such as a bump, or subtractive, such as a hole. The indicator can be visible to the human eye, and/or can be machine detectable, such as by pick-and-place technology. Indicators can be formed by many processes including molding and laser ablation/imprinting, which is particularly suited for use with a hard host material. | 11-12-2015 |
20150323168 | LED Light Fixture - An LED light fixture including a plurality of upwardly-protruding elongate fins extending therealong from distal fin-ends to proximal fin-ends adjacent to upward-flow openings through the fixture, the fins defining horizontal between-fin channels open at the distal fin-ends, and a plurality of flow-interrupters between adjacent fins changing air flow along the channels. The flow-interrupters may be less than half the heights of their respective between-fin channels and may be mounting bosses to serve the further purpose of facilitating assembly of the fixture. | 11-12-2015 |
20150316249 | LED Light Fixture - An LED light fixture including at least one LED light source thermally coupled to a heat-conductive structure. The heat-conductive structure having an LED-supporting region and heat-dissipating surfaces extending away therefrom. The at least one LED light source is thermally coupled to the LED-supporting region. The heat-conductive structure defines venting apertures bordering the at least one LED light source to facilitate ambient fluid flow to and from the heat-dissipating surfaces. In some embodiments, the LED light fixture includes a protrusion extending into a corresponding one of the venting apertures and oriented to direct air flow. In certain embodiments, the heat-conductive structure defines a plurality of venting apertures adjacent the at least one LED light source, the heat-dissipating surfaces include fins increasing in height at positions adjacent to the at least one of the venting apertures. | 11-05-2015 |
20150312983 | HIGH EFFICIENCY DRIVER CIRCUIT WITH FAST RESPONSE - A high efficiency driver circuit with fast response is disclosed. Embodiments of the present invention relate to an LED driver that can drive a plural number of LED strings. The driver according to example embodiments includes a voltage converter stage with a feedback loop. The driver can include a speed-up circuit, and/or an adaptive output voltage control circuit, also referred to herein as an overhead control circuit. In at least some embodiments, an input inductor helps to attenuate input current ripple, which could otherwise lead to low high-frequency winding loss in other inductors. The speed-up circuit can provide current regulation of the LED strings and prevent flickering of the LEDs. The overhead control circuit can adjust the output voltage of the driver to an optimum value to improve operating efficiency. | 10-29-2015 |
20150312974 | SEPIC DRIVER CIRCUIT WITH LOW INPUT CURRENT RIPPLE - A SEPIC driver circuit with low input current ripple is disclosed. Embodiments of the present invention provide a driver circuit that accommodates universal input, has a wide output voltage range and good efficiency. An LED lighting system using such as circuit is also disclosed. In at least some embodiments, the circuit is configured as a single-ended primary inductor converter circuit using a magnetic element, and a floating capacitor is connected between the input winding and the output winding of the magnetic element. In some embodiments, an inductor is also included at the DC input to the circuit. An output rectifier such as a diode can also be connected to the output winding of the magnetic element, and an output capacitor can be connected across the output of the circuit. An FET, a bipolar transistor, or a plurality of FETs can be used as the switching device. | 10-29-2015 |
20150311325 | IGBT STRUCTURE ON SIC FOR HIGH PERFORMANCE - An IGBT device includes an IGBT stack including a first surface and a second surface opposite the first surface, a collector contact over the first surface of the IGBT stack, a gate contact on the second surface of the IGBT stack, and an emitter contact on the second surface of the IGBT stack. The IGBT stack includes an injector region, which provides the first surface of the IGBT stack, a drift region over the injector region opposite the first surface, a pair of junction implants in the IGBT stack along the second surface of the IGBT stack, and a field termination region between the pair of junction implants in the IGBT stack along the second surface of the IGBT stack. | 10-29-2015 |
20150308630 | LED LAMP - A LED lamp for use in an existing light fixture having an electrical receptacle comprises an at least partially optically transmissive enclosure and a base having an external size that may be the same size or smaller than an external size of the electrical receptacle. A LED assembly is operable to emit light when energized through an electrical path from the base. The base comprises a universal mounting mechanism for mounting the lamp to the light fixture. A surge protector and an electrical connector are positioned at least partially in the base and are in the electrical path. A heat sink comprises a first portion in the enclosure for supporting the LED assembly and a second portion external of the enclosure for dissipating heat. The base is connected to the heat sink. | 10-29-2015 |
20150308628 | LED LAMP WITH LED BOARD HEAT SINK - A LED lamp includes an optically transmissive enclosure and a base connected to the enclosure. LEDs are mounted on a substrate for emitting light when energized though an electrical path from the base. The substrate and the LEDs are mounted outside of the enclosure for transmitting light from the plurality of LEDs into the enclosure. | 10-29-2015 |
20150300619 | LED LAMP WITH LED ASSEMBLY RETENTION MEMBER - A LED lamp includes an at least partially optically transmissive enclosure and a base. A LED assembly having a plurality of LEDs is located in the enclosure where the LEDs are operable to emit light when energized through an electrical path from the base. A heat sink has a heat dissipating portion that is at least partially exposed to the ambient environment and a heat conducting portion that is thermally coupled to the at least one LED assembly. The LED assembly is mounted on the heat conducting portion under radial tension. A retention member restrains the LED assembly from moving in an axial direction relative to the heat conducting portion. | 10-22-2015 |
20150296461 | GAN AMPLIFIER FOR WIFI APPLICATIONS - A gallium nitride (GaN) radio frequency integrated circuit (RFIC) is configured to receive and amplify a low-level WiFi signal to generate a WiFi transmit signal. By using a GaN RFIC, the performance of the RFIC is significantly improved when compared to conventional RFICs for WiFi signals. In one exemplary embodiment, the RFIC has an error vector magnitude less than 29 dBc, an average power output around 29 dBm, and an average power added efficiency of greater than 25%. In additional embodiments, the RFIC has a gain greater than about 32 dB and a peak output power around −37 dB. | 10-15-2015 |
20150292686 | LED LAMP - A lamp comprises an interior space and a base. An enclosure may be connected to the base to enclose the interior space. At least one LED board divides the interior space into a plurality of sectors. A LED is located in each sector in the enclosure operable to emit light when energized through an electrical path from the base. Light from the LED is reflected by a wall of the sector to create a reflected light source. | 10-15-2015 |
20150287805 | High Power Insulated Gate Bipolar Transistors - An insulated gate bipolar transistor (IGBT) includes a substrate having a first conductivity type, a drift layer having a second conductivity type opposite the first conductivity type, and a well region in the drift layer and having the first conductivity type. An epitaxial channel adjustment layer is on the drift layer and has the second conductivity type. An emitter region extends from a surface of the epitaxial channel adjustment layer through the epitaxial channel adjustment layer and into the well region. The emitter region has the second conductivity type and at least partially defines a channel region in the well region adjacent to the emitter region. A gate oxide layer is on the channel region, and a gate is on the gate oxide layer. Related methods are also disclosed. | 10-08-2015 |
20150276139 | LED LAMP WITH LED BOARD BRACE - An enclosure is divided into first and second portions by a theoretical plane defined by a horizontal line. LEDs are mounted on an LED board in the enclosure and are operable to emit light when energized through an electrical path. A first pin is mounted to a first end of the enclosure and a second pin mounted to a second end of the enclosure, both pins being in the electrical path. Braces support the LED board and comprise first and second legs. The first leg and second leg extend to a first point and a second point of intersection of the plane and the internal surface of the enclosure, respectively. A first conductor connects the first pin to the LED board and a second conductor connects the second pin to the LED board. The first conductor and first pin and the second conductor and the second pin are one-piece. | 10-01-2015 |
20150276138 | LED LAMP WITH LED BOARD BRACE - A LED lamp includes an elongated at least partially optically transmissive enclosure having a first end and a second end. LEDs are in the enclosure and are operable to emit light through the enclosure when energized through an electrical path. A first pin is mounted to the first end of the enclosure and a second pin mounted to the second end of the enclosure, the first pin and the second pin are in the electrical path. The LEDs are mounted on an LED board. A plurality of discrete braces are spaced along the length of the LED board and are mounted to the LED board. The braces support and position the LED board in the enclosure. | 10-01-2015 |
20150276137 | LED LAMP - An LED lamp includes an elongated at least partially optically transmissive enclosure having a first end and a second end. LEDs are located in the enclosure and are operable to emit light through the enclosure when energized through an electrical path. A first pair of pins are mounted to the first end of the enclosure and a second pair of pins are mounted to the second end of the enclosure, the pins being in the electrical path. The LEDs are mounted on an LED board. A support structure for supporting the LED board is formed as one-piece with the enclosure and is formed of an optical material. | 10-01-2015 |
20150276125 | FRAME AND LENS UPGRADE KITS FOR LIGHTING FIXTURES - Frame and lens upgrade kits for lighting fixtures. A frame bracket defines the frame area, which can be rectangular, for example. A lens frame fits just inside the frame bracket with the lens frame being releasably attached thereto. The frame bracket can be constructed from collapsible frame bracket subassemblies. For example, a rectangular frame bracket may be assembled from first and second collapsible frame bracket subassemblies that fan out and lock together to create a rigid frame bracket. The subassemblies each comprise elongated side and edge brackets that are fastened together such that they can pivot about one another. In some embodiments, one side of the lens frame is attached to a corresponding side of the frame bracket with a rotatable clip that allows the lens frame to swing such that its other side can attach to the bracket frame with an attachment latch, which can be magnetic, for example. | 10-01-2015 |
20150271888 | THREE-WAY SOLID-STATE LIGHT BULB - A three-way solid-state light bulb is disclosed. Embodiments of the present invention provide power supply circuitry that allows a solid-state lamp or light bulb to work in a manner similar to that of a common three-way incandescent light bulb. The power supply can selectively receive the input voltage, usually AC line voltage, on first and second input terminals. In some embodiments, a control circuit is operable to influence a feedback loop by diverting current and/or in some cases alter a current sense resistance in accordance with the selective presence of the voltage at the first and second inputs. The light output of the solid-state emitter or solid-state emitters in the bulb is set in accordance with a selective presence of the input voltage. | 09-24-2015 |
20150267879 | HIGH EFFICIENCY LED LAMP - A LED lamp includes a plurality of red LEDs and a plurality of blue LEDs, a phosphor covering at least the plurality of blue LEDs, where the lamp has an LPW of at least 200 in a steady state operation. | 09-24-2015 |
20150263145 | IGBT STRUCTURE FOR WIDE BAND-GAP SEMICONDUCTOR MATERIALS - An IGBT device includes an IGBT stack, a collector contact, a gate contact, and an emitter contact. The IGBT stack includes an injector region, a drift region over the injector region, a spreading region over the drift region, and a pair of junction implants in the spreading region. The spreading region provides a first surface of the IGBT stack, which is opposite the drift region. The pair of junction implants is separated by a channel, and extends from the first surface of the IGBT stack along a lateral edge of the IGBT stack towards the drift region to a first depth, such that the thickness of the spreading region is at least one and a half times greater than the first depth. | 09-17-2015 |
20150260377 | Adjustable Photocontrol Mounting Assembly - An assembly for connecting and holding a photocontrol with respect to a light fixture. The assembly includes a support member and a photocontrol receptacle over and secured with respect to the support member. The support member is on an exterior surface of a light-fixture housing at an opening formed in the housing. The photocontrol receptacle is rotatable about the support member for angular photocontrol adjustment on the light fixture. The support member is fixed with respect to the exterior surface of the light-fixture housing. The receptacle has an engagement portion rotatably engaging the support member, thereby holding the receptacle with respect to the light-fixture housing while permitting rotation of the receptacle with respect thereto. Another aspect is a related method for connecting and holding a photocontrol with respect to a light fixture. | 09-17-2015 |
20150256084 | CONVERTER CIRCUITRY - Disclosed is a DC-DC converter with a converter bridge, tank circuitry, and rectifier circuitry. In one embodiment, the converter bridge includes multiple switch circuits, which are formed with silicon carbide MOSFETs (metal on semiconductor field effect transistors), and are configured to provide a primary current. The tank circuitry includes a resonant capacitance, a resonant inductance, and a transformer with a primary, a first secondary, and a second secondary. The tank circuitry is configured to receive the primary current, and the transformer is associated with a magnetizing inductance. The resonant frequency of the tank circuitry is greater than about 225 kilohertz as essentially defined by the magnetizing inductance, the resonant capacitance, and the resonant inductance. The rectifier circuitry is coupled to the first secondary and the second secondary coil, and is adapted to provide a rectified output current. | 09-10-2015 |
20150256069 | POWER SUPPLY THAT MAINTAINS AUXILIARY BIAS WITHIN TARGET RANGE - A power supply includes a switch configured to control flow of current output from an inductor to an output of the power supply. The switch receives a switching signal from a control circuit. An auxiliary bias is generated to power the control circuit. A bias circuit outputs a bias signal that is used to generate the auxiliary bias. The bias circuit senses a level of the auxiliary bias to control output of the bias signal. Output of the bias signal may be controlled to maintain the level of the auxiliary bias at a target level or within a target range. | 09-10-2015 |
20150253361 | Voltage Monitoring Circuit - A voltage monitoring circuit includes a line monitoring circuit configured to receive an AC line voltage and generate an output voltage in response to the AC line voltage exceeding a threshold voltage, and a rectifier circuit coupled to the line monitor circuit and configured to receive the output voltage from the line monitoring circuit generate a rectified voltage signal in response to the output voltage. | 09-10-2015 |
20150252953 | DUAL OPTICAL INTERFACE LED LAMP - A LED lamp includes an at least partially optically transmissive enclosure and a base connected to the enclosure. A plurality of LEDs are located in the enclosure and are operable to emit light when energized through an electrical path from the base. An optical interface is positioned in the enclosure for electrically isolating a live electrical component and for receiving at least a portion of the light. The optical interface includes a light modifying property for modifying a characteristic of the portion of the light. | 09-10-2015 |
20150249384 | POWER CONVERSION ELECTRONICS - A power conversion apparatus and individual components thereof is described. In general, the power conversion apparatus converts a DC output received from an appropriate source, such as string of solar panels, to an AC output. The AC output may be a single-phase or three-phase, sinusoidal AC signal. The inverter system may include a boost converter, which is a DC-to-DC converter, and an inverter, which is essentially a DC-AC converter. In operation, the boost converter will boost the DC output from the appropriate source to a desired DC output voltage. The inverter will convert the DC output voltage to a desired single-phase or three-phase output voltage at a desired frequency, such as 50 or 60 hertz. The boost converter and the inverter may be packaged together in an appropriate sealed and weatherproof housing. | 09-03-2015 |
20150241050 | LED Light Fixture - An LED lighting fixture comprising a housing portion and a light-emitting portion supporting at least one illuminator, the housing portion and the light-emitting portion defining an open space therebetween permitting air/water-flow therethrough. In some embodiments, at least one wall extends within the open space and open for air/water-flow along at least two sides thereof. | 08-27-2015 |
20150241021 | LED Lensing Arrangement - An LED lensing arrangement for lighting fixtures includes (1) a rigid light-transmissive outer structure having an outwardly-facing light-exit surface and an outer-structure light-input surface, (2) an optically-clear molded polymeric inner structure having a light-entrance surface and a light-output surface which is adhered to the outer-structure light-input surface, the inner structure being of a material which is pourable upon molding, one example being a liquid silicone rubber (LSR) material, and (3) at least one LED light source secured with respect to and optically coupled to the inner-structure light-entrance surface. | 08-27-2015 |
20150240998 | LED LAMP - An LED lamp includes an enclosure and a base. LEDs are mounted on a first portion of a substrate and an electrical contact is mounted on a second portion of the substrate. The LEDs emit light from the enclosure when energized through an electrical path from the base. A heat sink conducts heat to the ambient environment. The first portion of the substrate is mounted on an outside surface of a tower that extends into the enclosure. The second portion of the substrate is located inside of the tower. An extension is electrically coupled to the base and includes a second electrical contact that is electrically coupled to the first electrical contact. | 08-27-2015 |
20150236017 | METHOD OF MANUFACTURING PRECISE SEMICONDUCTOR CONTACTS - A first dielectric layer including a first opening is provided on a first surface of a semiconductor layer. A second dielectric layer is provided on top of the first dielectric layer in the first opening. A first portion of the second dielectric layer is then removed, such that a second portion of the second dielectric layer remains in the first opening. The first dielectric layer is then removed, leaving only the second portion of the second dielectric layer on the surface of the semiconductor layer. An epitaxial layer or a base dielectric layer is grown on the exposed portions of the first surface of the semiconductor layer not covered by the second portion of the second dielectric layer. The second portion of the second dielectric layer is then removed to define one or more contact windows, and a contact metal is deposited in the one or more contact windows. | 08-20-2015 |
20150233544 | REMOTE PHOSPHOR ELEMENT FILLED WITH TRANSPARENT MATERIAL AND METHOD FOR FORMING MULTISECTION OPTICAL ELEMENTS - Lighting components and fixtures having optical elements with multiple portions are disclosed. A wavelength conversion element can be mounted over a source, the wavelength conversion element including wavelength conversion material remote to the source, such as on or near the outside surface of a conversion element. The element can be filled with a transparent and thermally conductive material which thermally couples the remote conversion material and the source, aiding in thermal dissipation and improving fixture efficacy. An optical element can be formed by using an embossing plate to form a first portion, partially curing the first portion, removing the embossing plate, and introducing material to form a second portion. | 08-20-2015 |
20150226385 | Systems and Methods for Application of Coatings Including Thixotropic Agents onto Optical Elements, and Optical Elements Having Coatings Including Thixotropic Agents - A method of forming an optical device includes providing an optical element, providing a luminescent suspension including a liquid encapsulant material, phosphor particles, a solvent and a thixotropic agent, atomizing the luminescent suspension, and spraying the atomized luminescent suspension onto the optical element using a flow of pressurized gas. A light emitting structure includes an optical element configured to emit light upon energization thereof, and a thin phosphor layer including a thixotropic agent on the optical element. | 08-13-2015 |
20150221574 | STRESS MITIGATION FOR THIN AND THICK FILMS USED IN SEMICONDUCTOR CIRCUITRY - A semiconductor device is configured to reduce stress in one or more film layers in the device. According to one embodiment, the semiconductor device includes a substrate, a discontinuous dielectric layer on a first surface of the substrate, and a substantially continuous encapsulation layer over the first surface of the substrate and the discontinuous dielectric layer. Notably, the dielectric layer may be broken into one or more dielectric sections in order to relieve stress in the semiconductor device. | 08-06-2015 |
20150216017 | SENSOR MODULE FOR A LIGHTING FIXTURE - A sensor module is integrated into a lighting fixture. The sensor module includes one or more environmental sensors and can be readily installed in or removed from the lighting fixture. In one embodiment, a heatsink of the lighting fixture is configured to receive the sensor module. Readings from the environmental sensors may be passed to control electronics associated with the lighting fixture and used to control the light output of the lighting fixture. The readings may also be passed on to other lighting fixtures, which may also use the readings to control their light output. | 07-30-2015 |
20150211723 | LED LAMP AND HEAT SINK - A lamp has an at least partially optically transmissive enclosure and a base that retains lamp electronics. LEDs are located in the enclosure and are operable to emit light when energized through an electrical path from the base. The LEDs are thermally isolated from the lamp electronics in the base. A heat sink is disposed between the base and the enclosure. The heat sink includes a heat conducting portion that is thermally coupled to the LEDs and a heat dissipating portion that is exposed to the ambient environment. The heat dissipating portion includes fins that have inner edges and create spaces between adjacent ones of the fins. The inner edges are spaced from one another to define an interior open space where the interior open space communicates with the spaces between the fins. | 07-30-2015 |
20150200336 | WAFER LEVEL CONTACT PAD STANDOFFS WITH INTEGRATED REFLECTOR - This disclosure relates to surface mount devices, such as light emitting devices, and methods of manufacture thereof, including recessed contact pads in relation to a mount surface, such that contact bumps and a reflective material are disposed to form a planar mounting surface. Embodiments according to the present disclosure include a light emitting device, wherein the device comprises at a reflective layer, forming at least a portion of a mounting surface. The device also includes one or more contact pads on the device, such that the contact pads are recessed in relation to the reflective layer. Contact bumps are formed on the contact pads, protruding beyond the contact pads, wherein the contact bumps compose at least a portion of the mounting surface. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed. | 07-16-2015 |
20150200335 | WAFER LEVEL CONTACT PAD SOLDER BUMPING FOR SURFACE MOUNT DEVICES WITH NON-PLANAR RECESSED CONTACTING SURFACES - This disclosure related to surface mount devices, such as light emitting devices, and methods of manufacture thereof, including recessed contact pads with protruding contact bumps. Embodiments according to the present disclosure include a light emitting device, wherein the device comprises at least a contact pad, such that the contact pad is recessed in relation to a surface of the device. Contact bumps are formed in contact with the contact pads, such that the contact bumps protrude beyond the surface and may contact a surface of a submount that the device is meant to be mounted to. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed. | 07-16-2015 |
20150192267 | LED Lens - A lens for distribution of light from a light emitter having an emitter axis. The lens includes an outer surface and a total internal reflection (TIR) surface positioned outwardly of and around the emitter such that light received by the TIR surface is totally internally reflected toward the outer surface. The TIR surface has at least one recessed region extending away from the light emitter, thereby to increase amount of TIR and facilitate lateral diffusion of highest-intensity light in the middle of the light distribution. The lens may further include a base surface adjacent the emitter and an inner surface defining an inner cavity about the emitter axis. In such embodiments, the TIR is positioned and configured for total internal reflection of light received from the inner surface. | 07-09-2015 |
20150192257 | NARROW-BEAM OPTIC AND LIGHTING SYSTEM USING SAME - A narrow-beam optic and a lighting system using the optic are disclosed. Embodiments of the present invention provide an optical element, or “optic” that can enable a lighting system to achieve beam control. The optic collects light from substantially all angles of an LED's light output and collimates the light into a narrow beam angle. In example embodiments, the optic includes an entry surface, an exit surface, and a concentrator lens opposite the entry surface and recessed relative to the exit surface. In example embodiments, a mounting feature or spacer adjacent to the entry surface spaces the entry surface and concentrator lens from an LED. An outer surface serves to provide total internal reflection (TIR) and is disposed between the exit surface and the mounting feature. | 07-09-2015 |
20150188006 | SILAZANE-CONTAINING MATERIALS FOR LIGHT EMITTING DIODES - LEDs comprising polysilazane/polysiloxane copolymers and curable compositions containing same are disclosed. Methods of providing thermal and UV degradation resistance to said LED's, as well as increased luminous flux, is provided. | 07-02-2015 |
20150176770 | LED LAMP - A tube that is at least partially optically transmissive. An LED mounted on a substrate is positioned in the tube and is operable to emit light through the tube when energized through an electrical path. Pins are in the electrical path. An electrical conductor electrically couples the pins to the electrical path, the electrical conductor is biased into engagement with an electrical contact on the substrate. The substrate may be secured to the tube by an adhesive. The substrate may be secured to the end caps and be suspended in the tube. | 06-25-2015 |
20150163878 | Dimmable Lighting Systems and Methods of Dimming Lighting Systems - A lighting apparatus includes a light source, a power input coupled to the light source, and a dimming control module coupled to the power input and the light source. The dimming control module is configured to change a brightness level of the light source in response to toggling of a power signal supplied at the power input. Related methods of operating a lighting apparatus are also disclosed. | 06-11-2015 |
20150159848 | LED LAMP AND MODULAR LIGHTING SYSTEM - A modular lighting system has lamps that may be connected to one another such that current is carried between the lamps. The lamps include an enclosure that is at least partially optically transmissive. At least one LED is located in the enclosure that is operable to emit light through the enclosure when energized through an electrical path. A first electrical connector is provided for connecting the electrical path to a power source and a second electrical connector is configured to connect the electrical path to a second lamp. | 06-11-2015 |
20150145418 | AMBIENT LIGHT REGULATION METHODS - A lighting fixture includes a solid-state light source and control circuitry. The control circuitry is configured to receive one or more ambient light level measurements corresponding to the amount of ambient light detected by an ambient light sensor, and determine a range of values for the one or more ambient light level measurements corresponding to a desired amount of light detected by the ambient light sensor. The control circuitry is then configured to drive the solid-state light source such that the one or more ambient light level measurements received from the ambient light sensor fall within the determined range of values. | 05-28-2015 |
20150138784 | SENSOR MODULE FOR A LIGHTING FIXTURE - A sensor module is integrated into a lighting fixture. The sensor module includes one or more environmental sensors and can be readily installed in or removed from the lighting fixture. In one embodiment, a heatsink of the lighting fixture is configured to receive the sensor module. Readings from the environmental sensors may be passed to control electronics associated with the lighting fixture and used to control the light output of the lighting fixture. The readings may also be passed on to other lighting fixtures, which may also use the readings to control their light output. | 05-21-2015 |
20150138776 | MULTIPLE-PLY SOLID STATE LIGHT FIXTURE - A multiple-ply solid state light fixture is disclosed. A panelized, solid state light fixture includes combined layers of material chemically bonded together without a traditional mechanical housing and with relatively few or no fasteners. In example embodiments, the solid state light fixture includes an LED mounting substrate, a thermal material on a non-LED side of the LED mounting substrate, and an optical material on the LED side of the LED mounting substrate. A plurality of LEDs are disposed or mounted, with or without additional packaging, on the LED side of the LED mounting substrate. A chemical bond is created between the substrate and the other layers. This chemical bond can be created, for example, through use of applied fluid or gelatinous compounds that are then solidified, or through the use of adhesives. | 05-21-2015 |
20150137689 | SYSTEMS AND METHODS FOR A CURRENT SHARING DRIVER FOR LIGHT EMITTING DIODES - Systems and methods for a current sharing driver for light emitting diodes are disclosed. One disclosed system includes: a first string of LEDs; a second string of LEDs connected in parallel with the first string; a first current control device connected in series with the first string of LEDs; a second current control device connected in series with the second string of LEDs; a first voltage measurement device coupled to the first string of LEDs and the second string of LEDs, the first voltage measurement circuit coupled to the first current control device and configured to control the first current control device; and a second voltage measurement device coupled to the first string of LEDs and the second string of LEDs, the second voltage measurement circuit coupled to the second current control device and configured to control the second current control device. | 05-21-2015 |
20150131293 | LED LAMP - A lamp includes an enclosure that is at least partially optically transmissive and a base. One or more LEDs are located in the enclosure and are operable to emit light when energized through an electrical path from the base. A heat sink having a heat dissipating portion that is at least partially exposed to the ambient environment and a heat conducting portion that is thermally coupled to the at least one LED transfers heat from the LEDs to the ambient environment. The heat sink includes fins that are located in the enclosure. A housing is press fit between the heat dissipating portion and the heat conducting portion and forms part of the heat sink. The housing is thermally coupled to the heat sink and is made of thermally conductive material and is at least partially exposed to the ambient environment. The housing defines at least a portion of the enclosure. | 05-14-2015 |
20150124449 | LED LIGHT FIXTURES WITH ARRANGEMENT FOR ELECTRICAL CONNECTION - An LED light fixture includes a heat sink structure, at least one LED board in thermal engagement with the heat sink structure, the at least one LED board having at least one LED emitter thereon, and an on-board connector on the LED board for connecting electrical wiring to the LED emitter(s). At least one enclosing member forms with the heat sink an interior space enclosing a corresponding LED board, the rigid enclosing member defining a wiring aperture therethrough in alignment with the on-board connector. The LED light fixture also has an exterior wireway structure including a one-piece duct which has an end portion engaged with the wiring aperture and forms a channel for wires to the on-board connector. The wireway structure further includes a single-piece rigid cover secured with respect to the enclosing member and enclosing the duct. | 05-07-2015 |
20150115816 | SOLID STATE LIGHTING DEVICE AND METHOD FOR OPERATING THE SAME - A lighting device employs at least one string of LEDs as a lighting source. The string of LEDs may be coupled in series between a power supply node and ground. In order to accurately determine a drive current running through or drive voltage across the string of LEDs, the drive current through the string of LEDs or the drive voltage across the string of LEDs is sampled randomly or semi-randomly, and a moving average is determined from each one of the samples. By sampling the drive current through or drive voltage across the string of LEDs randomly or semi-randomly, inaccuracies due to synchronization of the sampling with interference in the drive current signal or the drive voltage signal are effectively prevented. Accordingly, an accurate measurement of the drive current through or the drive voltage across the string of LEDs may be obtained. | 04-30-2015 |
20150115811 | DETECTION OF LINEAR AND PWM DIMMING IN A SOLID STATE LIGHTING DEVICE - A lighting device employs an array of LEDs as a lighting source. The array of LEDs may be coupled in series between a power supply node and ground. In order to determine whether the input drive signal to the array of LEDs is a pulse width modulated (PWM) signal or a linear signal, the voltage across the string of LEDs is sampled and stored in a cyclical buffer. The variance of the samples stored in the cyclical buffer is then calculated and used to determine whether the input signal provided to the string of LEDs at the power supply node is a PWM signal or a linear signal. In one embodiment, the variance is compared to a predetermined threshold value to determine whether the input signal is a PWM signal or a linear signal. | 04-30-2015 |
20150102361 | SEMICONDUCTOR DEVICES IN SIC USING VIAS THROUGH N-TYPE SUBSTRATE FOR BACKSIDE CONTACT TO P-TYPE LAYER - A Silicon Carbide (SiC) semiconductor device having back-side contacts to a P-type region and methods of fabrication thereof are disclosed. In one embodiment, an SiC semiconductor device includes an N-type substrate and an epitaxial structure on a front-side of the N-type substrate. The epitaxial substrate includes a P-type layer adjacent to the N-type substrate and one or more additional SiC layers on the P-type layer opposite the N-type substrate. The semiconductor device also includes one or more openings through the N-type substrate that extend from a back-side of the N-type substrate to the P-type layer and a back-side contact on the back-side of the N-type substrate and within the one or more openings such that the back-side contact is in physical and electrical contact with the P-type layer. The semiconductor device further includes front-side contacts on the epitaxial structure opposite the N-type substrate. | 04-16-2015 |
20150098238 | LED LAMP - A lamp comprises has an optically transmissive enclosure and a base. At least one LED is located in the enclosure and is operable to emit light when energized through an electrical path from the base. A light non-transmissive portion defines a light transmissive portion where the light transmissive portion is illuminated when the at least one LED is energized. The light transmissive portion may define information such as branding information. | 04-09-2015 |
20150098206 | LED LAMP - A lamp comprises an optically transmissive enclosure and a base. An LED assembly is located in the enclosure and is operable to emit light when energized through an electrical path from the base. The LED assembly comprises an LED and a lumophoric dome that surrounds the LED. A partially reflective pad is on the lumophoric dome for manipulating the pattern of light emitted from the lumophoric dome. A heat sink comprises a heat dissipating portion that is at least partially exposed to the ambient environment and a heat conducting portion that is thermally coupled to the LED. An optically transmissive lens emits light from the enclosure where the lens comprises an annular area defined by a textured surface and a transparent area interior of the annular area. | 04-09-2015 |
20150097226 | FIELD EFFECT DEVICE WITH ENHANCED GATE DIELECTRIC STRUCTURE - A vertically oriented field effect device has a body and an enhance gate structure. The body includes a JFET (junction field effect transistor) region disposed between junction implants that extend into the body from a top surface of the body. The gate structure includes a supplemental gate dielectric, a primary gate dielectric, and a gate contact. The supplemental gate dielectric is formed over the top surface of the body above the JFET region, such that the supplemental dielectric is separated from the junction implants by a gap. The primary gate dielectric is formed over the supplemental gate dielectric, above the gap over the top surface of the body, and over at least a portion of the junction implants. The gate contact is formed over the primary gate dielectric. | 04-09-2015 |
20150092449 | MODULAR DRIVER MODULE FOR LIGHT FIXTURES WITH LED LUMINAIRES - A driver module is configured to generate the drive signals necessary to drive an LED or an array of LEDs of one or more LED luminaires. The driver module may, but need not, be located remotely from the LED luminaires. Since the driver module provides the drive signals, the LED luminaires do not need to have their own driver electronics, and as such, can be rendered in a more aesthetically pleasing and cost effective manner. As an example, the driver module may be located within a junction box or escutcheon plate associated with a light fixture and the LED luminaires can be mounted in the existing sockets of the light fixture. The internal wiring of the light fixture may be used to carry the drive signals provided by the driver module to the LED luminaires via the sockets of the light fixture. | 04-02-2015 |
20150084611 | BOOST CONVERTER WITH REDUCED SWITCHING LOSS AND METHODS OF OPERATING THE SAME - An apparatus, e.g., a boost converter, includes a first switch configured to be coupled to an inductor and to support a charging current in the inductor from a power source and at least two serially-coupled second switches coupled in parallel with the first switch and configured to selectively route current from the inductor to at least two serially-connected capacitors. The apparatus may further include a control circuit configured to operate the first switch and the plurality of second switches. | 03-26-2015 |
20150084125 | MONOLITHICALLY INTEGRATED VERTICAL POWER TRANSISTOR AND BYPASS DIODE - A vertical field-effect transistor (FET) device includes a monolithically integrated bypass diode connected between a source contact and a drain contact of the vertical FET device. According to one embodiment, the vertical FET device includes a pair of junction implants separated by a junction field-effect transistor (JFET) region. At least one of the junction implants of the vertical FET device includes a deep well region that is shared with the integrated bypass diode, such that the shared deep well region functions as both a source junction in the vertical FET device and a junction barrier region in the integrated bypass diode. The vertical FET device and the integrated bypass diode may include a substrate, a drift layer over the substrate, and a spreading layer over the drift layer, such that the junction implants of the vertical FET device are formed in the spreading layer. | 03-26-2015 |
20150084119 | LAYOUT CONFIGURATIONS FOR INTEGRATING SCHOTTKY CONTACTS INTO A POWER TRANSISTOR DEVICE - A semiconductor device includes a vertical field-effect-transistor (FET) and a bypass diode. The vertical FET device includes a substrate, a drift layer formed over the substrate, a gate contact and a plurality of source contacts located on a first surface of the drift layer opposite the substrate, a drain contact located on a surface of the substrate opposite the drift layer, and a plurality of junction implants, each of the plurality of junction implants laterally separated from one another on the surface of the drift layer opposite the substrate and extending downward toward the substrate. Each of the one or more bypass diodes are formed by placing a Schottky metal contact on the first surface of the drift layer, such that each Schottky metal contact runs between two of the plurality of junction implants. | 03-26-2015 |
20150084118 | SEMICONDUCTOR DEVICE INCLUDING A POWER TRANSISTOR DEVICE AND BYPASS DIODE - A semiconductor device includes a vertical FET device and a Schottky bypass diode. The vertical FET device includes a gate contact, a source contact, and a drain contact. The gate contact and the source contact are separated from the drain contact by at least a drift layer. The Schottky bypass diode is coupled between the source contact and the drain contact and monolithically integrated adjacent to the vertical FET device such that a voltage placed between the source contact and the drain contact is distributed throughout the drift layer by the Schottky bypass diode in such a way that a voltage across each one of a plurality of P-N junctions formed between the source contact and the drain contact within the vertical FET device is prevented from exceeding a barrier voltage of the respective P-N junction. | 03-26-2015 |
20150084116 | DEVICES INCLUDING ULTRA-SHORT GATES AND METHODS OF FORMING SAME - Provided are devices including ultra-short gates and methods of forming same. Methods include forming a first gate pattern on a semiconductor that includes a first recess having a first width, A dielectric spacer is formed on a sidewall of the first recess to define a second recess in the first recess that has a second width that is smaller than the first width. A gate having the second width is formed in the second recess. | 03-26-2015 |
20150084063 | SEMICONDUCTOR DEVICE WITH A CURRENT SPREADING LAYER - A semiconductor device includes a substrate, a drift layer over the substrate, a spreading layer over the drift layer, and a pair of junction implants in a surface of the spreading layer opposite the drift layer. An anode covers the surface of the spreading layer opposite the drift layer, and a cathode covers a surface of the substrate opposite the drift layer. By including the spreading layer, a better balance can be struck between the on state resistance of the semiconductor device and the peak electric field in the device, thereby improving the performance thereof. | 03-26-2015 |
20150084062 | MONOLITHICALLY INTEGRATED VERTICAL POWER TRANSISTOR AND BYPASS DIODE - A vertical field-effect transistor (FET) device includes a monolithically integrated bypass diode connected between a source contact and a drain contact of the vertical FET device. According to one embodiment, the vertical FET device includes a pair of junction implants separated by a junction field-effect transistor (JFET) region. At least one of the junction implants of the vertical FET device includes a deep well region that is shared with the integrated bypass diode, such that the shared deep well region functions as both a source junction in the vertical FET device and a junction barrier region in the integrated bypass diode. The vertical FET device and the integrated bypass diode may include a substrate, a drift layer over the substrate, and a spreading layer over the drift layer, such that the junction implants of the vertical FET device are formed in the spreading layer. | 03-26-2015 |
20150062909 | LED LAMP - A LED lamp includes an at least partially optically transmissive enclosure and a base. A LED assembly comprising at least one LED is located in the enclosure and is operable to emit light when energized through an electrical path from the base. A heat sink comprises a heat dissipating portion that is at least partially exposed to the ambient environment and a heat conducting portion that is thermally coupled to the at least one LED. The heat sink is connected to the base by a snap fit connector comprising a deformable first member on one of the base or heat sink engaging a second member on the other one of the heat sink and the base. A retention member holds the first member in engagement with the second member. A seal is positioned between the heat sink and the base, the seal being compressed between the heat sink and the base. | 03-05-2015 |
20150048489 | EDGE TERMINATION TECHNIQUE FOR HIGH VOLTAGE POWER DEVICES - Embodiments of a semiconductor die having a semiconductor device implemented on the semiconductor die and an edge termination structure around a periphery of the semiconductor device and methods of fabricating the same are disclosed. In one embodiment, a semiconductor die includes a semiconductor device and an edge termination structure around a periphery of the semiconductor device, where the edge termination structure includes negative features (e.g., trenches and/or divots) that vary dose in a corresponding edge termination region to approximate a desired dose profile. In one embodiment, the desired dose profile is a substantially decreasing or substantially linearly decreasing dose from an edge of a main junction of the semiconductor device to an edge of the edge termination region. In this manner, electric field crowding at the edge of the main junction of the semiconductor device is substantially reduced, which in turn substantially improves a break-down voltage of the semiconductor device. | 02-19-2015 |
20150041886 | VERTICAL POWER TRANSISTOR DEVICE - A power metal-oxide-semiconductor field-effect transistor (MOSFET) includes a substrate, a drift layer over the substrate, and a spreading layer over the drift layer. The spreading layer includes a pair of junction implants separated by a junction gate field effect (JFET) region. A gate oxide layer is on top of the spreading layer. The gate contact is on top of the gate oxide layer. Each one of the source contacts are on a portion of the spreading layer separate from the gate oxide layer and the gate contact. The drain contact is on the surface of the substrate opposite the drift layer. | 02-12-2015 |
20150035443 | LIGHTING APPARATUS FOR USE WITH CONTROLLED CURRENT DRIVERS - An apparatus includes a bus configured to be coupled to a controlled current source and at least one light emitting device coupled to the bus. The apparatus further includes a voltage regulator circuit configured to regulate a voltage at the bus and a current regulator circuit configured to control a current through the at least one light emitting device. The current regulator circuit may be used to control a color output of the apparatus. | 02-05-2015 |
20150028350 | Controlled Ion Implantation Into Silicon Carbide Using Channeling And Devices Fabricated Using Controlled Ion Implantation Into Silicon Carbide Using Channeling - Methods of forming a semiconductor structure include the use of channeled implants into silicon carbide crystals. Some methods include providing a silicon carbide layer having a crystallographic axis, heating the silicon carbide layer to a temperature of about 300° C. or more, implanting dopant ions into the heated silicon carbide layer at an implant angle between a direction of implantation and the crystallographic axis of less than about 2°, and annealing the silicon carbide layer at a time-temperature product of less than about 30,000° C.-hours to activate the implanted ions. | 01-29-2015 |
20150024516 | Electrostatic Phosphor Coating Systems and Methods for Light Emitting Structures and Packaged Light Emitting Diodes Including Phosphor Coating - Methods are disclosed including applying a layer of binder material onto an LED structure. A luminescent solution including an optical material suspended in a solution is atomized using a flow of pressurized gas, and the atomized luminescent solution is sprayed onto the LED structure including the layer of binder material using the flow of pressurized gas. | 01-22-2015 |
20150009670 | LIGHTING DEVICES THAT COMPRISE ONE OR MORE SOLID STATE LIGHT EMITTERS - Light engine modules comprise a support member and a solid state light emitter, in which (1) the emitter is mounted on the support member, (2) a region of the support member has a surface with a curved cross-section, (3) the emitter and a compensation circuit are mounted on the support member, (4) an electrical contact element extends to at least two surfaces of the support member, and/or (5) a substantial entirety of the module is located on one side of a plane and the emitter emits light into another side of the plane. Also, a module comprising means for supporting a light emitter and a light emitter. Also, a lighting device comprising a housing member and a light emitter mounted on a removable support member. Also, a lighting device comprising a module mounted in a lighting device element. Also, a method comprising mounting a module to a lighting device element. | 01-08-2015 |
20140368117 | SOLID STATE LIGHTING DEVICES AND METHODS OF MANUFACTURING THE SAME - Lighting devices comprising first, second and third strings of solid state lighting devices. One aspect further comprises means for supplying first fixed current through the first string, means for supplying second fixed current through the second string, and means for supplying current through the third string. In a second aspect, the first and second strings emit light within a specific area on a 1931 CIE Chromaticity Diagram, and the third string emits light of dominant wavelength 600-640 nm. A third aspect further comprises a power line and a power supply configured to supply a first and second fixed currents through the first and second strings, respectively, and supply a current to the third string. A method of making a lighting device, comprising measuring color output, adjusting current to first, second and/or third strings, and permanently setting currents to the first and second strings. | 12-18-2014 |
20140361343 | CASCODE STRUCTURES WITH GaN CAP LAYERS - A transistor device including a cap layer is described. One embodiment of such a device includes cap layer between a gate and a semiconductor layer. In one embodiment, the thickness of the cap layer is between 5 nm and 100 nm. In another embodiment, the cap layer can be doped, such as delta-doped or doped in a region remote from the semiconductor layer. Devices according to the present invention can show capacitances which are less drain bias dependent, resulting in improved linearity. | 12-11-2014 |
20140347885 | Optical Waveguide Bodies and Luminaires Utilizing Same - According to one aspect, a luminaire comprises a waveguide body including a central section and first and second separate side sections extending away from the central section along first and second opposed directions, respectively. The central section includes a coupling portion and the waveguide body has a length and includes a plurality of light extraction features that extract light out of the side sections. At least one LED is disposed adjacent the coupling portion and is operated by a power circuit to produce light that is directed into the waveguide body by the coupling portion. At least one structural member extends along the length of the waveguide body for supporting the waveguide body and encloses at least one of the power circuit and the at least one LED. | 11-27-2014 |
20140346874 | Power Supply with Standby Operation - A power supply includes a power conversion circuit configured to selectively operate in one of an active mode in which output power is supplied to a load and a standby mode in which output power is not supplied to the load, a plurality of auxiliary circuits including a first auxiliary circuit and a second auxiliary circuit, a bias node configured to supply power to the plurality of auxiliary circuits, and a switch that is coupled between the bias node and the first auxiliary circuit and that is configured to disconnect the first auxiliary circuit from the bias node in response to a control signal. | 11-27-2014 |
20140312376 | Semiconductor Light Emitting Devices Including Red Phosphors that Exhibit Good Color Rendering Properties and Related Red Phosphors - A light emitting device includes a light emitting diode (“LED”) that emits light having a dominant wavelength in the blue color range, and a recipient luminophoric medium that is configured to down-convert at least some of the light emitted by the LED. The recipient luminophoric medium includes a green phosphor that down-converts the radiation emitted by the LED to radiation having a peak wavelength that is between about | 10-23-2014 |
20140307436 | LED Lighting Fixture - An LED lighting fixture including a housing comprising a single-piece wall structure defining a cavity with an LED-supporting surface therewithin. An LED illuminator is mounted at the LED-supporting surface in the cavity, the LED-supporting surface positioning the LED illuminator in a desired orientation. An LED driver may be secured against the housing which transfers heat therefrom. There may be a plurality of spaced apart LED illuminators mounted at the LED-supporting surface within the cavity. The LED lighting fixture may also include a single-piece reflector comprising a plurality of reflector cups for the LED illuminators and extending therefrom to a common forward end of the housing. | 10-16-2014 |
20140292176 | LED LAMP WITH LED BOARD HEAT SINK - A LED lamp includes an optically transmissive enclosure and a base connected to the enclosure. LEDs are mounted on a substrate for emitting light when energized though an electrical path from the base. The mounting substrate for the LEDs has a surface that is exposed to the exterior of the enclosure for transmitting heat from the plurality of LEDs and dissipating heat to the ambient environment. | 10-02-2014 |
20140291715 | COMPACT LED PACKAGE WITH REFLECTIVITY LAYER - LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The packages can also comprise reflective layers to minimize losses due to light absorption, which in turn can increase the overall package emission efficiency. | 10-02-2014 |
20140291698 | LOW MICROPIPE 100 MM SILICON CARBIDE WAFER - A high quality single crystal wafer of SiC is disclosed having a diameter of at least about 100 mm and a micropipe density of less than about 25 cm | 10-02-2014 |
20140284643 | POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE - A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface. | 09-25-2014 |
20140270793 | OPTICAL COMMUNICATION FOR SOLID-STATE LIGHT SOURCES - The disclosure relates to a lighting fixture, which includes an array of solid-state light sources that are configured to generate light for general illumination lighting purposes and control circuitry. A drive signal is used to drive solid-state light sources. The control circuitry is configured to use a control output to control the drive signal to at least one of the solid-state light sources. The control output is configured to control the drive signal to 1) set at least one characteristic of the light generated by the array of the solid-state light sources, and 2) modulate the light with data for transmission. The light is modulated such that any change in the at least one characteristic based on the light being modulated is anthropically imperceptible. The characteristic of the light generated by the array of solid-state light sources may include the intensity, color, color temperature and the like. | 09-18-2014 |
20140268885 | LENS ASSEMBLY FOR A SOLID-STATE LIGHTING FIXTURE - The disclosure relates to a lighting fixture having a base, a solid-state light source, and a lens assembly. The optic has a body with a cavity and a proximal opening. The lens assembly is coupled to the base at the proximal opening. The solid-state light source is mounted to the base and is configured to direct light into the cavity via the proximal opening. At least a portion of an interior surface of the body includes a number of elongated prisms. At least a portion of the exterior surface of the body includes a number of diffusers. | 09-18-2014 |
20140268826 | LED LAMP AND HEAT SINK - A lamp has an optically transmissive enclosure and a base. At least one LED is located in the enclosure and are operable to emit light when energized through an electrical path from the base. A heat sink comprises a heat dissipating portion having a first part that is located inside of the enclosure and that is thermally coupled to the LED and a second part that is exposed to the ambient environment. The second part comprises a plurality of stems connected to the first part where each stem supports a first overhang that extends over a portion of the enclosure and a second overhang that extends over a portion of the base. | 09-18-2014 |
20140268819 | ELECTRICALLY INSULATIVE COATINGS FOR LED LAMP AND ELEMENTS - The present disclosure discloses a method for providing protective coatings onto an energizable LED component coupled to an electrical path. More particularly, the present disclosure relates to LED lamps comprising transparent dielectric coatings and LED lamps and devices made thereby. | 09-18-2014 |
20140268808 | LED LAMP AND HYBRID REFLECTOR - A lamp comprises an enclosure having a reflective surface and an exit surface through which light is emitted from the enclosure and a base. A plurality of LEDs are located in the enclosure and are operable to emit light when energized through an electrical path from the base. The reflective surface comprises a first reflective layer applied to the enclosure and a second reflective layer over the first reflective layer. The first reflective layer is a metalized surface. The second layer comprises a transparent carrier such as silicone mixed with a reflective media such as TiO | 09-18-2014 |
20140268791 | LIGHTING FIXTURES FOR SOLID-STATE LIGHT SOURCES - Lighting fixtures for solid-state light sources are disclosed. In one embodiment, a lighting fixture has a housing and one or more solid-state lighting sources mounted within the housing. The housing has a body, a lens assembly, and a removable lens adapter. To provide ambient lighting, the one or more solid-state lighting sources are mounted within the housing to emit light through the lens assembly. With regard to the lens assembly, the removable lens adapter is removably attached to the body of the housing so as to mount the lens assembly on the body. Since the removable lens adapter can be removed, different lens assemblies and different removable lens adapters can be selected to be used with the lighting fixture. Thus, the removable lens adapter and lens assembly can be selected from among a variety of different design choices so that the lighting fixture is tailored to a particular application. | 09-18-2014 |
20140268790 | AMBIENT LIGHT MONITORING IN A LIGHTING FIXTURE - A lighting fixture employing a solid-state light source and an ambient light sensor is disclosed. The solid-state light source is placed within a light source housing and configured to emit light through a lens assembly that covers an opening into a mixing chamber provided within the light source housing. In one embodiment, the ambient light sensor is located within mixing chamber with the solid-state light source. In another embodiment, the ambient light sensor is located outside of the mixing chamber. In either embodiment, the ambient light sensor may be recessed within a waveguide, which aides in controlling the sensor distribution beam for the ambient light sensor. The sensor distribution beam essentially defines an area from which light reflected off of a task surface is accurately monitored via the ambient light sensor. The direction of the sensor distribution beam and the light emitted from the ambient light sensor may generally coincide. | 09-18-2014 |
20140268778 | SOLID STATE LIGHTING APPARATUS AND METHODS USING INTEGRATED DRIVER CIRCUITRY - A lighting apparatus includes a first substrate including a switching circuit, the switching circuit including a first port, a second port and a current control circuit configured to generate a current at the second port of the current control circuit responsive to a varying voltage at the first port. The apparatus further includes a second substrate mounted on the first substrate and including at least two LEDs electrically coupled to the second port of the current control circuit of the first substrate. | 09-18-2014 |
20140268772 | LED LAMP - A LED lamp has a base and an at least partially optically transmissive enclosure connected to the base. A heat sink is partially disposed in the enclosure and supports a plurality of LEDs. The heat sink comprising a mounting portion positioned in the enclosure for supporting the LEDs and a heat dissipating portion exposed to the ambient environment where the interior of the enclosure is exposed to the ambient environment. The heat sink have a plurality of separate heat sink structures that are mounted to the lamp independently of one another. Each heat sink structure may have a thickness of approximately 1-5 mm. Each heat sink structure may in some embodiments weigh approximately 3.8 to 7.7 grams and in other embodiments weigh approximately 27 grams. | 09-18-2014 |
20140268771 | LED LUMINAIRE WITH IMPROVED THERMAL MANAGEMENT AND NOVEL LED INTERCONNECTING ARCHITECTURE - A LED lamp includes an optically transmissive enclosure and a base connected to the enclosure. LEDs are mounted on a ribbon for emitting light when energized though an electrical path from the base. The mounting ribbon for the LEDs has a surface that is positioned adjacent an interior surface of the enclosure for transmitting heat from the plurality of LEDs to the enclosure. | 09-18-2014 |
20140268765 | LINEAR LIGHTING DEVICE - A linear lighting device includes a body, a light source holder, and a light source. The body has a top portion, a bottom portion, and a rear portion. The light source holder has a holding member and an attachment member. The attachment member of the light source holder is secured to the rear portion of the body. Further, the light source is disposed on the holding member of the light source holder. A lighting device also includes a cover. The cover has a first end and a second end, and is movable between an open position and a closed position. The first end of the cover is pivotably secured to the bottom portion of the body and the second end of the cover is adapted to be fixedly secured to the top portion of the body. | 09-18-2014 |
20140268762 | Multi-Layer Polymeric Lens and Unitary Optic Member for LED Light Fixtures and Method of Manufacture - A unitary optic member for directing light from a plurality of LED light sources on a board beneath the optic member, the optic member having a plurality of lens portions surrounded by and interconnected by a non-lens portion and comprising: a first molded polymeric layer forming (a) the non-lens portion and (b) an outermost layer of each of the lens portions, the outermost layer of each lens portion forming a pocket-space at such lens portion; and for each lens portion, a second molded polymeric layer overmolded onto the first polymeric layer within the corresponding pocket-space. The invention includes an LED light fixture with such a unitary optic member. Another aspect of the invention is a multi-layer polymeric lens for directing light from an LED light source, the lens defining a lens optical footprint and at least one of the polymeric layers being less than coextensive with the lens optical footprint. | 09-18-2014 |
20140268761 | One-Piece Multi-Lens Optical Member and Method of Manufacture - An LED light fixture includes a heat-sink, a circuit board thereon and having a plurality of spaced LED light sources, and a one-piece optical member with a plurality of secondary lenses over corresponding LED light sources, the one-piece optical member comprises (a) each of the lenses having at least one layer of a polymeric material which extends into a lens flange of such material that surrounds the lens and is spaced from the other lenses and (b) a polymeric carrier portion surrounding the lenses, overlapping and molded onto to the lens flanges across such overlapping, and extending to a peripheral edge. The polymeric materials may be different; e.g., the lens layer and lense flanges being an acrylic and the carrier being a polycarbonate. The innermost lens layer may be of an LSR material. The invention is also such one-piece optical member and a method of manufacturing such member. | 09-18-2014 |
20140268750 | LIGHTING FIXTURE WITH REFLECTOR AND TEMPLATE PCB - The present invention relates to different embodiments of lighting fixtures, such as high bay lighting fixtures, comprising one or more improved features. Some of these features include the direct mounting of emitters on a heat sink and/or the use of a template-like board for providing an electrical connection between emitters. These features can improve heat dissipation from the emitters and simplify fabrication. In other embodiments, expensive lens optics of prior art SSL fixtures can be replaced with a flat lens and reflector in order to produce a fixture having a satisfactory spacing criterion. | 09-18-2014 |
20140268748 | SURFACE AMBIENT WRAP LIGHT FIXTURE - A modular fixture that is well-suited for use with solid state light sources, such as LEDs, to provide a surface ambient light (SAL). The fixture comprises two structural components: a housing subassembly and a lighting subassembly. These two subassemblies may be removably attached to operate as a singular fixture. Many different lighting subassemblies may be compatible with a single housing subassembly and vice versa. The housing subassembly comprises a frame that is mountable to an external structure. The lighting subassembly comprises the light sources and optical elements that tailor the light to achieve a particular profile. Electronics necessary to power and control the light sources may be disposed in the lighting subassembly. Various mount mechanisms may be used to attach the fixture to a surface such as a ceiling or a wall. Multiple fixtures can be connected serially to provide an extended linear fixture. | 09-18-2014 |
20140268737 | DIRECT VIEW OPTICAL ARRANGEMENT - The present disclosure relates to a lighting fixture that has a light source housing that forms a mixing chamber with an opening for a lens assembly having a central area that is bound by a perimeter line. The lens assembly is mounted over the opening. The central area and the perimeter line need not be visible and are simply used to define how one or more LED arrays are mounted within the mixing chamber. The one or more LED arrays are mounted within the mixing chamber and adapted to emit light having a central axis, wherein the central axis passes through and along a portion of the perimeter. | 09-18-2014 |
20140268732 | MULTI-POINT TO SINGLE POINT OPTIC - A lighting component having an optic is provided. The optic includes a body formed from a plurality of partial elliptical bodies. Each partial elliptical body is substantially elliptical about a source focal point and a common focal point. Each source focal point for the partial elliptical bodies is disparately located and each common focal point for the plurality of partial elliptical bodies is collocated. The body of the optic has a common outlet proximate the common focal point and a plurality of source inlets where each source inlet of the plurality of source inlets is proximate the source focal point for a corresponding one of the plurality of partial elliptical tubes. | 09-18-2014 |
20140268730 | LIGHTING FIXTURE WITH BRANCHING HEAT SINK AND THERMAL PATH SEPARATION - The present invention relates to different embodiments of lighting fixtures, such as high bay lighting fixtures, comprising improved features. One of these features can be a driver box placement that is displaced from the center of the fixture. In one such embodiment, the driver box can be mounted such that no portion is over the emitters. Another improved features is a heat sink with branching spokes. As they move away from the center of the heat sink, each of the spokes can branch into multiple spokes, which can improve conductive thermal dissipation. Empty spaces can be left between the spokes to improve convective thermal dissipation. | 09-18-2014 |
20140268728 | LIGHT EMITTER COMPONENTS, SYSTEMS, AND RELATED METHODS - Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects. | 09-18-2014 |
20140268720 | LINEAR LIGHT FIXTURE WITH INTERCHANGEABLE LIGHT ENGINE UNIT - A modular troffer-style fixture that is well-suited for use with solid state light sources, such as LEDs, to provide a surface ambient light (SAL). The fixture comprises two structural components: a housing subassembly and a lighting subassembly. These two subassemblies may be removably attached to operate as a singular fixture. Many different lighting subassemblies may be compatible with a single housing subassembly and vice versa. The housing subassembly comprises a body that is mountable to an external structure. The lighting subassembly comprises the light sources and optical elements that tailor the light to achieve a particular profile. Electronics necessary to power and control the light sources may be disposed in the housing subassembly, the lighting subassembly, or both. Various mount mechanisms may be used to attach the fixture to a surface such as a ceiling or a wall. Multiple fixtures can be connected serially to provide an extended continuous fixture. | 09-18-2014 |
20140268631 | REMOTE LUMIPHOR SOLID STATE LIGHTING DEVICES WITH ENHANCED LIGHT EXTRACTION - Solid state light emitting devices include lumiphor elements that are spatially segregated from electrically activated solid state emitters with an intermediately arranged optical element (including but not limited to a dichroic filter). Curved or faceted optical elements, and curved or faceted reflectors, may be employed. Multiple solid state emitters may be arranged in multiple reflector cups or recesses. Characteristics of optical elements and/or lumiphor elements of such devices may be varied with respect to angular position. | 09-18-2014 |
20140266125 | Buck-Boost Voltage Converter Circuits for Solid State Lighting Apparatus - A voltage converter includes a converter circuit and a control circuit coupled to the converter circuit and configured to selectively operate the converter circuit in a boost mode or a floating buck mode in response to a level of an input voltage supplied to the voltage converter circuit. The converter circuit may further include an inductor, a first control switch coupled to the control circuit, and a second control switch coupled to the control circuit. The control circuit may be configured to control a state of the first control switch in the boost mode in response to a level of current in the inductor, and the control circuit may be configured to control a state of the second control switch in the floating buck mode in response to the level of current in the inductor. | 09-18-2014 |
20140265930 | REPLACEABLE LIGHTING FIXTURE COMPONENTS - A lighting fixture includes a driver module and a separate light engine module, which has a solid-state light source and light engine memory. The driver module is electrically coupled to the light engine module and configured to drive the solid-state light source based on drive data. The drive data defines how the driver module should drive the solid-state light source to generate light with at least one defined lighting characteristic. The drive data may define or be used to identify the signal characteristics, such as drive currents, voltages, waveforms, and the like that must be provided by the driver module to drive the solid-state light source. The drive data is stored in the light engine memory of the light engine module, and the driver module is configured to retrieve the drive data from the light engine memory and drive the solid-state light source based on the drive data. | 09-18-2014 |
20140265922 | LIGHTING APPARATUS AND METHODS USING RECONFIGURABLE DIMMING MAPPING - A lighting apparatus includes at least one light emitting device and a reconfigurable driver circuit configured to drive the at least one light emitting device with an intensity that varies responsive to a dimming signal according to an adjustable mapping of the dimming signal to output of the light emitting device. In some embodiments, the mapping may be configurable using circuit component selection. In further embodiments, the mapping may be provided by a data input. | 09-18-2014 |
20140265921 | Solid State Lighting Apparatus and Methods of Forming - A light emitting device can include a solid state lighting source and a luminophoric medium for down-converting at least some of the radiation emitted by the solid state lighting source. The luminophoric medium may include a first material that down-converts the radiation emitted by the solid state lighting source to radiation having a first peak wavelength and that has a first decay time. The luminophoric medium may include a second material that down-converts the radiation emitted by the solid state lighting source to radiation having a second peak wavelength and that has a second decay time that is longer than the first decay time. | 09-18-2014 |
20140265895 | Damping Resonance In A Converter Including A Coupling Capacitor - A converter circuit includes an input filter including an input capacitor configured to filter electromagnetic interference from an input voltage. The converter circuit includes an output capacitor, a first inductor coupled to the input capacitor, a switch coupled to the first inductor and configured to control a level of current flowing in the first inductor, a coupling capacitor connected to the first inductor, and an output rectifier coupled between the coupling capacitor and the output capacitor. A damping circuit that is configured to damp a resonant frequency of the converter circuit is coupled in parallel with the coupling capacitor. | 09-18-2014 |
20140265888 | Lighting Apparatus Including a Current Bleeder Module for Sinking Current During Dimming of the Lighting Apparatus and Methods of Operating the Same - A lighting apparatus includes an input power terminal, a light source element coupled to the input power terminal, and a current bleeder module that is connected to the input power terminal and is configured to draw a current from the input power terminal responsive to a phase cut input power signal received at the input power terminal during a first portion of a period of the phase cut input power signal and is configured as an open circuit so as not to draw current from the input power terminal during a second portion of the period of the phase cut input power signal. | 09-18-2014 |
20140265886 | LIGHTING APPARATUS AND METHODS USING SWITCHED ENERGY STORAGE - A lighting apparatus includes a string of serially-connected light-emitting devices including at least a first segment and a second segment and a control circuit configured to control a relationship of light outputs of the first segment and the second segment by diverting current from a node of the string to at least one energy storage device and subsequently transferring energy from the at least one energy storage device to at least the first segment. The control circuit may be configured to divert the current responsive to a control input, such as a temperature and/or a dimming level. The at least one energy storage device may include at least one inductor. In some embodiments, the control circuit may control at least one color characteristic of light produced by the string. | 09-18-2014 |
20140265885 | MULTIPLE POWER OUTPUTS GENERATED FROM A SINGLE CURRENT SOURCE - A system includes a power converter that is configured to supply current to a plurality of output loads connected in series. At least one of the output loads is connected in parallel with a switch that switches in accordance with a duty cycle. The duty cycle may be set in accordance with a predetermined current ratio of average current flow through the output loads. | 09-18-2014 |
20140264960 | ENCAPSULATION OF ADVANCED DEVICES USING NOVEL PECVD AND ALD SCHEMES - Embodiments of a multi-layer environmental barrier for a semiconductor device and methods of manufacturing the same are disclosed. In one embodiment, a semiconductor device is formed on a semiconductor die. The semiconductor die includes a semiconductor body and a passivation structure on the semiconductor body. A multi-level environmental barrier is provided on the passivation structure. The multi-layer environmental barrier is a low-defect multi-layer dielectric film that hermetically seals the semiconductor device from the environment. In one embodiment, the multi-layer environmental barrier has a defect density of less than 10 defects per square centimeter (cm | 09-18-2014 |
20140264868 | WAFER-LEVEL DIE ATTACH METALLIZATION - Embodiments of a semiconductor wafer having wafer-level die attach metallization on a back-side of the semiconductor wafer, resulting semiconductor dies, and methods of manufacturing the same are disclosed. In one embodiment, a semiconductor wafer includes a semiconductor structure and a front-side metallization that includes front-side metallization elements for a number of semiconductor die areas. The semiconductor wafer also includes vias that extend from a back-side of the semiconductor structure to the front-side metallization elements. A back-side metallization is on the back-side of the semiconductor structure and within the vias. For each via, one or more barrier layers are on a portion of the back-side metallization that is within the via and around a periphery of the via. The semiconductor wafer further includes wafer-level die attach metallization on the back-side metallization other than the portions of the back-side metallization that are within the vias and around the peripheries of the vias. | 09-18-2014 |
20140264713 | GATE CONTACT FOR A SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF - Embodiments of a gate contact for a semiconductor device and methods of fabrication thereof are disclosed. In one embodiment, a semiconductor device includes a semiconductor structure and a dielectric layer on a surface of the semiconductor structure, where the dielectric layer has an opening that exposes an area of the semiconductor structure. A gate contact for the semiconductor device is formed on the exposed area of the semiconductor structure through the opening in the dielectric layer. The gate contact includes a proximal end on a portion of the exposed area of the semiconductor structure, a distal end opposite the proximal end, and sidewalls that each extend between the proximal end and the distal end of the gate contact. For each sidewall of the gate contact, an air region separates the sidewall and the distal end of the gate contact from the dielectric layer. | 09-18-2014 |
20140264579 | Field Effect Transistor Devices with Buried Well Regions and Epitaxial Layers - A method of forming a transistor device includes providing a drift layer having a first conductivity type and an upper surface, forming first regions in the drift layer and adjacent the upper surface, the first regions having a second conductivity type that is opposite the first conductivity type and being spaced apart from one another, forming a body layer on the drift layer including the source regions, forming spaced apart source regions in the body layer above respective ones of the first regions, forming a vertical conduction region in the body layer between the source regions, the vertical conduction region having the first conductivity type and defining channel regions in the body layer between the vertical conduction region and respective ones of the source regions, forming a gate insulator on the body layer, and forming a gate contact on the gate insulator. | 09-18-2014 |
20140264564 | Field Effect Transistor Devices with Buried Well Protection Regions - A method of forming a transistor device includes providing a drift layer having a first conductivity type, forming a first region in the drift layer, the first region having a second conductivity type that is opposite the first conductivity type, forming a body layer on the drift layer including the first region, forming a source layer on the body layer, forming a trench in the source layer and the body layer above the first region and extending into the first region, forming a gate insulator on the inner sidewall of the trench, and forming a gate contact on the gate insulator. | 09-18-2014 |
20140264563 | Field Effect Transistor Devices with Protective Regions - A transistor device includes a first conductivity type drift layer, a second conductivity type first region in the drift layer, a body layer having the second conductivity type on the drift layer including the first region, a source layer on the body layer, and a body contact region that extends through the source layer and the body layer and into the first region. The transistor device further includes a trench through the source layer and the body layer and extending into the drift layer adjacent the first region. The trench has an inner sidewall facing away from the first region. A gate insulator is on the inner sidewall of the trench, and a gate contact is on the gate insulator. | 09-18-2014 |
20140264562 | Field Effect Transistor Devices with Regrown P-Layers - A transistor device includes a drift layer having a first conductivity type, a body layer on the drift layer, the body layer having a second conductivity type opposite the first conductivity type, and a source region on the body layer, the source region having the first conductivity type. The device further includes a trench extending through the source region and the body layer and into the drift layer, a channel layer on the inner sidewall of the trench, the channel layer having the second conductivity type and having an inner sidewall opposite an inner sidewall of the trench, a gate insulator on the inner sidewall of the channel layer, and a gate contact on the gate insulator. | 09-18-2014 |
20140264381 | SEMICONDUCTOR DEVICE WITH SELF-ALIGNED OHMIC CONTACTS - A method of fabricating a semiconductor device includes providing one or more semiconductor layers, providing a gate contact on a first surface of the one or more semiconductor layers, then using the gate contact as a mask to deposit a source contact and a drain contact on the first surface of the one or more semiconductor layers, such that the source contact and the drain contact include an interior edge that is laterally aligned with a different lateral edge of the gate contact. | 09-18-2014 |
20140256072 | Semiconductor Light Emitting Device Packages and Methods - A submount for a light emitting device package includes a substrate with a first bond pad and a second bond pad on a first surface. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are on the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. | 09-11-2014 |
20140255038 | VISIBLE LIGHT COMMUNICATION VIA SOLID STATE LIGHTING DEVICES - A solid-state lighting fixture includes a first group of solid-state light elements, a second group of solid-state light elements, and a light control module. The first group of solid-state light elements is configured to emit visible light at a first wavelength. The second group of solid-state light elements is configured to emit light at a second wavelength, which is different from the first wavelength. The light control module is configured to modulate the light emitted from the first group of solid-state light elements and modulate the light emitted from the second group of solid-state light elements, respectively, such that the modulation pattern of the emitted light from each one of the first group of solid-state light elements and the second group of solid-state light elements communicates a first subset of data and a second subset of data, respectively, while being undetectable to the human eye. | 09-11-2014 |
20140254199 | SOLID STATE LIGHTING APPARATUS INCLUDING ISOLATED SOLID STATE LIGHTING DRIVER CIRCUITS AND RELATED SOLID STATE LIGHTING COVERS, HOUSINGS, AND LENSES - A solid state lighting apparatus can include an electrical connector that is configured to couple to a standardized electrical fixture, where the electrical connector provides a recess therein. A cover can be coupled to the electrical connector to cover the recess and a solid state lighting driver circuit can be located beneath the cover. A solid state lighting housing, that is separate from the electrical connector and the cover, can be configured to house a solid state light emitting device and at least one flexible wire can electrically couple the solid state lighting driver circuit to the solid state light emitting device. | 09-11-2014 |
20140254179 | Light Fixture with Facilitated Thermal Management - A light fixture including at least one LED emitter and at least one LED power-circuitry unit within an enclosure formed by a base and a cover movably secured with respect to the base. The at least one LED emitter is secured with respect to the base and in thermal communication therewith. The at least one LED power-circuitry unit is secured with respect to the base such that, when the cover is closed, the power-circuitry unit is in thermal communication with the cover. During operation primary heat transfer from the power-circuitry unit and primary heat transfer from the LED emitter(s) are to separate enclosure members. | 09-11-2014 |
20140254161 | Light-Directing Apparatus with Protected Reflector-Shield and Lighting Fixture Utilizing Same - A light-directing apparatus for predominantly forward distribution of light from a light emitter having an emitter axis. The light-directing apparatus includes a forward-reflective surface entirely within a lens member positioned over the light emitter. The lens member has an outer surface and an inner cavity including an emitter-light-receiving void and a light-reflecting void which is contiguous with the emitter-light-receiving void and is different in configuration than the emitter-light-receiving void. The forward-reflective surface is in the light-reflecting void in position in the path of light emitted rearwardly. | 09-11-2014 |
20140253056 | Power Supply with Adaptive-Controlled Output Voltage - A power supply circuit includes a pre-regulator configured to receive an input voltage and to generate an output voltage, and a switching current regulator coupled to an output of the pre-regulator and configured to regulate a level of current supplied to an output load. The switching current regulator is controlled by a switching signal having a duty cycle. The circuit further includes a controller that generates the switching signal. The controller monitors the duty cycle of the switching signal and controls a level of the output voltage generated by the pre-regulator by providing a control signal in response to the duty cycle of the switching signal. | 09-11-2014 |
20140252967 | SOLID STATE LIGHTING APPARATUS AND CIRCUITS INCLUDING LED SEGMENTS CONFIGURED FOR TARGETED SPECTRAL POWER DISTRIBUTION AND METHODS OF OPERATING THE SAME - A dimmable solid state lighting apparatus can include a plurality of light emitting diode (LED) segments including a first LED segment that can have a targeted spectral power distribution for light emitted from the apparatus that is different than spectral power distributions for other LED segments included in the plurality of LED segments. An LED segment selection circuit can be configured to selectively control current through the plurality of LED segments to shift the light emitted by the apparatus to the targeted spectral power distribution responsive to dimming input. | 09-11-2014 |
20140252940 | Light Fixture - An LED light fixture including a heat-sink body having a circuit-board mounting surface and an aperture member supported over the circuit-board mounting surface and forming an optical aperture. An LED circuit board is affixed in thermal-contact relationship to the circuit-board mounting surface in position between the mounting surface and the aperture member, the circuit board having an LED-populated area and a surrounding non-LED-populated area which extends beyond the optical aperture. In some other embodiments, the fixture is a low-profile LED light fixture including a cover and a base plate which has a substantially planar back surface, a front surface and heat-dissipating surfaces extending forward from the front surface. An LED circuit board and at least one LED power-circuitry unit, which are secured with respect to the front surface along side the heat-dissipating surfaces, do not extend behind the back surface of the base plate. The aspect ratio of the cross-section of the fixture orthogonal to the base plate between the back surface of the base plate and a forwardmost surface of the cover is greater than about 6. | 09-11-2014 |
20140246978 | SOLID STATE LIGHTING APPARATUS WITH ELECTRICAL CONNECTORS INCLUDING PORTIONS OF DRIVER CIRCUITS - A solid state lighting apparatus can include an electrical connector that is configured to releasably couple to a standardized electrical fixture having ac voltage provided thereat, where the electrical connector includes an opening that is configured to provide a recess in the electrical connector including an interior contact to provide the ac voltage in the recess when connected to the standardized electrical fixture. A protective circuit stage of a solid state lighting driver circuit can be in the recess to electrically coupled to the interior contact. An electrical wire can include a first portion that can be electrically coupled to the protective circuit stage in the recess and a second portion that is outside the recess. A solid state lighting housing can be configured to releasably couple to the second portion of the electrical wire. | 09-04-2014 |
20140246790 | FLOATING BOND PAD FOR POWER SEMICONDUCTOR DEVICES - Embodiments of a semiconductor device including a floating bond pad are disclosed. In one preferred embodiment, the semiconductor device is a power semiconductor device. In one embodiment, the semiconductor device includes a substrate that includes an active area and a control contact area, a first bond pad on the active area, a floating control bond pad on the control contact area and laterally extending over a portion of the first bond pad, and a dielectric between the portion of the first bond pad and the floating control bond pad. The floating control bond pad enables the active area to extend below the floating control bond pad, which in turn decreases a size of the power semiconductor device for a particular rated current or, conversely, increases a size of the active area and thus a rated current for a particular semiconductor die size. | 09-04-2014 |
20140246699 | TUNNEL JUNCTION FIELD EFFECT TRANSISTORS HAVING SELF-ALIGNED SOURCE AND GATE ELECTRODES AND METHODS OF FORMING THE SAME - Methods of forming a transistor include providing a semiconductor epitaxial structure including a channel layer and barrier layer on the channel layer, forming a gate electrode on the barrier layer, etching the semiconductor epitaxial structure using the gate electrode as an etch mask to form a trench in the semiconductor epitaxial structure, and depositing a source metal in the trench. The trench extends at least to the channel layer, and the source metal forms a Schottky junction with the channel layer. Related semiconductor device structures are also disclosed. | 09-04-2014 |
20140246681 | HIGH CURRENT, LOW SWITCHING LOSS SiC POWER MODULE - A power module includes a housing with an interior chamber and multiple switch modules mounted within the interior chamber of the housing. The switch modules are interconnected and configured to facilitate switching power to a load. Each one of the switch modules includes at least one transistor and at least one diode. The at least one transistor and the at least one diode may be formed from a wide band-gap material system, such as silicon carbide (SiC), thereby allowing the power module to operate at high frequencies with lower switching losses when compared to conventional power modules. | 09-04-2014 |
20140240974 | HIGH VOLTAGE ARRAY LIGHT EMITTING DIODE (LED) DEVICES AND FIXTURES - High voltage array light emitting devices and fixtures are disclosed. In one embodiment a light emitting device can include a submount, a light emission area disposed over the submount and a retention material adapted to be dispensed about the light emission area. The light emitting device can be operable at high voltages which are greater than approximately 40 volts (V). In one aspect, the retention material can be least partially disposed within the light emission area such that the retention material physically separates a first section of the light emission area from a second section of the light emission area. | 08-28-2014 |
20140240039 | ENHANCED DOHERTY AMPLIFIER - The disclosure relates to an enhanced Doherty amplifier that provides significant performance improvements over conventional Doherty amplifiers. The enhanced Doherty amplifier includes a power splitter, combining node, a carrier path, and a peaking path. The power splitter is configured to receive an input signal and split the input signal into a carrier signal provided at a carrier splitter output and a peaking signal provided at a peaking splitter output. The carrier path includes carrier power amplifier circuitry, a carrier input network coupled between the carrier splitter output and the carrier power amplifier circuitry, and a carrier output network coupled between the carrier power amplifier circuitry and the Doherty combining node. The peaking path includes peaking power amplifier circuitry, a peaking input network coupled between the peaking splitter output and the peaking power amplifier circuitry, and a carrier output network coupled between the power amplifier circuitry and the Doherty combining node. | 08-28-2014 |
20140239848 | DYNAMIC LIGHT EMITTING DEVICE (LED) LIGHTING CONTROL SYSTEMS AND RELATED METHODS - Dynamic light emitting device (LED) lighting adjustment systems and related methods are disclosed. In one aspect, a method can receive, at an LED lighting fixture, a lighting adjustment signal corresponding to a target lighting level and determine a delta value that represents a difference between a current lighting level of the LED lighting fixture and the target lighting level and a step time value associated with the determined delta value. The method can further include adjusting the current lighting level of the LED lighting fixture to a new current lighting level for the duration of the step time value and repeating the determining and adjusting steps until the new current lighting level equals the target lighting level. | 08-28-2014 |
20140239808 | GLARE-REACTIVE LIGHTING APPARATUS - A system includes at least one lighting device, e.g., at least one LED luminaire, and a control circuit configured to control a spectral output produced by the at least one lighting device responsive to environmental information about an area illuminated by the at least one lighting device. The control circuit may be configured to control a color temperature of the illumination responsive to the environmental information. In some embodiments, the control circuit may be configured to lower the color temperature of the illumination responsive to the environmental information indicating a level of reflected light and/or a weather condition, such as precipitation, correlated with the presence or likely presence of glare. | 08-28-2014 |
20140239794 | GAS COOLED LED LAMP - In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen. | 08-28-2014 |
20140239325 | LIGHT EMITTER COMPONENTS AND METHODS HAVING IMPROVED PERFORMANCE - Light emitter components and methods having improved performance and related methods are disclosed. In one embodiment, a light emitter component can include a submount and at least one light emitting diode (LED) chip disposed over the submount. The submount can contact at least two different sides of the at least one LED chip. In one aspect, a submount can include surface portions adapted to receive portions one or more LED chips. In one aspect, one or more LED chips can be embedded within the submount. | 08-28-2014 |
20140239316 | LIGHT EMITTER PACKAGES AND METHODS - Light emitter packages and related methods having improved performance are disclosed. In one aspect, a light emitter package can include at least one light emitter chip disposed over a substrate or submount. In some aspects, the package can include a reflective polymeric material or polymeric reflector (sometimes referred to as a “solder mask” or “solder mask material”), a reflective material, and a conductive material disposed adjacent each other within a portion of the light emitter package. In some aspects, the reflective material can include a metallic material or metallic reflector applied to side walls of traces and/or within portions of a gap between traces prior to application of the reflective polymeric material within the gap. | 08-28-2014 |
20140239308 | MIX DOPING OF A SEMI-INSULATING GROUP III NITRIDE - Embodiments of a semi-insulating Group III nitride and methods of fabrication thereof are disclosed. In one embodiment, a semi-insulating Group III nitride layer includes a first doped portion that is doped with a first dopant and a second doped portion that is doped with a second dopant that is different than the first dopant. The first doped portion extends to a first thickness of the semi-insulating Group III nitride layer. The second doped portion extends from approximately the first thickness of the semi-insulating Group III nitride layer to a second thickness of the semi-insulating Group III nitride layer. In one embodiment, the first dopant is Iron (Fe), and the second dopant is Carbon (C). In another embodiment, the semi-insulating Group III nitride layer is a semi-insulating Gallium Nitride (GaN) layer, the first dopant is Fe, and the second dopant is C. | 08-28-2014 |
20140232297 | SOLID STATE LIGHTING SWITCHES AND FIXTURES PROVIDING DIMMING AND COLOR CONTROL - A solid state lighting switch can include a first input control that can be configured to adjust a dimming indication or color indication for a solid state lighting fixture that is configured for coupling to the solid state lighting switch. A selective linking mechanism can be configured to activate a linked mode of operation of the switch to link the dimming indication to the color indication or to activate an unlinked mode of operation of the switch to unlink the dimming indication from the color indication. | 08-21-2014 |
20140232289 | SOLID STATE LIGHTING APPARATUSES AND RELATED METHODS - Solid state lighting apparatuses and related methods are described. In certain embodiments, a solid state lighting apparatus adapted to operate with alternating current (AC) received from an AC power source is provided. The lighting apparatus can include a substrate and an array of solid state light emitters arranged on or supported by the substrate. Multiple solid state light emitter sets of the array can be arranged to be activated and/or deactivated at different times relative to one another during a portion of an AC cycle. The lighting apparatus can also include at least one reflective structure arranged between one or more solid state light emitters and at least one driver circuit component, to reduce or eliminate absorption by the driver circuit component(s) of light generated by the solid state light emitter(s). | 08-21-2014 |
20140232288 | SOLID STATE LIGHTING APPARATUSES AND RELATED METHODS - Solid state lighting apparatuses are adapted to operate with alternating current (AC) received directly from an AC power source. An exemplary apparatus includes a substrate and multiple sets of one or more solid state light emitters disposed over the substrate. Multiple sets of solid state light emitters can be configured to be activated and/or deactivated at different times relevant to one another during portions of an AC cycle, and may optionally have different duty cycles. Emitter configurations, color combinations, and/or circuit components may reduce perceivable flicker, color shifts, and/or spatial variations in luminous flux. Color temperature and/or beam pattern may be adjusted. Multiple emitters may be arranged along non-coplanar substrate portions. | 08-21-2014 |
20140218987 | POWER SUPPLY WITH LOW ELECTRO-MAGNETIC INTERFERENCE AND INDUCTOR FOR POWER SUPPLY WITH LOW ELECTRO-MAGNETIC INTERFERENCE - A power supply circuit includes an input configured to receive an input voltage, an output configured to supply an output voltage, at least one inductor, at least one diode, and at least one switch. The inductor may have a parasitic capacitance less than about 100 pF. Related inductors are also disclosed. | 08-07-2014 |
20140218944 | Mounting Assembly for Light Fixture - A mounting assembly for securing a light fixture to a static structure. The mounting assembly includes a bar and a securing member which has a bar-gripping portion and an arm portion extending from the bar-gripping portion and attachable to the static structure. The bar is secured with respect to a main body portion of the light fixture. The bar has an axis. The arm portion has an arm axis which is substantially orthogonal to the bar axis. In another aspect of this invention, the mounting assembly includes a fixture-holding portion and an arm portion secured to the fixture-holding portion. The fixture-holding portion is secured with respect to the light fixture. The arm portion configured for selective attachment to a substantially cylindrical static structure and a substantially planar surface. | 08-07-2014 |
20140218941 | LED Light Fixture - An LED light fixture including a housing and an LED assembly secured with respect to the housing. The LED assembly includes a heat sink and an LED illuminator secured with respect to an LED-supporting region of the heat sink with heat-dissipating surfaces extending therefrom. The heat sink having front, rear and lateral sides and being open to ambient-fluid flow to and from the heat-dissipating surfaces along each of the sides. | 08-07-2014 |
20140218931 | LED LAMP WITH OMNIDIRECTIONAL LIGHT DISTRIBUTION - An LED based lamp has an optically transmissive enclosure connected to a base. The base may include a heat sink. A substrate is positioned in the enclosure and supports a plurality of LEDs where the periphery of the substrate has alternating recessed portions and protruding portions that define a plurality of laterally extending projections. One LED is located on each of the projections to increase the amount of down light generated by the lamp. | 08-07-2014 |
20140217907 | SOLID STATE LIGHTING APPARATUS INCLUDING SEPARATELY DRIVEN LED STRINGS AND METHODS OF OPERATING THE SAME - A solid state lighting apparatus can include a first string of Light Emitting Diodes (LEDs) that is configured to operate in response to a rectified ac voltage having a cycle including a null time interval when the first string is off and a second string of LEDs, that is separate from the first string of LEDs, and can be configured to emit light during at least a portion of the null time interval. | 08-07-2014 |
20140217436 | SUBMOUNT-FREE LIGHT EMITTING DIODE (LED) COMPONENTS AND METHODS OF FABRICATING SAME - Light emitting devices include a Light Emitting Diode (LED) chip having an anode contact and a cathode contact on a face thereof. A solder mask extends from the gap between the contacts onto one or both of the contacts. The LED chip may be mounted on a printed circuit board without an intervening submount. Related fabrication methods are also described. | 08-07-2014 |
20140217435 | Light Emitting Diodes with Low Junction Temperature and Solid State Backlight Components Including Light Emitting Diodes with Low Junction Temperature - A light emitting diode chip a support layer having a first face and a second face opposite the first face, a diode region on the first face of the support layer, and a bond pad on the second face of the support layer. The bond pad includes a gold-tin structure having a weight percentage of tin of 50% or more. The light emitting diode chip may include a plurality of active regions that are connected in electrical series on the light emitting diode chip. | 08-07-2014 |
20140217434 | LIGHT EMITTING DEVICES AND METHODS - Light emitting devices and methods such as light emitting diodes (LEDs) are disclosed for use in higher voltage applications. Variable arrangements of LEDs are disclosed herein. Arrangements can include one or more LED chips connected in series, parallel, and/or a combination thereof. LED chips can be disposed in a package body having at least one thermal element and one or more electrical components. | 08-07-2014 |
20140217326 | COATED PHOSPHORS AND LIGHT EMITTING DEVICES INCLUDING THE SAME - Provided according to embodiments of the invention are method of coating a phosphor that include contacting the phosphor with a sol comprising at least one of silica, alumina, borate and a precursor thereof, to form a coating on the phosphor; and heating the phosphor. Also provided are phosphors that are coated with alumina, silica and/or borate, and light emitting devices that include such phosphors. | 08-07-2014 |
20140213094 | CONNECTOR DEVICES, SYSTEMS, AND RELATED METHODS FOR CONNECTING LIGHT EMITTING DIODE (LED) MODULES - Connector devices, systems, and related methods for connecting light emitting diode (LED) modules to thermal substrates and/or optical elements are disclosed. In some aspects, a connector device can include a connector body having a first side configured to engage an LED module and a second side configured to engage an optical element for mechanically coupling the LED module to the optical element. The connector device can further include a housing configured to receive a portion of an electrical wire for electrically coupling the LED module to the electrical wire. A connector system can include an annular body defining an opening and at least one LED module disposed in a portion of the connector. The connector can be configured to cover a portion of the LED module and leave another portion of the LED module exposed or visible. | 07-31-2014 |
20140211504 | OPTICAL WAVEGUIDE ASSEMBLY AND LIGHT ENGINE INCLUDING SAME - An optical waveguide assembly includes a plurality of separate body sections each having a coupling cavity for receiving an LED element and a light extraction feature spaced from the coupling cavity, and a mounting structure surrounding the plurality of body sections that maintains the plurality of body sections in assembled relationship. The waveguide assembly may be incorporated into a light engine. | 07-31-2014 |
20140211503 | WAVEGUIDE BODIES INCLUDING REDIRECTION FEATURES AND METHODS OF PRODUCING SAME - According to one aspect, a waveguide includes a body exhibiting a total internal reflectance characteristic and having a first face and a second face opposite the first face wherein the first and second faces extend along a lateral direction and a coupling cavity adapted to receive a light emitting diode (LED) that is configured to direct light into the body. The body additionally includes an extraction feature disposed on one of the first and second faces and configured to direct light traveling through the body out of at least one of the first and second faces. The body further includes a redirection feature disposed at least in part between the first and second faces and disposed between the coupling cavity and the extraction feature along the lateral direction, and configured to redirect light traveling through the body laterally within the body. | 07-31-2014 |
20140211502 | OPTICAL WAVEGUIDES AND LUMINAIRES INCORPORATING SAME - According to one aspect, a waveguide includes a waveguide body having a coupling cavity extending therethrough and a plug member having a first portion disposed in the coupling cavity. The plug member includes an outer surface substantially conforming to the coupling cavity and a second portion extending from the first portion into the coupling cavity and a reflective surface adapted to direct light in the coupling cavity into the waveguide body. | 07-31-2014 |
20140211497 | Optical Waveguide and Lamp Including Same - An optical waveguide includes a body of optically transmissive material defined by outer edges and having a width substantially greater than an overall thickness thereof. The body of optically transmissive material includes a first side and a second side opposite the first side. An interior coupling cavity is defined by a surface intersecting the second side and extends from the second side toward the first side. The interior coupling cavity is disposed remote from edges of the body and is configured to receive an LED element. The body of optically transmissive material further includes a first array of light mixing cavities surrounding the interior coupling cavity and an extraction feature disposed on one of the first and second sides. The light extraction feature at least partially surrounds the interior coupling cavity. | 07-31-2014 |
20140211496 | CONSOLIDATED TROFFER - A dropped-ceiling lighting system having a reflector positioned in an opening in a grid used to suspend a dropped ceiling, a lighting device including a light source mounted adjacent to the reflector, a structural support securing the lighting device to the grid, and a power source for the lighting device. Also discloses is a dropped-ceiling lighting system comprised of a reflector attached to a plenum barrier positioned in an opening in a grid used to suspend a dropped ceiling, a power source extends from a first edge of the plenum barrier to a second edge of the plenum barrier, and a light source is mounted to the power source. | 07-31-2014 |
20140211495 | Optical Waveguide and Luminaire Incorporating Same - An optical waveguide includes a body of optically transmissive material having a width substantially greater than an overall thickness thereof. The body of material has a first side, a second side opposite the first side, and a plurality of interior bores extending between the first and second sides each adapted to receive a light emitting diode. Extraction features are disposed on the second side and the extraction features direct light out of at least the first side and at least one extraction feature forms a taper disposed at an outer portion of the body. | 07-31-2014 |
20140211470 | LED Lighting Fixture - An LED light fixture including a frame defining a forward open region and a rearward region with a rearmost portion adapted for securement to a support member. An LED assembly is secured with respect to the frame and positioned within the open forward region with open spaces remaining therebetween. The LED assembly includes an LED illuminator secured with respect to the LED-supporting region of a heat sink with an LED-supporting region and heat-dissipating surfaces extending therefrom. Another aspect of the invention is a non-metallic frame defining a forward open region and having a rearward region having a rearmost portion adapted for securement to a support member. An LED assembly is secured with respect to the frame and positioned within the open forward region with open spaces remaining therebetween. | 07-31-2014 |
20140211462 | LUMINAIRES USING WAVEGUIDE BODIES AND OPTICAL ELEMENTS - According to one aspect, a luminaire includes a waveguide body having an interior coupling cavity extending into a portion of the waveguide body remote from an edge thereof. The luminaire further includes an LED element extending into the interior coupling cavity having first and second sets of LEDs wherein each LED of the first set comprises a blue-shifted yellow LED and each LED of the second set comprises a red LED wherein the red LEDs are disposed between the blue-shifted yellow LEDs and wherein the blue-shifted yellow LEDs have a first height and the red LEDs have a second height less than the first height. The LED element further includes a lens disposed over the first and second sets of LEDs. | 07-31-2014 |
20140211457 | SIMPLIFIED LOW PROFILE MODULE WITIH LIGHT GUIDE FOR PENDANT, SURFACE MOUNT, WALL MOUNT AND STAND ALONE LUMINAIRES - A luminaire having a waveguide suspended beneath a mounting element, the waveguide has a first surface proximal to the mounting element, a second surface distal to the mounting element, and an edge between the first and the second surfaces. At least one cavity extends into the waveguide from the first surface to the second surface. A LED component is coupled to the waveguide so as to emit light into the cavity. LED support structures are also disclosed. | 07-31-2014 |
20140210364 | CIRCUITS AND METHODS FOR CONTROLLING SOLID STATE LIGHTING - A solid state lighting apparatus can include a plurality of light-emitting devices (LEDs) that are electrically coupled together in at least one string. The apparatus can further include a first LED segment that is configured to emit a first chromaticity light coupled across a first bypass circuit, a second LED segment that is configured to emit a second chromaticity light coupled across a second bypass circuit, and at least one additional LED segment that is configured to emit an additional chromaticity light coupled across a respective at least one additional bypass circuit. A control circuit can be configured to modulate the at least one additional bypass circuit, to cause the lighting apparatus to emit an additional v′ shift in a chromaticity value of light emitted by the string to vary substantially in conformance with a Planckian locus in response to a dimming input to the control circuit. | 07-31-2014 |
20140210355 | METHODS, CIRCUITS AND SYSTEMS FOR ADJUSTING CHROMATICITY OF SOLID STATE LIGHTING - A plurality of light-emitting devices (LEDs), included in at least a string, can include at least one first LED configured to emit first chromaticity light, at least one second LED configured to emit second chromaticity light, and at least one additional LED configured to emit additional chromaticity light, wherein the at least one string can be operated by modulating the first modulated LED segment and/or the at least one additional modulated LED segment based on respective specified chromaticity values of the plurality of LEDs to provide the light substantially in conformance with a Planckian locus. The chromaticity of the light emitted by the at least one string can b e measured to provide a measured chromaticity value and the modulation of the first modulated LED segment or the at least one additional modulated LED segment can be adjusted by a shift value based on a difference between the measured chromaticity value and a specified chromaticity value to provide an additional v′ shift in light toward the Planckian locus. | 07-31-2014 |
20140203729 | LIGHTING DEVICE HAVING GROUPS OF SOLID STATE LIGHT EMITTERS, AND LIGHTING ARRANGEMENT - A lighting device comprising first, second and third groups of solid state light emitters, the first group emitting light having a dominant wavelength of 430 to 490 nm, the second group at 525 to 575 (in some devices 540 to 575 nm), the third group at 610 to 640 nm. In some devices, wavelength of light from emitters in first and second groups, and light from second and third groups, differs by at least 70 nm. Some devices emit light having CRI Ra of at least 70 when first, second and third groups of emitters are illuminated. Also, a lighting arrangement comprising first, second and third groups as above, in addition to a fourth emitter emitting light of dominant wavelength outside the ranges for the first, second and third groups, and not more than 10 nm different from a dominant wavelength of a color on an item to be illuminated. | 07-24-2014 |
20140203717 | SOLID-STATE LIGHTING APPARATUS WITH FILAMENT IMITATION FOR USE WITH FLORESCENT BALLASTS - A lighting apparatus includes a solid-state lighting circuit, a ballast connection port including first and second terminals and a filament-imitating impedance coupled between the first and a second terminals of the ballast connection port and to an input terminal of the solid-state lighting circuit. The filament-imitating impedance may be configured to transfer power at a nominal frequency of an output produced by the ballast and to provide an impedance between the first and second terminals of the ballast connection port that prevents shutdown of the ballast. In some embodiments, the filament-imitating impedance may vary with temperature, e.g., the filament-imitating impedance may be configured to imitate a temperature dependence of a fluorescent tube filament. The lighting apparatus may be included in a fluorescent lamp replacement lamp. | 07-24-2014 |
20140203714 | LED LIGHTING APPARATUS FOR USE WITH AC-OUTPUT LIGHTING BALLASTS - A lighting apparatus includes at least one light emitting diode (LED) and a passive resonant converter circuit having an output coupled to the at least one LED and an input configured to be coupled to a ballast that produces an AC output. The passive resonant converter circuit may include a combination of a passive rectifier circuit, such as a passive diode bridge, and a resonant circuit, such as a CL resonant circuit. An input of the passive rectifier circuit may be configured to be coupled to the ballast and the resonant circuit and the at least one LED may be coupled to an output of the passive rectifier circuit. At least a portion of the passive resonant converter may be packaged with the at least one LED in a lamp and all or a portion of the passive resonant converter circuit may be packaged as a module or other unit for use with a lamp. | 07-24-2014 |
20140203320 | COMPOSITE HIGH REFLECTIVITY LAYER - A high efficiency light emitting diode with a composite high reflectivity layer integral to said LED to improve emission efficiency. One embodiment of a light emitting diode (LED) chip comprises an LED and a composite high reflectivity layer integral to the LED to reflect light emitted from the active region. The composite layer comprises a first layer, and alternating plurality of second and third layers on the first layer, and a reflective layer on the topmost of said plurality of second and third layers. The second and third layers have a different index of refraction, and the first layer is at least three times thicker than the thickest of the second and third layers. For composite layers internal to the LED chip, conductive vias can be included through the composite layer to allow an electrical signal to pass through the composite layer to the LED. | 07-24-2014 |
20140198503 | LIGHTING DEVICES COMPRISING SOLID STATE LIGHT EMITTERS - A lighting device comprising a trim element, an electrical connector and at least one solid state light emitter, the lighting device weighing less than one kilogram. If current of about 12 watts (or in some cases about 15 watts, or in some cases not more than about 15 watts) is supplied to the electrical connector, the at least one solid state light emitter will illuminate so that the lighting device will emit white light of at least 500 lumens. Also, a lighting device that weighs less than one kilogram and can generate white light of at least 500 lumens using a current of not more than about 15 watts. Also, a lighting device for mounting in a recessed housing, comprising a unitary structure trim element that conducts heat away from at least one solid state light emitter and dissipates at least some of the heat outside of the recessed housing. | 07-17-2014 |
20140197758 | POWER SUPPLY WITH INTERFACE AND EMBEDDED CONFIGURATION INFORMATION - A power supply system may include power supply circuitry configured to power an output load, and a processor configured to generate configuration information that configures a remote device with the capability to control the power supply circuitry. The processor may also be configured to transmit the configuration information with a network interface to the remote device in response to a triggering event associated with the remote device. In response to receipt of the configuration information, the remote device may be configured to generate a control interface. A user of the remote device may control the power supply circuitry through the control interface. | 07-17-2014 |
20140197750 | SYSTEMS AND METHODS FOR CONTROLLING SOLID STATE LIGHTING DURING DIMMING AND LIGHTING APPARATUS INCORPORATING SUCH SYSTEMS AND/OR METHODS - A lighting apparatus having a plurality of light-emitting devices (LEDs) can include at least one first LED that is configured to emit first chromaticity light, at least one second LED that is configured to emit second chromaticity light, and at least one additional LED that is configured to emit third chromaticity light. A control circuit can be operatively coupled to the plurality of light-emitting devices and configured to cause a color temperature produced by the plurality of LEDs to vary substantially in conformance with a Planckian locus in response to a dimming control input less than about 1800K. | 07-17-2014 |
20140197291 | Light Fixture Support Assembly - A mounting assembly for securing a fixture in a desired orientation. The assembly includes a fulcrum and an opposing structure each secured with respect to the fixture and positioned to receive a support member therebetween. The fulcrum defines a fulcrum plane and is positioned to pivotably engage one side of the support member. The assembly also includes at least one adjustable engager separately secured to the opposing structure for engaging the support member at position spaced from the fulcrum plane such that, when the support member is received between the fulcrum and the engager, adjustment of the engager holds the fixture in the desired orientation. In some embodiments, the fixture is a luminaire. | 07-17-2014 |
20140192529 | LED Apparatus and Method for Accurate Lens Alignment - An LED apparatus of the type including (a) a mounting board having an LED-supporting surface with an LED device thereon and (b) a lens member over the LED device establishing a light path therebetween. The inventive LED apparatus includes a lens-aligning member having front and back surfaces. The lens member includes a lens portion and a flange thereabout, the flange being attached to the front surface of the lens-aligning member such that the lens portion substantially surrounds the protruding LED device. The lens-aligning member has a first mating feature which is positioned and arranged for mating engagement with a second mating feature of the mounting board, thereby accurately aligning the lens member over the LED device by accurately aligning the lens-alignment member with the mounting board. Other aspects of the invention is a method for assembly of an LED apparatus and a method for manufacturing custom high-efficiency LED lensing for LED-array modules. | 07-10-2014 |
20140191660 | LIGHTING FIXTURE WITH INTEGRAL CIRCUIT PROTECTION FIELD - A lighting fixture includes a power input configured to be coupled to a power source, a power output configured to be coupled to an external load and a lighting device, such as a light emitting diode (LED) device, coupled to the power input and configured to provide illumination. The lighting fixture further includes a protection circuit coupled between the power input and the power output and configured to detect a condition of a power source coupled to the power input and to control power transmission between the power input and the power output responsive to the detected condition. The power output may be configured to support daisy-chain connection of the lighting fixture to at least one other lighting fixture, and the protection circuit may be configured to control power transmission to the at least one other lighting fixture responsive to the detected condition. | 07-10-2014 |
20140191653 | PROTECTIVE DIFFUSIVE COATING FOR LED LAMP - The present disclosure discloses LED lamps and enclosures comprising light transparent polymer coatings comprising light diffusing particles as well as methods for providing improved luminous intensity distribution. More particularly, the present disclosure relates to enclosures comprising light-transparent polymer coatings comprising a light diffusing particles on at least one surfaces of the enclosure of an LED lamp. | 07-10-2014 |
20140191648 | PROTECTIVE COATING FOR LED LAMP - The present disclosure discloses a method for providing protective coatings onto one or more surfaces of a frangible enclosure of an LED lamp and a lamp prepared therefrom. More particularly, the present disclosure relates to LED lamps comprising polymer coatings on at least one or more surfaces of an enclosure of an LED lamps. | 07-10-2014 |
20140191259 | MOLDED CHIP FABRICATION METHOD AND APPARATUS - A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices. | 07-10-2014 |
20140183584 | LED LAMP INCORPORATING REMOTE PHOSPHOR AND DIFFUSER WITH HEAT DISSIPATION FEATURES - LED lamps or bulbs are disclosed that comprise a light source, a heat sink structure and a remote phosphor carrier having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink. The phosphor carrier can have a three-dimensional shape and comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light passes through the phosphor carrier. The phosphor carrier converts at least some of the LED light, with some embodiments emitting a white light combination of LED and phosphor light. The phosphors in the phosphor carriers can operate at a lower temperature to have greater phosphor conversion efficiency and reduced heat related damage. The lamps or bulbs can also comprise a diffuser over the phosphor carrier to distribute light and conceal the phosphor carrier. | 07-03-2014 |
20140183577 | LIGHT EMITTING DEVICES FOR LIGHT EMITTING DIODES (LEDS) - Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed. | 07-03-2014 |
20140183568 | LED PACKAGE WITH FLEXIBLE POLYIMIDE CIRCUIT AND METHOD OF MANUFACTURING LED PACKAGE - A light emitting diode (LED) package may include a base, at least one light emitting die on the base, and a flextape on the base. The flextape includes at least one metal trace connected to the light emitting die. In a method of manufacturing the LED package, the base may be formed so as to include a basin and at least one light emitting die may be placed within the basin. The flextape may be provided to include at least one metal trace that is electrically connected to the light emitting die. | 07-03-2014 |
20140183553 | TRANSISTOR STRUCTURES HAVING REDUCED ELECTRICAL FIELD AT THE GATE OXIDE AND METHODS FOR MAKING SAME - A transistor device having reduced electrical field at the gate oxide interface is disclosed. In one embodiment, the transistor device comprises a gate, a source, and a drain, wherein the gate is at least partially in contact with a gate oxide. The transistor device has a P+ region within a JFET region of the transistor device in order to reduce an electrical field on the gate oxide. | 07-03-2014 |
20140183552 | TRANSISTOR STRUCTURES HAVING A DEEP RECESSED P+ JUNCTION AND METHODS FOR MAKING SAME - A transistor device having a deep recessed P+ junction is disclosed. The transistor device may comprise a gate and a source on an upper surface of the transistor device, and may include at least one doped well region, wherein the at least one doped well region has a first conductivity type that is different from a conductivity type of a source region within the transistor device and the at least one doped well region is recessed from the upper surface of the transistor device by a depth. The deep recessed P+ junction may be a deep recessed P+ implanted junction within a source contact area. The deep recessed P+ junction may be deeper than a termination structure in the transistor device. The transistor device may be a Silicon Carbide (SIC) MOSFET device. | 07-03-2014 |
20140177226 | LED Lighting Apparatus with Facilitated Heat Transfer and Fluid Seal - LED lighting apparatus including (a) a circuit board which has a plurality of light sources spaced thereon, (b) a heat sink to which the circuit board is thermally coupled, and (c) a securement structure which includes a rigid peripheral structure applying force along a peripheral area of the circuit board toward the heat sink to increase the thermal coupling therebetween to facilitate heat transfer from the light sources during operation. The lighting apparatus may also include an optical member with a plurality of lens portions over corresponding light sources and a peripheral region, the securement structure engaging the peripheral region which sandwiches a gasket against the heat sink. The apparatus may use manipulation involving surface convexity, such as bowing, thereby allowing the securement structure to further facilitate surface-to-surface thermal coupling between the circuit board and the heat sink. | 06-26-2014 |
20140175966 | LED LAMP - A lamp comprises an LED light source for emitting light. A combined heat sink and reflector is thermally coupled to the LED light source. The heat sink and reflector comprise an internal surface for reflecting the light and an exterior surface. The internal surface and the external surface are uncovered such that heat is dissipated from the interior surface and the exterior surface. | 06-26-2014 |
20140175664 | DIELECTRIC SOLDER BARRIER FOR SEMICONDUCTOR DEVICES - The present disclosure relates to a dielectric solder barrier for a semiconductor die. In one embodiment, a semiconductor die includes a substrate, a semiconductor body on a first surface of the substrate, one or more first metallization layers on the semiconductor body opposite the substrate, a via that extends from a second surface of the substrate through the substrate and the semiconductor body to the one or more first metallization layers, and a second metallization layer on the second surface of the substrate and within the via. A portion of the second metallization layer within the via provides an electrical connection between the second metallization layer and the one or more first metallization layers. The semiconductor die further includes a dielectric solder barrier on the second metallization layer. Preferably, the dielectric solder barrier is on a surface of the portion of the second metallization layer within the via. | 06-26-2014 |
20140175473 | LIGHT EMITTING DIODES INCLUDING LIGHT EMITTING SURFACE BARRIER LAYERS, AND METHODS OF FABRICATING SAME - A light emitting device includes a Light Emitting Diode (LED) having a light emitting surface, a silicon nitride layer on the light emitting surface and a sealed environment surrounding the light emitting surface. The silicon nitride layer may be directly on and cover the light emitting surface. The silicon nitride layer may completely cover the light emitting surface. The silicon nitride layer may provide a substance blocking layer such as a moisture blocking layer and/or a carbon blocking layer that can prevent moisture and/or carbon, such as Volatile Organic Compounds (VOCs) that contain carbon, from reaching the light emitting surface. | 06-26-2014 |
20140168989 | SOLID STATE LIGHT SOURCE EMITTING WARM LIGHT WITH HIGH CRI - Solid state light sources, lighting devices and lamps arranged to provide emission with a warm temperature and high CRI. One embodiment of a solid state lighting device according to the present invention comprises a light emitting diode (LED) device capable of emitting light in an emission spectrum. A filter arranged so that at least some light from the LED light source passes through it, with the filter filtering at least some of one or more portions of the light source emission spectrum. The resulting light source light has a different temperature but substantially the same CRI after passing through the filter. | 06-19-2014 |
20140167653 | EFFICIENT ROUTING TABLES FOR LIGHTING NETWORKS - Control of lighting fixtures in a lighting network may be distributed among the lighting fixtures. The lighting fixtures may be broken into groups that are associated with different lighting zones. At least some of the lighting fixtures will have or be associated with one or more sensors. Within the overall lighting network or the various lighting zones, the lighting fixtures may share sensor data from their sensors. Each lighting fixture may process sensor data provided by its own sensor, a remote standalone sensor, or lighting fixture, and process the sensor data according to the lighting fixture's own internal logic to control operation of the lighting fixture. The lighting fixtures may also receive control input from other lighting fixtures, control nodes, light switches, and commissioning tools. The control input may be processed along with the sensor data according to the internal logic to further enhance control of the lighting fixture. | 06-19-2014 |
20140167642 | HANDHELD DEVICE FOR COMMUNICATING WITH LIGHTING FIXTURES - Control of lighting fixtures in a lighting network may be distributed among the lighting fixtures. The lighting fixtures may be broken into groups that are associated with different lighting zones. At least some of the lighting fixtures will have or be associated with one or more sensors. Within the overall lighting network or the various lighting zones, the lighting fixtures may share sensor data from their sensors. Each lighting fixture may process sensor data provided by its own sensor, a remote standalone sensor, or lighting fixture, and process the sensor data according to the lighting fixture's own internal logic to control operation of the lighting fixture. The lighting fixtures may also receive control input from other lighting fixtures, control nodes, light switches, and commissioning tools. The control input may be processed along with the sensor data according to the internal logic to further enhance control of the lighting fixture. | 06-19-2014 |
20140167623 | COMMISSIONING FOR A LIGHTING NETWORK - The present disclosure relates to lighting fixtures for use in a lighting network where the lighting fixtures and other elements are able to communicate with each other via wired or wireless communication techniques. When the lighting network is being formed or modified, a lighting fixture is selected to act as a coordinator for forming the lighting network. For example, a user may employ a commissioning tool to select a particular lighting fixture as the coordinator. The coordinator will send out one or more ‘join my network’ messages toward the other elements of the lighting network. The elements that receive the ‘join my network’ message may respond in order to make the coordinator aware of their presence and join them to a lighting network. | 06-19-2014 |
20140167622 | AUTO COMMISSIONING LIGHTING FIXTURE - The present disclosure relates to lighting fixtures for use in a lighting network where the lighting fixtures and other elements are able to communicate with each other via wired or wireless communication techniques. When the lighting network is being formed or modified, the lighting fixtures may be able to communicate with each other and automatically determine a single lighting fixture to act as a coordinator during a commissioning process. The lighting fixtures can exchange their communication addresses, such as MAC addresses, wherein the lighting fixture with the lowest (or highest) normal communication address becomes the coordinator. The coordinator may also be configured to assign short addresses to use for communications once the lighting network is formed instead of the longer MAC, or like, addresses. The short addresses can reduce routing overhead, and thus make the routing of messages including control information, sensor data, and the like, more efficient. | 06-19-2014 |