Patent application title: THERMAL MODULE STRUCTURE
Inventors:
Chih-Peng Chen (New Taipei City, TW)
Chih-Peng Chen (New Taipei City, TW)
Assignees:
ASIA VITAL COMPONENTS CO., LTD.
IPC8 Class: AF28D1504FI
USPC Class:
16510426
Class name: Liquid fluent heat exchange material utilizing change of state utilizing capillary attraction
Publication date: 2013-11-21
Patent application number: 20130306277
Abstract:
A thermal module structure includes a main body and at least one heat
pipe. The main body has a base section and an extension section. Multiple
radiating fins extend from a circumference of the extension section. The
heat pipe is assembled with the main body. The heat pipe has a heat
absorption end and a heat dissipation end. The thermal module structure
has lower thermal resistance so that the heat dissipation effect of the
thermal module structure is greatly enhanced. Moreover, the manufacturing
cost of the thermal module structure is lowered and the manufacturing
time of the thermal module structure is shortened.Claims:
1. A thermal module structure comprising: a main body having a base
section and an extension section extending from a middle portion of one
side of the base section, multiple radiating fins extending from a
circumference of the extension section; and at least one heat pipe
assembled with the main body, the heat pipe having a heat absorption end
and a heat dissipation end, the heat absorption end being assembled with
the other side of the base section opposite to the extension section, the
heat dissipation end being attached to one side of the extension section.
2. The thermal module structure as claimed in claim 1, wherein multiple extension limbs further outward extend from the circumference of the extension section, each extension limb having a free end formed with at least one locating hole.
3. The thermal module structure as claimed in claim 1, wherein the other side of the base section has at least one groove formed in a position where the heat pipe is positioned, the heat absorption end of the heat pipe being assembled in the groove.
4. The thermal module structure as claimed in claim 1, wherein the main body is integrally formed by means of mechanical processing.
5. The thermal module structure as claimed in claim 4, wherein the mechanical processing is aluminum extrusion.
6. The thermal module structure as claimed in claim 1, wherein the main body has a first side, a fan being disposed on the first side of the main body.
7. The thermal module structure as claimed in claim 1, wherein the main body has a second side on which the heat dissipation end of the heat pipe is positioned, a fan being disposed on the second side of the main body.
Description:
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates generally to an improved thermal module structure, and more particularly to a thermal module structure having lower thermal resistance and able to provide much better heat dissipation effect. Moreover, the manufacturing cost of the thermal module structure is lowered and the manufacturing time of the thermal module structure is shortened.
[0003] 2. Description of the Related Art
[0004] Following the continuous advance of sciences and technologies, the sizes of electronic products have become smaller and smaller, while the power consumption and the heat generated by the electronic products have become greater and greater. In order to keep the electronic components stably operating, the heat must be dissipated at high efficiency.
[0005] Please refer to FIGS. 1A and 1B. FIG. 1A is a perspective exploded view of a conventional thermal module 1. FIG. 1B is a perspective assembled view of the conventional thermal module 1. The conventional thermal module 1 includes a base seat 10, a heat dissipation unit 11 and at least one heat pipe 12. The heat dissipation unit 11 is composed of multiple radiating fins 111 overlapping one another. The heat pipe 12 passes through the heat dissipation unit 11 and is connected therewith to form the thermal module 1. In general, the radiating fins 111 are connected to the base seat 10 and the heat pipe 12 with solder paste by means of soldering. Such soldering process takes much time and leads to increase of manufacturing cost.
[0006] Moreover, the bottom face of the base seat 10 of the conventional thermal module 1 is directly attached to and in contact with a heat source 13. Accordingly, the heat generated by the heat source must first go through the base seat 10 and then to the radiating fins 111 to dissipate. According to such arrangement, the heat cannot be quickly transferred to outer side of the thermal module in the first time. Moreover, the thermal resistance is increased. This will slow down the heat dissipation.
[0007] According to the above, the conventional thermal module has the following shortcomings:
1. The manufacturing cost is increased. 2. It takes much time to manufacture the thermal module. 3. The heat dissipation is slowed down.
SUMMARY OF THE INVENTION
[0008] A primary object of the present invention is to provide an improved thermal module structure, which has lower thermal resistance and is able to provide much better heat dissipation effect.
[0009] A further object of the present invention is to provide the above thermal module structure. The manufacturing cost of the thermal module structure is lowered and the manufacturing time of the thermal module structure is shortened.
[0010] To achieve the above and other objects, the thermal module structure of the present invention includes a main body and at least one heat pipe. The main body has a base section and an extension section extending from a middle portion of one side of the base section. Multiple radiating fins extend from a circumference of the extension section. The heat pipe is assembled with the main body. The heat pipe has a heat absorption end and a heat dissipation end. The heat absorption end is assembled with the other side of the base section opposite to the extension section. The heat dissipation end is attached to one side of the extension section.
[0011] The side of the base section with the heat absorption end of the heat pipe is attached to a heat source. The heat absorption end of the heat pipe serves to directly absorb the heat generated by the heat source and transfer the heat to the heat dissipation end attached to the side of the extension section. Then the heat is dissipated from the radiating fins of the extension section. Accordingly, the heat can be quickly dissipated. The main body is integrally formed so that the manufacturing cost of the thermal module structure is greatly lowered and the manufacturing process of the thermal module structure is simplified.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
[0013] FIG. 1A is a perspective exploded view of a conventional thermal module;
[0014] FIG. 1B is a perspective assembled view of the conventional thermal module;
[0015] FIG. 2A is a perspective exploded view of a first embodiment of the thermal module structure of the present invention;
[0016] FIG. 2B is a perspective assembled view of the first embodiment of the thermal module structure of the present invention;
[0017] FIG. 3A is a perspective exploded view of a second embodiment of the thermal module structure of the present invention;
[0018] FIG. 3B is a perspective assembled view of the second embodiment of the thermal module structure of the present invention;
[0019] FIG. 4A is a perspective exploded view of a third embodiment of the thermal module structure of the present invention; and
[0020] FIG. 4B is a perspective assembled view of the third embodiment of the thermal module structure of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0021] Please refer to FIGS. 2A and 2B. FIG. 2A is a perspective exploded view of a first embodiment of the thermal module structure of the present invention. FIG. 2B is a perspective assembled view of the first embodiment of the thermal module structure of the present invention. According to the first embodiment, the thermal module structure 2 of the present invention includes a main body 20 and at least one heat pipe 21. The main body 20 has a base section 201 and an extension section 202 extending from a middle portion of one side of the base section 201. Multiple radiating fins 2023 extend from a circumference of the extension section 202. The base section 201 and the extension section 202 are integrally formed by means of mechanical processing. In this embodiment, the mechanical processing is aluminum extrusion.
[0022] The heat pipe 21 is assembled with the main body 20. The heat pipe 21 has a heat absorption end 211 and a heat dissipation end 212. The heat absorption end 211 is assembled with the other side of the base section 201 opposite to the extension section 202. The heat dissipation end 212 is attached to one side of the extension section 202. The other side of the base section 201 has at least one groove 2011 formed in a position where the heat pipe 21 is positioned. The heat absorption end 211 of the heat pipe 21 is assembled in the groove 2011.
[0023] According to the above arrangement, the heat pipe 21 is assembled with the main body 20, whereby the heat absorption end 211 can absorb the heat and transfer the heat to the heat dissipation end 212. Then the heat is dissipated from the radiating fins 2023 of the extension section 202. Accordingly, the heat can be quickly dissipated. Moreover, the base section 201, the extension section 202 and the radiating fins 2023 are integrally formed so that the manufacturing process is simplified and the manufacturing cost is greatly lowered.
[0024] Please refer to FIGS. 3A and 3B. FIG. 3A is a perspective exploded view of a second embodiment of the thermal module structure of the present invention. FIG. 3B is a perspective assembled view of the second embodiment of the thermal module structure of the present invention. The second embodiment is substantially identical to the first embodiment in component and connection relationship between the components and thus will not be repeatedly described hereinafter. The second embodiment is mainly different from the first embodiment in that multiple extension limbs 2021 further outward extend from the circumference of the extension section 202. Each extension limb 2021 has a free end formed with at least one locating hole 2022. The main body 20 has a first side 22. A fan 24 is disposed on the first side 22 of the main body 20. By means of the locating holes 2022 of the free ends of the extension limbs 2021, the fan 24 is affixed to the thermal module structure 2. The side of the base section 201 with the heat pipe 21 is attached to the heat source 25. The heat absorption end 211 of the heat pipe 21 serves to absorb the heat generated by the heat source 25 and transfer the heat to the heat dissipation end 212. Then the heat is dissipated from the radiating fins 2023 of the extension section 202 and carried away by the airflow generated by the fan 24. Accordingly, the heat can be quickly dissipated.
[0025] Please refer to FIGS. 4A and 4B. FIG. 4A is a perspective exploded view of a third embodiment of the thermal module structure of the present invention. FIG. 4B is a perspective assembled view of the third embodiment of the thermal module structure of the present invention. The third embodiment is substantially identical to the second embodiment in component and connection relationship between the components and thus will not be repeatedly described hereinafter. The third embodiment is mainly different from the second embodiment in that the main body 20 has a second side 23 on which the heat dissipation end 212 of the heat pipe 21 is positioned. A fan 24 is disposed on the second side 23 of the main body 20. By means of the locating holes 2022 of the free ends of the extension limbs 2021, the fan 24 is affixed to the thermal module structure 2. The side of the base section 201 with the heat pipe 21 is attached to the heat source 25. The heat absorption end 211 of the heat pipe 21 serves to absorb the heat generated by the heat source 25 and transfer the heat to the heat dissipation end 212. Then the heat is dissipated from the radiating fins 2023 of the extension section 202 and carried away by the airflow generated by the fan 24. Accordingly, the heat can be quickly dissipated.
[0026] In conclusion, in comparison with the conventional thermal module, the present invention has the following advantages:
1. The manufacturing cost is lowered. 2. The manufacturing process is simplified. 3. The heat dissipation is speeded.
[0027] The above embodiments are only used to illustrate the present invention, not intended to limit the scope thereof. It is understood that many changes and modifications of the above embodiments can be made without departing from the spirit of the present invention. The scope of the present invention is limited only by the appended claims.
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