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LAW OFFICES OF MIKIO ISHIMARU

SUNNYVALE, CA US

1. 20110047604 COMPUTING INPUT SYSTEM WITH SECURE STORAGE AND METHOD OF OPERATION THEREOF 02-24-2011
2. 20110042757 INTEGRATED CIRCUIT SYSTEM WITH BAND TO BAND TUNNELING AND METHOD OF MANUFACTURE THEREOF 02-24-2011
3. 20110040958 METHOD OF SWITCHING COMPUTER OPERATING SYSTEMS 02-17-2011
4. 20110037157 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF 02-17-2011
5. 20110037152 DROP-MOLD CONFORMABLE MATERIAL AS AN ENCAPSULATION FOR AN INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD FOR MANUFACTURING THEREOF 02-17-2011
6. 20110037140 INTEGRATED CIRCUIT SYSTEM WITH SEALRING AND METHOD OF MANUFACTURE THEREOF 02-17-2011
7. 20110037136 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH IMAGE SENSOR SYSTEM 02-17-2011
8. 20110035587 DATA PROGRAMMING CONTROL SYSTEM WITH SECURE DATA MANAGEMENT AND METHOD OF OPERATION THEREOF 02-10-2011
9. 20110035142 NAVIGATION SYSTEM WITH SINGLE INITIATION MECHANISM AND METHOD OF OPERATION THEREOF 02-10-2011
10. 20110030568 PRESS-FITTING DIE - Provided is a press-fitting die including two removable templates each having two opposing surfaces with molds provided thereon, 02-10-2011
11. 20110029104 AUTOMATED PROGRAMMIING SYSTEM EMPLOYING NON-TEXT USER INTERFACE 02-03-2011
12. 20110024887 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THROUGH SILICON VIA BASE AND METHOD OF MANUFACTURE THEREOF 02-03-2011
13. 20110018084 ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF FABRICATION THEREOF 01-27-2011
14. 20110012270 INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING AND METHOD OF MANUFACTURE THEREOF 01-20-2011
15. 20110006187 METHOD OF FORMING A KNIFE MOLD BY ETCHING ONCE AND THE KNIFE MOLD FORMED BY THE METHOD 01-13-2011
16. 20100332847 ENCRYPTING PORTABLE MEDIA SYSTEM AND METHOD OF OPERATION THEREOF 12-30-2010
17. 20100327418 INTEGRATED CIRCUIT PACKAGE SYSTEM USING HEAT SLUG 12-30-2010
18. 20100320621 INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH SIDE-BY-SIDE AND OFFSET STACKING AND METHOD FOR MANUFACTURING THEREOF 12-23-2010
19. 20100320619 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF 12-23-2010
20. 20100320603 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION LAYER AND METHOD FOR MANUFACTURING THEREOF 12-23-2010
21. 20100320601 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THROUGH VIA DIE HAVING PEDESTAL AND RECESS AND METHOD OF MANUFACTURE THEREOF 12-23-2010
22. 20100320591 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONTACT PADS AND METHOD OF MANUFACTURE THEREOF 12-23-2010
23. 20100320590 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A LEADFRAME HAVING RADIAL-SEGMENTS AND METHOD OF MANUFACTURE THEREOF 12-23-2010
24. 20100320589 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMPS AND METHOD OF MANUFACTURE THEREOF 12-23-2010
25. 20100320587 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MANUFACTURE THEREOF 12-23-2010
26. 20100320586 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED INTEGRATED CIRCUIT AND METHOD OF MANUFACTURE THEREOF 12-23-2010
27. 20100320583 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A DUAL SUBSTRATE PACKAGE AND METHOD OF MANUFACTURE THEREOF 12-23-2010
28. 20100320582 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INWARD AND OUTWARD INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF 12-23-2010
29. 20100320529 INTEGRATED CIRCUIT SYSTEM WITH HIGH VOLTAGE TRANSISTOR AND METHOD OF MANUFACTURE THEREOF 12-23-2010
30. 20100320503 STRAINED CHANNEL TRANSISTOR AND METHOD OF FABRICATION THEREOF 12-23-2010
31. 20100319008 PARALLEL PROCESSING METHOD FOR DUAL OPERATING SYSTEM 12-16-2010
32. 20100314763 INTEGRATED CIRCUIT SYSTEM EMPLOYING LOW-K DIELECTRICS AND METHOD OF MANUFACTURE THEREOF 12-16-2010
33. 20100314741 INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH REDISTRIBUTION AND METHOD OF MANUFACTURE THEREOF 12-16-2010
34. 20100314738 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A STACK PACKAGE AND METHOD OF MANUFACTURE THEREOF 12-16-2010
35. 20100314736 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF 12-16-2010
36. 20100314731 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HIGH LEAD COUNT AND METHOD OF MANUFACTURE THEREOF 12-16-2010
37. 20100312469 NAVIGATION SYSTEM WITH SPEECH PROCESSING MECHANISM AND METHOD OF OPERATION THEREOF 12-09-2010
38. 20100304556 INTEGRATED CIRCUIT SYSTEM WITH VERTICAL CONTROL GATE AND METHOD OF MANUFACTURE THEREOF 12-02-2010
39. 20100302790 LED LUMINAIRE AND METHOD FOR FABRICATING THE SAME 12-02-2010
40. 20100301469 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER INTERCONNECTIONS AND METHOD OF MANUFACTURE THEREOF 12-02-2010
41. 20100297844 INTEGRATED CIRCUIT SYSTEM WITH THROUGH SILICON VIA AND METHOD OF MANUFACTURE THEREOF 11-25-2010
42. 20100295153 INTEGRATED CIRCUIT SYSTEM WITH HIERARCHICAL CAPACITOR AND METHOD OF MANUFACTURE THEREOF 11-25-2010
43. 20100293516 MASK SYSTEM EMPLOYING SUBSTANTIALLY CIRCULAR OPTICAL PROXIMITY CORRECTION TARGET AND METHOD OF MANUFACTURE THEREOF 11-18-2010
44. 20100289142 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COIN BONDED INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF 11-18-2010
45. 20100289134 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH REINFORCED ENCAPSULANT HAVING EMBEDDED INTERCONNECT AND METHOD OF MANUFACTURE THEREOF 11-18-2010
46. 20100289128 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND TRANSPOSER AND METHOD OF MANUFACTURE THEREOF 11-18-2010
47. 20100287373 DATA SECURITY SYSTEM WITH ENCRYPTION - data security system is provided that includes: verifying the user by providing user identification to retrieve 11-11-2010
48. 20100279504 INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING 11-04-2010
49. 20100277452 MOBILE DISPLAY CONTROL SYSTEM - method for operation of a mobile display control system is provided including providing a sensor for monitoring an 11-04-2010
50. 20100276815 INTEGRATED CIRCUIT COMMUNICATION SYSTEM WITH DIFFERENTIAL SIGNAL AND METHOD OF MANUFACTURE THEREOF 11-04-2010
51. 20100270680 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OFFSET STACKING AND ANTI-FLASH STRUCTURE 10-28-2010
52. 20100270670 INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF 10-28-2010
53. 20100268460 NAVIGATION SYSTEM WITH PREDICTIVE MULTI-ROUTING AND METHOD OF OPERATION THEREOF 10-21-2010
54. 20100264754 STORED-POWER SYSTEM INCLUDING POWER MANAGEMENT 10-21-2010
55. 20100264529 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTEGRAL INNER LEAD AND PADDLE AND METHOD OF MANUFACTURE THEREOF 10-21-2010
56. 20100264528 QUAD FLAT PACK IN QUAD FLAT PACK INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD FOR MANUFACTURING THEREOF 10-21-2010
57. 20100264525 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADED PACKAGE AND METHOD FOR MANUFACTURING THEREOF 10-21-2010
58. 20100259916 LIGHT-EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME 10-14-2010
59. 20100258928 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED INTEGRATED CIRCUIT AND METHOD OF MANUFACTURE THEREOF 10-14-2010
60. 20100258868 INTEGRATED CIRCUIT SYSTEM WITH A FLOATING DIELECTRIC REGION AND METHOD OF MANUFACTURE THEREOF 10-14-2010
61. 20100244277 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE UNDERFILL AND METHOD OF MANUFACTURE THEREOF 09-30-2010
62. 20100244273 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DEVICE UNITS AND METHOD FOR MANUFACTURING THEREOF 09-30-2010
63. 20100244236 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD OF MANUFACTURE THEREOF 09-30-2010
64. 20100244232 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH Z-INTERCONNECTS HAVING TRACES AND METHOD OF MANUFACTURE THEREOF 09-30-2010
65. 20100244223 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF 09-30-2010
66. 20100244222 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF 09-30-2010
67. 20100244221 INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF 09-30-2010
68. 20100244219 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF 09-30-2010
69. 20100244218 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MULTI-STACKED FLIP CHIPS AND METHOD OF MANUFACTURE THEREOF 09-30-2010
70. 20100244217 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED CONFIGURATION AND METHOD OF MANUFACTURE THEREOF 09-30-2010
71. 20100244212 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST TYPE INTERCONNECTOR AND METHOD OF MANUFACTURE THEREOF 09-30-2010
72. 20100244024 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF 09-30-2010
73. 20100240175 METHOD FOR MAKING A STACKED PACKAGE SEMICONDUCTOR MODULE HAVING PACKAGES STACKED IN A CAVITY IN THE MODULE SUBSTRATE 09-23-2010
74. 20100237488 INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING 09-23-2010
75. 20100237483 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTERPOSER AND METHOD OF MANUFACTURE THEREOF 09-23-2010
76. 20100237482 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LAYERED PACKAGING AND METHOD OF MANUFACTURE THEREOF 09-23-2010
77. 20100237481 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF 09-23-2010
78. 20100230796 INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM AND METHOD FOR MAKING THEREOF 09-16-2010
79. 20100230765 INTEGRATED CIRCUIT SYSTEM EMPLOYING STRESS MEMORIZATION TRANSFER 09-16-2010
80. 20100230487 SELF-AUTHENTICATING CREDIT CARD SYSTEM - self-authenticating credit card method includes: inputting a unique identification to an input device on a 09-16-2010
81. 20100225008 WIRE BOND INTERCONNECTION - between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger 09-09-2010
82. 20100225007 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED DIE AND METHOD OF MANUFACTURE THEREOF 09-09-2010
83. 20100224991 INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM 09-09-2010
84. 20100224979 STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD FOR MANUFACTURING THEREOF 09-09-2010
85. 20100224978 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLEX TAPE AND METHOD OF MANUFACTURE THEREOF 09-09-2010
86. 20100224975 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A DUAL BOARD-ON-CHIP STRUCTURE AND METHOD OF MANUFACTURE THEREOF 09-09-2010
87. 20100224974 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PATTERNED SUBSTRATE AND METHOD OF MANUFACTURE THEREOF 09-09-2010
88. 20100219523 STACKABLE INTEGRATED CIRCUIT PACKAGE SYSTEM 09-02-2010
89. 20100219486 METHOD FOR CONTAINING A SILICIDED GATE WITHIN A SIDEWALL SPACER IN INTEGRATED CIRCUIT TECHNOLOGY 09-02-2010
90. 20100207262 PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTURE THEREOF 08-19-2010
91. 20100203683 SEMICONDUCTOR SYSTEM WITH FINE PITCH LEAD FINGERS AND METHOD OF MANUFACTURE THEREOF 08-12-2010
92. 20100200967 INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING SHIELD 08-12-2010
93. 20100200966 SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER DIE-UP FLIP CHIP BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES 08-12-2010
94. 20100198508 NAVIGATION SYSTEM HAVING ROUTE CUSTOMIZATION MECHANISM AND METHOD OF OPERATION THEREOF 08-05-2010
95. 20100198496 NAVIGATION SYSTEM WITH PATH PREDICTION AND METHOD OF OPERATION THEREOF 08-05-2010
96. 20100198494 NAVIGATION SYSTEM HAVING ADAPTIVE COVERAGE AND METHOD OF OPERATION THEREOF 08-05-2010
97. 20100193926 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OFFSET STACKED DIE 08-05-2010
98. 20100193226 SOLDER BUMP CONFINEMENT SYSTEM FOR AN INTEGRATED CIRCUIT PACKAGE 08-05-2010
99. 20100176503 SEMICONDUCTOR PACKAGE SYSTEM WITH THERMAL DIE BONDING 07-15-2010
100. 20100176497 INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM 07-15-2010
101. 20100174922 ENCRYPTION BRIDGE SYSTEM AND METHOD OF OPERATION THEREOF 07-08-2010
102. 20100174913 MULTI-FACTOR AUTHENTICATION SYSTEM FOR ENCRYPTION KEY STORAGE AND METHOD OF OPERATION THEREFOR 07-08-2010
103. 20100174614 SYSTEM AND METHOD FOR MANAGING ELECTRONIC SERVICE PLATFORM 07-08-2010
104. 20100171228 INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF MANUFACTURE THEREOF 07-08-2010
105. 20100162258 ELECTRONIC SYSTEM WITH CORE COMPENSATION AND METHOD OF OPERATION THEREOF 06-24-2010
106. 20100155926 INTEGRATED CIRCUIT PACKAGING SYSTEM FOR FINE PITCH SUBSTRATES AND METHOD OF MANUFACTURE THEREOF 06-24-2010
107. 20100155918 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF 06-24-2010
108. 20100153010 NAVIGATION SYSTEM WITH QUERY MECHANISM AND METHOD OF OPERATION THEREOF 06-17-2010
109. 20100152965 NAVIGATION SYSTEM HAVING MILEAGE MECHANISM AND METHOD OF OPERATION THEREOF 06-17-2010
110. 20100148355 INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING WAFER LEVEL CHIP SCALE PACKAGING 06-17-2010
111. 20100148354 INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING THROUGH SILICON VIA WITH DIRECT INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF 06-17-2010
112. 20100148344 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INPUT/OUTPUT EXPANSION 06-17-2010
113. 20100148336 INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING THROUGH SILICON VIAS WITH PARTIAL DEPTH METAL FILL REGIONS AND METHOD OF MANUFACTURE THEREOF 06-17-2010
114. 20100146367 SYSTEM FOR TESTING THE UPSTREAM CHANNEL OF A CABLE NETWORK 06-10-2010
115. 20100142174 INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF 06-10-2010
116. 20100140813 INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF 06-10-2010
117. 20100140809 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A PROTRUSION ON AN INNER STACKING MODULE AND METHOD OF MANUFACTURE THEREOF 06-10-2010
118. 20100140789 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EXPOSED TERMINAL INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF 06-10-2010
119. 20100140770 INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING ASYMMETRIC ENCAPSULATION STRUCTURES AND METHOD OF MANUFACTURE THEREOF 06-10-2010
120. 20100140769 INTEGRATED CIRCUIT PACKAGING SYSTEM USING BOTTOM FLIP CHIP DIE BONDING AND METHOD OF MANUFACTURE THEREOF 06-10-2010
121. 20100140766 LARGE DIE PACKAGE STRUCTURES AND FABRICATION METHOD THEREFOR 06-10-2010
122. 20100140765 LEADLESS INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF 06-10-2010
123. 20100140764 WIRE-ON-LEAD PACKAGE SYSTEM AND METHOD OF MANUFACTURE THEREOF 06-10-2010
124. 20100140763 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED PADDLE AND METHOD OF MANUFACTURE THEREOF 06-10-2010
125. 20100136744 METHOD FOR MAKING SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE AND INVERTED LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE 06-03-2010
126. 20100133665 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD FRAME AND METHOD OF MANUFACTURE THEREOF 06-03-2010
127. 20100133534 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND FLIP CHIP AND METHOD OF MANUFACTURE THEREOF 06-03-2010
128. 20100127361 ENCAPSULANT INTERPOSER SYSTEM WITH INTEGRATED PASSIVE DEVICES AND MANUFACTURING METHOD THEREFOR 05-27-2010
129. 20100123251 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MULTI LEVEL CONTACT AND METHOD OF MANUFACTURE THEREOF 05-20-2010
130. 20100123247 BASE PACKAGE SYSTEM FOR INTEGRATED CIRCUIT PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF 05-20-2010
131. 20100123242 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT CARRIER AND METHOD OF MANUFACTURE THEREOF 05-20-2010
132. 20100123233 INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF PACKAGE STACKING 05-20-2010
133. 20100123232 INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING AN INTERNAL STRUCTURE PROTRUSION AND METHOD OF MANUFACTURE THEREOF 05-20-2010
134. 20100123230 INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING BUMPED LEAD AND METHOD OF MANUFACTURE THEREOF 05-20-2010
135. 20100123229 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLATED PAD AND METHOD OF MANUFACTURE THEREOF 05-20-2010
136. 20100123227 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF 05-20-2010
137. 20100122345 CONTROL SYSTEM AND PROTECTION METHOD FOR INTEGRATED INFORMATION SECURITY SERVICES 05-13-2010
138. 20100117205 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK AND METHOD OF MANUFACTURE THEREOF 05-13-2010
139. 20100114469 NAVIGATION SYSTEM HAVING DYNAMIC ADAPTIVE ROUTING AND METHOD OF OPERATION THEREOF 05-06-2010
140. 20100109097 INTEGRATED CIRCUIT SYSTEM EMPLOYING AN ELEVATED DRAIN 05-06-2010
141. 20100109045 INTEGRATED CIRCUIT SYSTEM EMPLOYING STRESS-ENGINEERED LAYERS 05-06-2010
142. 20100106405 NAVIGATION SYSTEM HAVING FILTERING MECHANISM AND METHOD OF OPERATION THEREOF 04-29-2010
143. 20100102458 SEMICONDUCTOR PACKAGE SYSTEM WITH CAVITY SUBSTRATE AND MANUFACTURING METHOD THEREFOR 04-29-2010
144. 20100090350 MULTI-CHIP PACKAGE SYSTEM INCORPORATING AN INTERNAL STACKING MODULE WITH SUPPORT PROTRUSIONS 04-15-2010
145. 20100088527 MEMORY PROTECTION SYSTEM AND METHOD - memory protection method is provided with a user input key: The user input key is compared with an internal 04-08-2010
146. 20100087061 INTEGRATED CIRCUIT SYSTEM EMPLOYING BACKSIDE ENERGY SOURCE FOR ELECTRICAL CONTACT FORMATION 04-08-2010
147. 20100078831 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SINGULATION PROCESS 04-01-2010
148. 20100078828 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING STRUCTURE 04-01-2010
149. 20100078794 STACKED DIE SEMICONDUCTOR DEVICE HAVING CIRCUIT TAPE 04-01-2010
150. 20100078789 SEMICONDUCTOR PACKAGE SYSTEM WITH THROUGH SILICON VIA INTERPOSER 04-01-2010
151. 20100072634 PLANAR ENCAPSULATION AND MOLD CAVITY PACKAGE IN PACKAGE SYSTEM 03-25-2010
152. 20100072630 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ADHESIVE SEGMENT SPACER 03-25-2010
153. 20100072597 INTEGRATED CIRCUIT PACKAGE SYSTEM FOR STACKABLE DEVICES 03-25-2010
154. 20100072596 INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING PLANAR INTERCONNECT 03-25-2010
155. 20100072591 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ANTI-PEEL PAD 03-25-2010
156. 20100072589 SEMICONDUCTOR PACKAGE SYSTEM WITH DIE SUPPORT PAD 03-25-2010
157. 20100072586 QUAD FLAT PACK IN QUAD FLAT PACK INTEGRATED CIRCUIT PACKAGE SYSTEM 03-25-2010
158. 20100068741 ASSAY SYSTEM FOR ADENOSINE TRIPHOSPHATE AND CREATINE KINASE 03-18-2010
159. 20100065936 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH IMAGE SENSOR SYSTEM 03-18-2010
160. 20100059885 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION LAYER 03-11-2010
161. 20100059884 LEADLESS SEMICONDUCTOR CHIP CARRIER SYSTEM 03-11-2010
162. 20100059873 BALL GRID ARRAY PACKAGE STACKING SYSTEM - includes: forming a heat spreader having a centrally located access port 03-11-2010
163. 20100055725 SYSTEM FOR ASSAYS OF AMINOTRANSFERASE - assay system comprising providing a platform having a contact surface 03-04-2010
164. 20100052150 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE SUBSTRATE HAVING CORNER CONTACTS AND METHOD OF MANUFACTURE THEREOF 03-04-2010
165. 20100052131 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION LAYER 03-04-2010
166. 20100052117 STACKABLE MULTI-CHIP PACKAGE SYSTEM WITH SUPPORT STRUCTURE 03-04-2010
167. 20100046183 INTEGRATED CIRCUIT PACKAGE SYSTEM - includes: connecting a carrier and an integrated circuit mounted thereover 02-25-2010
168. 20100044882 INTEGRATED CIRCUIT PACKAGE SYSTEM FLIP CHIP 02-25-2010
169. 20100044878 INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING CAVITY 02-25-2010
170. 20100044849 STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM AND METHOD OF MANUFACTURE THEREOF 02-25-2010
171. 20100041261 Foldable electrical connector-housing system and method of manufacture thereof 02-18-2010
172. 20100041181 HEAT DISSIPATING PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME 02-18-2010
173. 20100038804 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLD GATE 02-18-2010
174. 20100038781 INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING A CAVITY 02-18-2010
175. 20100038771 INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE 02-18-2010
176. 20100038768 INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND MANUFACTURING METHOD THEREOF 02-18-2010
177. 20100038761 INTEGRATED CIRCUIT PACKAGE SYSTEM - includes: mounting a first integrated circuit over a carrier 02-18-2010
178. 20100035290 ENZYME DETECTION SYSTEM WITH CAGED SUBSTRATES 02-11-2010
179. 20100033941 EXPOSED INTERCONNECT FOR A PACKAGE ON PACKAGE SYSTEM 02-11-2010
180. 20100032828 SEMICONDUCTOR ASSEMBLY WITH COMPONENT ATTACHED ON DIE BACK SIDE 02-11-2010
181. 20100032821 TRIPLE TIER PACKAGE ON PACKAGE SYSTEM - integrated circuit package system includes: providing a first package having a first interposer mounted over a 02-11-2010
182. 20100029046 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONCAVE TERMINAL 02-04-2010
183. 20100025836 MULTI-LAYER PACKAGE-ON-PACKAGE SYSTEM - package-on-package system includes: providing a bottom package module incorporating a bottom package substrate 02-04-2010
184. 20100025835 INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM 02-04-2010
185. 20100025834 FAN-IN INTERPOSER ON LEAD FRAME FOR AN INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM 02-04-2010
186. 20100025833 RDL PATTERNING WITH PACKAGE ON PACKAGE SYSTEM 02-04-2010
187. 20100025830 A METHOD FOR FORMING AN ETCHED RECESS PACKAGE ON PACKAGE SYSTEM 02-04-2010
188. 20100019369 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFRAME SUBSTRATE 01-28-2010
189. 20100013104 INTEGRATED CIRCUIT HARD MASK PROCESSING SYSTEM 01-21-2010
190. 20100009527 INTEGRATED CIRCUIT SYSTEM EMPLOYING SINGLE MASK LAYER TECHNIQUE FOR WELL FORMATION 01-14-2010
191. 20100009468 METHOD OF MANUFACTURE FOR SEMICONDUCTOR PACKAGE WITH FLOW CONTROLLER 01-14-2010
192. 20100007002 MULTI-LAYER SEMICONDUCTOR PACKAGE - semiconductor package comprises a base substrate with a semiconductor die mounted on a top side of the base 01-14-2010
193. 20100007000 PACKAGE STACKING SYSTEM WITH MOLD CONTAMINATION PREVENTION 01-14-2010
194. 20100006993 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CHIP ON LEAD 01-14-2010
195. 20100005135 GENERAL PURPOSE MOBILE LOCATION-BLOGGING SYSTEM 01-07-2010
196. 20100002449 METHOD FOR FABRICATING MICRO-LENS AND MOLD CAVITY THEREOF AND LIGHT EMITTING DEVICE 01-07-2010
197. 20100002134 COMMUNICATION SYSTEM WITH DISPLAY STATUS 01-07-2010
198. 20100001391 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORTED STACKED DIE 01-07-2010
199. 20100001385 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BUMPED LEAD AND NONBUMPED LEAD 01-07-2010
200. 20100001384 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEAD-FRAME PADDLE SCHEME FOR SINGLE AXIS PARTIAL SAW ISOLATION 01-07-2010
201. 20100001370 INTEGRATED CIRCUIT SYSTEM EMPLOYING ALTERNATING CONDUCTIVE LAYERS 01-07-2010
202. 20100001283 TRIGGERED SILICON CONTROLLED RECTIFIER FOR RF ESD PROTECTION 01-07-2010
203. 20090325359 INTEGRATED CIRCUIT SYSTEM EMPLOYING A MODIFIED ISOLATION STRUCTURE 12-31-2009
204. 20090322916 SIGNAL PROCESSING SYSTEM - includes: defining a nonlinear function 12-31-2009
205. 20090321913 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LOCKING TERMINAL 12-31-2009
206. 20090321908 STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTRA-STACK ENCAPSULATION 12-31-2009
207. 20090321907 STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM 12-31-2009
208. 20090321899 INTEGRATED CIRCUIT PACKAGE SYSTEM STACKABLE DEVICES 12-31-2009
209. 20090321898 CONFORMAL SHIELDING INTEGRATED CIRCUIT PACKAGE SYSTEM 12-31-2009
210. 20090315170 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED CIRCUITRY AND POST, AND METHOD OF MANUFACTURE THEREOF 12-24-2009
211. 20090315164 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WIRE-IN-FILM ENCAPSULATION 12-24-2009
212. 20090313691 IDENTITY VERIFICATION SYSTEM APPLICABLE TO VIRTUAL PRIVATE NETWORK ARCHITECTURE AND METHOD OF THE SAME 12-17-2009
213. 20090313292 CUSTOMIZABLE INFORMATION MANAGEMENT SYSTEM 12-17-2009
214. 20090312857 PROGRAMMER ACTUATOR SYSTEM AND METHOD OF OPERATION THEREOF 12-17-2009
215. 20090309237 SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HAVING DIFFERENT BONDABLE HEIGHTS AT LEAD FINGER TIPS 12-17-2009
216. 20090309207 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIE AND PACKAGE COMBINATION 12-17-2009
217. 20090309204 BALL GRID ARRAY PACKAGE STACKING SYSTEM - includes: providing a base substrate 12-17-2009
218. 20090309198 INTEGRATED CIRCUIT PACKAGE SYSTEM - includes a leadframe with leads configured to provide electrical contact between an integrated circuit chip and an 12-17-2009
219. 20090309197 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERNAL STACKING MODULE 12-17-2009
220. 20090309192 INTEGRATED CIRCUIT SYSTEM WITH SUB-GEOMETRY REMOVAL AND METHOD OF MANUFACTURE THEREOF 12-17-2009
221. 20090308717 ADJUSTABLE MICRO DEVICE FEEDER SYSTEM AND METHOD OF OPERATION THEREOF 12-17-2009
222. 20090303690 INTEGRATED CIRCUIT PACKAGE SYSTEM FOR STACKABLE DEVICES 12-10-2009
223. 20090302452 MOUNTABLE INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM 12-10-2009
224. 20090302442 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ISOLATED PADS AND METHOD OF MANUFACTURE THEREOF 12-10-2009
225. 20090300282 REDUNDANT ARRAY OF INDEPENDENT DISKS WRITE RECOVERY SYSTEM 12-03-2009
226. 20090294962 PACKAGING SUBSTRATE AND METHOD FOR FABRICATING THE SAME 12-03-2009
227. 20090294941 PACKAGE-ON-PACKAGE SYSTEM WITH HEAT SPREADER 12-03-2009
228. 20090294935 SEMICONDUCTOR PACKAGE SYSTEM WITH CUT MULTIPLE LEAD PADS 12-03-2009
229. 20090294904 INTEGRATED CIRCUIT SYSTEM EMPLOYING BACK END OF LINE VIA TECHNIQUES 12-03-2009
230. 20090289335 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SHIELD AND TIE BAR 11-26-2009
231. 20090288688 NON-CORROSIVE CHEMICAL RINSE SYSTEM - rinse system including providing a chemical rinse including a corrosion inhibitor and rinsing a wafer with the 11-26-2009
232. 20090288594 ELECTROLESS DEPOSITION CHEMICAL SYSTEM LIMITING STRONGLY ADSORBED SPECIES 11-26-2009
233. 20090288593 ELECTROLESS DEPOSITION SYSTEM - includes a deposition solution and saturating the deposition solution with an oxygen concentration in a range from about 11-26-2009
234. 20090287964 INTERNET ACCESSIBLE TEST SYSTEM - including: providing a remote client having an Internet connection 11-19-2009
235. 20090284721 RETICLE SYSTEM FOR MANUFACTURING INTEGRATED CIRCUIT SYSTEMS 11-19-2009
236. 20090283893 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SLOTTED DIE PADDLE AND METHOD OF MANUFACTURE THEREOF 11-19-2009
237. 20090283890 SEMICONDUCTOR MULTI-PACKAGE MODULE INCLUDING TAPE SUBSTRATE LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE 11-19-2009
238. 20090283889 INTEGRATED CIRCUIT PACKAGE SYSTEM - includes: providing a heat spreader 11-19-2009
239. 20090283888 PACKAGE SYSTEM INCORPORATING A FLIP-CHIP ASSEMBLY 11-19-2009
240. 20090280629 INTEGRATED CIRCUIT SYSTEM EMPLOYING GRAIN SIZE ENLARGEMENT 11-12-2009
241. 20090273094 INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM 11-05-2009
242. 20090273062 SEMICONDUCTOR PACKAGE HEAT SPREADER - semiconductor heat spreader from a unitary metallic plate is provided 11-05-2009
243. 20090269243 ELECTRICALLY CONTROLLED MICROFLUIDIC SYSTEM 10-29-2009
244. 20090268497 FULL-WAVE RECTIFYING DEVICE - includes a first rectification module and a second rectification module 10-29-2009
245. 20090267585 CASCODE CURRENT MIRROR CIRCUIT, BANDGAP CIRCUIT, REFERENCE VOLTAGE CIRCUIT HAVING THE CASCODE CURRENT MIRROR CIRCUIT AND THE BANDGAP CIRCUIT, AND VOLTAGE STABILIZING/REGULATING CIRCUIT HAVING THE REFERENCE VOLTAGE CIRCUIT 10-29-2009
246. 20090261367 OPTICAL ERASE MEMORY STRUCTURE - method for providing an optical erase memory structure including: forming a metal-insulator-metal memory cell 10-22-2009
247. 20090259398 NAVIGATIONAL DIRECTION INDICATING DEVICE 10-15-2009
248. 20090258494 INLINE INTEGRATED CIRCUIT SYSTEM - integrated circuit package system including: providing a leadframe with an integrated circuit mounted thereover 10-15-2009
249. 20090256711 ANIMAL MANAGEMENT SYSTEM AND SCANNING ACCESS DEVICE 10-15-2009
250. 20090256665 VIBRATION-PROOF HOLDER APPLICABLE TO COMMUNICATION/NAVIGATION DEVICES FOR VEHICLE USE 10-15-2009
251. 20090256267 INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH CENTRAL BOND WIRES 10-15-2009
252. 20090254956 COMMUNICATION SIGNAL CHARACTERISTIC MEASUREMENT SYSTEM 10-08-2009
253. 20090253262 ELECTROLESS PLATING SYSTEM - includes a plating solution and controlling reducing agents in the plating solution for deposition over outlier features 10-08-2009
254. 20090252284 MULTI-CHECKPOINT TYPE CLUSTERED ANIMAL COUNTING DEVICE 10-08-2009
255. 20090252154 SYSTEM FOR INTEGRATING AND TRANSMITTING NETWORK PHONE SIGNALS AND METHOD APPLIED THEREIN 10-08-2009
256. 20090252086 FRONT-END GATEWAY UNIT FOR REMOTE ECOLOGICAL ENVIRONMENT MONITORING SYSTEM 10-08-2009
257. 20090250818 VIA ELECTROMIGRATION IMPROVEMENT BY CHANGING THE VIA BOTTOM GEOMETRIC PROFILE 10-08-2009
258. 20090250813 INTEGRATED CIRCUIT SOLDER BUMPING SYSTEM 10-08-2009
259. 20090250810 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL SYSTEM AND METHOD OF MANUFACTURE THEREOF 10-08-2009
260. 20090250798 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERCONNECT SUPPORT 10-08-2009
261. 20090250762 INTEGRATED CIRCUIT SYSTEM EMPLOYING SACRIFICIAL SPACERS 10-08-2009
262. 20090246862 BIOLUMINOGENIC ASSAY SYSTEM FOR MEASURING BETA-LACTAMASE ACTIVITY 10-01-2009
263. 20090245102 NETWORK BACKUP SYSTEM AND METHOD - are proposed 10-01-2009
264. 20090243091 MOCK BUMP SYSTEM FOR FLIP CHIP INTEGRATED CIRCUITS 10-01-2009
265. 20090243090 MOCK BUMP SYSTEM FOR FLIP CHIP INTEGRATED CIRCUITS 10-01-2009
266. 20090243082 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PLANAR INTERCONNECT 10-01-2009
267. 20090243077 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH RIGID LOCKING LEAD 10-01-2009
268. 20090243073 STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM 10-01-2009
269. 20090243072 STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM 10-01-2009
270. 20090243071 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING MODULE 10-01-2009
271. 20090243070 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE UNDER WIRE-IN-FILM ADHESIVE 10-01-2009
272. 20090243069 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION 10-01-2009
273. 20090243068 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH NON-SYMMETRICAL SUPPORT STRUCTURES 10-01-2009
274. 20090243067 MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUBSTRATE 10-01-2009
275. 20090243066 MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EXPOSED EXTERNAL INTERCONNECTS 10-01-2009
276. 20090236756 FLIP CHIP INTERCONNECTION SYSTEM - includes: providing a conductive lead coated with a protective coating 09-24-2009
277. 20090236754 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING MODULE 09-24-2009
278. 20090236753 INTEGRATED CIRCUIT PACKAGE SYSTEM FOR STACKABLE DEVICES 09-24-2009
279. 20090236752 PACKAGE-ON-PACKAGE SYSTEM WITH VIA Z-INTERCONNECTIONS 09-24-2009
280. 20090236751 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE FOR DIE OVERHANG 09-24-2009
281. 20090236733 BALL GRID ARRAY PACKAGE SYSTEM - comprising: forming a package base including: fabricating a heat spreader having an access port 09-24-2009
282. 20090236731 STACKABLE INTEGRATED CIRCUIT PACKAGE SYSTEM 09-24-2009
283. 20090236723 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-IN-PACKAGE AND METHOD OF MANUFACTURE THEREOF 09-24-2009
284. 20090236720 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STEP MOLD RECESS 09-24-2009
285. 20090236719 PACKAGE IN PACKAGE SYSTEM INCORPORATING AN INTERNAL STIFFENER COMPONENT 09-24-2009
286. 20090236718 PACKAGE-ON-PACKAGE SYSTEM WITH INTERNAL STACKING MODULE INTERPOSER 09-24-2009
287. 20090236704 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ISOLATED LEADS 09-24-2009
288. 20090233035 TAMPERPROOF ADHESIVE TAPE - comprised of a substrate one or more identification layers formed on a surface of the substrate 09-17-2009
289. 20090230532 SYSTEM FOR SOLDER BALL INNER STACKING MODULE CONNECTION 09-17-2009
290. 20090230529 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ETCHED RING AND DIE PADDLE AND METHOD OF MANUFACTURE THEREOF 09-17-2009
291. 20090230517 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTEGRATION PORT 09-17-2009
292. 20090224389 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DEVICES 09-10-2009
293. 20090221117 INTEGRATED CIRCUIT SYSTEM EMPLOYING RESISTANCE ALTERING TECHNIQUES 09-03-2009
294. 20090218675 MULTIPACKAGE MODULE HAVING STACKED PACKAGES WITH ASYMMETRICALLY ARRANGED DIE AND MOLDING 09-03-2009
295. 20090218636 INTEGRATED CIRCUIT SYSTEM FOR SUPPRESSING SHORT CHANNEL EFFECTS 09-03-2009
296. 20090216982 SELF-LOCKING MASS STORAGE SYSTEM AND METHOD OF OPERATION THEREOF 08-27-2009
297. 20090213738 TEST SYSTEM WITH USER SELECTABLE CHANNEL 08-27-2009
298. 20090213737 TEST SYSTEM WITH RETURN SWEEP LEVEL SETTING 08-27-2009
299. 20090212442 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PENETRABLE FILM ADHESIVE 08-27-2009
300. 20090212419 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OVERHANG FILM 08-27-2009
301. 20090212415 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EXTERNAL INTERCONNECTS WITHIN A DIE PLATFORM 08-27-2009
302. 20090212408 INTEGRATED CIRCUIT PACKAGE SYSTEM FOR STACKABLE DEVICES 08-27-2009
303. 20090212401 PACKAGE SYSTEM FOR SHIELDING SEMICONDUCTOR DIES FROM ELECTROMAGNETIC INTERFERENCE 08-27-2009
304. 20090210244 TRUSTED ACQUAINTANCES NETWORK SYSTEM - [700] includes: providing a network system [104] with a computer system [105 ] 08-20-2009
305. 20090201748 REMOVABLE NONVOLATILE MEMORY SYSTEM WITH DESTRUCTIVE READ 08-13-2009
306. 20090198930 INFORMATION BACKUP SYSTEM FOR HANDHELD DEVICES 08-06-2009
307. 20090195101 MOTOR ROTOR 08-06-2009
308. 20090194867 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERNAL STACKING MODULE ADHESIVE 08-06-2009
309. 20090194853 SHIELDED STACKED INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF 08-06-2009
310. 20090191029 SYSTEM FOR HANDLING SEMICONDUCTOR DIES - comprising providing a semiconductor die adhered to a tacky tape 07-30-2009
311. 20090190597 DATA ITEM INTERVAL IDENTIFIER LOOKUP METHOD AND SYSTEM 07-30-2009
312. 20090189716 FILTER DEVICE WITH FINITE TRANSMISSION ZEROS 07-30-2009
313. 20090189275 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFER SCALE HEAT SLUG 07-30-2009
314. 20090185412 PHASE-CHANGE MATERIAL, MEMORY UNIT AND METHOD FOR ELECTRICALLY STORING/READING DATA 07-23-2009
315. 20090184915 LOW-BACKLIGHT IMAGE VISIBILITY ENHANCEMENT METHOD AND SYSTEM 07-23-2009
316. 20090184774 TRANSISTOR VOLTAGE-CONTROLLED OSCILLATOR 07-23-2009
317. 20090184769 NEGATIVE-FEEDBACK TYPE ULTRA-WIDEBAND SIGNAL AMPLIFICATION CIRCUIT 07-23-2009
318. 20090184655 POWER MANAGEMENT SYSTEM FOR LIGHT EMITTING DIODES 07-23-2009
319. 20090182456 PROGRAMMING CONTROL SYSTEM FOR ADJUSTING AN AIR CONDITIONING EQUIPMENT 07-16-2009
320. 20090182455 SYSTEM FOR INSTANTLY AND REMOTELY MANAGING ASSETS OF AIR CONDITIONING EQUIPMENT 07-16-2009
321. 20090181739 COMPETITION CHEAT-PREVENTING SYSTEM AND METHOD 07-16-2009
322. 20090181551 INTEGRATED CIRCUIT SYSTEM EMPLOYING MULTIPLE EXPOSURE DUMMY PATTERNING TECHNOLOGY 07-16-2009
323. 20090179319 STACKED SEMICONDUCTOR PACKAGE ASSEMBLY HAVING HOLLOWED SUBSTRATE 07-16-2009
324. 20090179314 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFINGER SUPPORT 07-16-2009
325. 20090179312 INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM 07-16-2009
326. 20090179307 INTEGRATED CIRCUIT SYSTEM EMPLOYING FEED-FORWARD CONTROL 07-16-2009
327. 20090176133 FUEL CELL CONTROL SYSTEM AND CONTROL METHOD THEREOF 07-09-2009
328. 20090174064 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEAT SLUG 07-09-2009
329. 20090171779 Mobile Advertisement and Rating System - method of operating a mobile advertisement and rating system includes receiving an advertisement parameter by a 07-02-2009
330. 20090171710 Mobile Advertisement System With Advertisement Status 07-02-2009
331. 20090171556 Mutable Mobile Traffic Routing System - method of operating a mutable mobile traffic routing system includes receiving traffic routing parameters by a 07-02-2009
332. 20090170538 Mobile Location Sharing System - comprising: enabling a sender wireless device to send a payload including a location descriptor and a list of target 07-02-2009
333. 20090166886 MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTRA-STACK ENCAPSULATION 07-02-2009
334. 20090166885 INTEGRATED CIRCUIT PACKAGE WITH IMPROVED CONNECTIONS 07-02-2009
335. 20090166845 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EXTENDED CORNER LEADS 07-02-2009
336. 20090166835 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERPOSER 07-02-2009
337. 20090166834 MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING INTERPOSER 07-02-2009
338. 20090166824 LEADLESS PACKAGE SYSTEM HAVING EXTERNAL CONTACTS 07-02-2009
339. 20090166823 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEAD LOCKING STRUCTURE 07-02-2009
340. 20090166822 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SHIELDING 07-02-2009
341. 20090161330 CHIP CARRIER AND FABRICATION METHOD - substrate having a ground plane, a first side, and a second side is provided 06-25-2009
342. 20090155961 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION 06-18-2009
343. 20090155960 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OFFSET STACKING AND ANTI-FLASH STRUCTURE 06-18-2009
344. 20090152740 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLIP CHIP 06-18-2009
345. 20090152706 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERCONNECT LOCK 06-18-2009
346. 20090152704 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER 06-18-2009
347. 20090152701 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION 06-18-2009
348. 20090152700 MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTABLE INTEGRATED CIRCUIT DIE 06-18-2009
349. 20090152692 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OFFSET STACKING 06-18-2009
350. 20090152688 INTEGRATED CIRCUIT PACKAGE SYSTEM FOR SHIELDING ELECTROMAGNETIC INTERFERENCE 06-18-2009
351. 20090152547 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME INTERPOSER AND METHOD OF MANUFACTURE THEREOF 06-18-2009
352. 20090149173 WIRELESS NETWORK PROFILING SYSTEM - is provided including providing a base station tester for attaching to a cellular base station 06-11-2009
353. 20090147671 SYSTEM FOR TESTING THE UPSTREAM CHANNEL OF A CABLE NETWORK 06-11-2009
354. 20090146315 INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM AND METHOD OF MANUFACTURE THEREOF 06-11-2009
355. 20090146271 INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM 06-11-2009
356. 20090146269 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SHIELD 06-11-2009
357. 20090146268 INTEGRATED CIRCUIT PACKAGE SYSTEM FOR ELECTROMAGNETIC ISOLATION 06-11-2009
358. 20090146262 INTEGRATED CIRCUIT SYSTEM EMPLOYING SELECTIVE EPITAXIAL GROWTH TECHNOLOGY 06-11-2009
359. 20090146181 INTEGRATED CIRCUIT SYSTEM EMPLOYING DIFFUSED SOURCE/DRAIN EXTENSIONS 06-11-2009
360. 20090140992 DISPLAY SYSTEM - including: providing a processor 06-04-2009
361. 20090140408 INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH STACKING VIA INTERCONNECT 06-04-2009
362. 20090140407 INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH ANTI-MOLD FLASH FEATURE 06-04-2009
363. 20090134509 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CARRIER AND METHOD OF MANUFACTURE THEREOF 05-28-2009
364. 20090132762 REMOVABLE NONVOLATILE MEMORY SYSTEM WITH FUNCTIONAL INHIBITION 05-21-2009
365. 20090127720 DROP-MOLD CONFORMABLE MATERIAL AS AN ENCAPSULATION FOR AN INTEGRATED CIRCUIT PACKAGE SYSTEM 05-21-2009
366. 20090127719 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE SUBSTRATE HAVING CORNER CONTACTS 05-21-2009
367. 20090127715 MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTRUSION 05-21-2009
368. 20090127683 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INSULATOR 05-21-2009
369. 20090127680 INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH WIRE-IN-FILM ENCAPSULANT 05-21-2009
370. 20090121335 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION 05-14-2009
371. 20090115043 MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING INTERCONNECTS 05-07-2009
372. 20090115040 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ARRAY OF EXTERNAL INTERCONNECTS 05-07-2009
373. 20090115032 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL CONNECTIVITY 05-07-2009
374. 20090108428 MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUBSTRATE HAVING A CONDUCTOR-FREE RECESS 04-30-2009
375. 20090106522 ELECTRONIC SYSTEM WITH DYNAMIC SELECTION OF MULTIPLE COMPUTING DEVICE 04-23-2009
376. 20090102069 INTEGRATED CIRCUIT SYSTEM WITH ASSIST FEATURE 04-23-2009
377. 20090096112 INTEGRATED CIRCUIT UNDERFILL PACKAGE SYSTEM 04-16-2009
378. 20090091042 INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING DIE HAVING RELIEVED ACTIVE REGION 04-09-2009
379. 20090090975 INTEGRATED CIRCUIT SYSTEM EMPLOYING FLUORINE DOPING 04-09-2009
380. 20090085199 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLD LOCK SUBASSEMBLY 04-02-2009
381. 20090085181 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DIE 04-02-2009
382. 20090085178 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BASE STRUCTURE DEVICE 04-02-2009
383. 20090085177 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFRAME ARRAY 04-02-2009
384. 20090081814 INTEGRATED MANUFACTURING SYSTEM WITH TRANSISTOR DRIVE CURRENT CONTROL 03-26-2009
385. 20090079096 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DEVICE UNITS 03-26-2009
386. 20090079091 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER 03-26-2009
387. 20090079066 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PASSIVE COMPONENTS 03-26-2009
388. 20090079049 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WARP-FREE CHIP 03-26-2009
389. 20090079048 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH UNDER PADDLE LEADFINGERS 03-26-2009
390. 20090072412 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE ENCAPSULATION HAVING RECESS 03-19-2009
391. 20090072378 MEMORY DEVICE SYSTEM WITH STACKED PACKAGES 03-19-2009
392. 20090072377 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DELAMINATION PREVENTION STRUCTURE 03-19-2009
393. 20090072375 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTI-CHIP MODULE 03-19-2009
394. 20090072366 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL CONNECTIVITY 03-19-2009
395. 20090072365 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EXTERNAL INTERCONNECTS AT HIGH DENSITY 03-19-2009
396. 20090072364 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADS SEPARATED FROM A DIE PADDLE 03-19-2009
397. 20090072363 INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH LEADS 03-19-2009
398. 20090063802 DATA SECURITY SYSTEM - [100] [800] [900] [1600] [2000] includes providing a unique identification from a first system [102] to a second system [104] 03-05-2009
399. 20090063038 Navigation system having location based service and temporal management 03-05-2009
400. 20090057864 INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING AN OFFSET STACKED CONFIGURATION 03-05-2009
401. 20090057863 INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH ANTI-MOLD FLASH FEATURE 03-05-2009
402. 20090057862 INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH CARRIER INTERPOSER 03-05-2009
403. 20090057861 INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH SIDE-BY-SIDE AND OFFSET STACKING 03-05-2009
404. 20090039388 INTEGRATED CIRCUIT SYSTEM EMPLOYING A CONDENSATION PROCESS 02-12-2009
405. 20090032932 INTEGRATED CIRCUIT PACKAGING SYSTEM FOR FINE PITCH SUBSTRATES 02-05-2009
406. 20090032918 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DEVICES 02-05-2009
407. 20090027863 Method for making a semiconductor multipackage module including a processor and memory package assemblies 01-29-2009
408. 20090026597 STACKED INTEGRATED CIRCUIT LEADFRAME PACKAGE SYSTEM 01-29-2009
409. 20090026568 OPTICAL COLOR SENSOR SYSTEM - is provided including providing a substrate having an optical sensor therein and forming a passivation layer over the 01-29-2009
410. 20090026280 REGULATION CONTROL SYSTEM OF AIR CONDITIONING EQUIPMENT 01-29-2009
411. 20090021306 INTEGRATED CIRCUIT SYSTEM FOR LINE REGULATION OF AN AMPLIFIER 01-22-2009
412. 20090020893 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH TRIPLE FILM SPACER 01-22-2009
413. 20090016033 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEXIBLE SUBSTRATE AND MOUNDED PACKAGE 01-15-2009
414. 20090016032 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEXIBLE SUBSTRATE AND RECESSED PACKAGE 01-15-2009
415. 20090014899 INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING STACKED DIE 01-15-2009
416. 20090014893 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WIRE-IN-FILM ISOLATION BARRIER 01-15-2009
417. 20090014883 INTEGRATED CIRCUIT SYSTEM WITH DUMMY REGION 01-15-2009
418. 20090014866 MULTICHIP MODULE PACKAGE AND FABRICATION METHOD 01-15-2009
419. 20090014849 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE MOLDING 01-15-2009
420. 20090014543 INTEGRATED CIRCUIT SYSTEM WITH ANTENNA - system for manufacturing an integrated circuit system having a substrate with a integrated circuit device 01-15-2009
421. 20090012650 NETWORK-BASED AIR-CONDITIONING EQUIPMENT REMOTE MONITORING AND MANAGEMENT SYSTEM 01-08-2009
422. 20090009282 NETWORK-BASED LIGHTING EQUIPMENT REMOTE MONITORING AND MANAGEMENT SYSTEM 01-08-2009
423. 20090008768 SEMICONDUCTOR PACKAGE SYSTEM WITH PATTERNED MASK OVER THERMAL RELIEF 01-08-2009
424. 20090008761 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEX BUMP 01-08-2009
425. 20090008760 SEMICONDUCTOR DEVICE HAS ENCAPSULANT WITH CHAMFER SUCH THAT PORTION OF SUBSTRATE AND CHAMFER ARE EXPOSED FROM ENCAPSULANT AND REMAINING PORTION OF SURFACE OF SUBSTRATE IS COVERED BY ENCAPSULANT 01-08-2009
426. 20090004504 CIRCUIT SYSTEM WITH CIRCUIT ELEMENT AND REFERENCE PLANE 01-01-2009
427. 20090002961 PACKAGING SYSTEM WITH HOLLOW PACKAGE - packaging system comprising: forming terminal leads 01-01-2009
428. 20090001613 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OVERHANG DIE 01-01-2009
429. 20090001612 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION 01-01-2009
430. 20090001593 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OVERHANGING CONNECTION STACK 01-01-2009
431. 20090001563 INTEGRATED CIRCUIT PACKAGE IN PACKAGE SYSTEM WITH ADHESIVELESS PACKAGE ATTACH 01-01-2009
432. 20090001549 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SYMMETRIC PACKAGING 01-01-2009
433. 20090001545 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SIDE SUBSTRATE 01-01-2009
434. 20090001539 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH TOP AND BOTTOM TERMINALS 01-01-2009
435. 20090001531 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTEGRAL INNER LEAD AND PADDLE 01-01-2009
436. 20090001509 CIRCUIT SYSTEM WITH CIRCUIT ELEMENT - circuit system includes: forming a first electrode over a substrate 01-01-2009
437. 20080315603 PICK AND PLACE SYSTEM - including: moving a vacuum probe in a linear direction using a linear actuator system 12-25-2008
438. 20080315411 INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING 12-25-2008
439. 20080315406 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CAVITY SUBSTRATE 12-25-2008
440. 20080315380 INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING PERIMETER PADDLE 12-25-2008
441. 20080315374 INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM 12-25-2008
442. 20080315317 SEMICONDUCTOR SYSTEM HAVING COMPLEMENTARY STRAINED CHANNELS 12-25-2008
443. 20080308933 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIFFERENT CONNECTION STRUCTURES 12-18-2008
444. 20080303142 ELECTRONIC SYSTEM WITH VERTICAL INTERMETALLIC COMPOUND 12-11-2008
445. 20080303133 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONTOURED DIE 12-11-2008
446. 20080303123 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFINGER 12-11-2008
447. 20080303122 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADED PACKAGE 12-11-2008
448. 20080299938 Mobile Batttery Management System - mobile battery management system comprising receiving a battery management parameter by a client from a server over 12-04-2008
449. 20080297269 FREQUENCY SHIFT KEYING MODULATOR HAVING SIGMA-DELTA MODULATED PHASE ROTATOR 12-04-2008
450. 20080297250 INTEGRATED CIRCUIT SYSTEM FOR CONTROLLING AMPLIFIER GAIN 12-04-2008
451. 20080297227 INTEGRATED CIRCUIT SYSTEM FOR ANALOG SWITCHING 12-04-2008
452. 20080291701 POWER CONVERTER FOR COMPENSATING MAXIMUM OUTPUT POWER AND PWM CONTROLLER FOR THE SAME 11-27-2008
453. 20080291700 POWER CONVERTER HAVING PWM CONTROLLER FOR MAXIMUM OUTPUT POWER COMPENSATION 11-27-2008
454. 20080290849 VOLTAGE REGULATION SYSTEM - is provided including detecting a feedback voltage less than a reference voltage 11-27-2008
455. 20080290485 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH RELIEF 11-27-2008
456. 20080284066 INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING RESILIENT MEMBER MOLD SYSTEM TECHNOLOGY 11-20-2008
457. 20080284038 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PERIMETER PADDLE 11-20-2008
458. 20080284002 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH THIN PROFILE 11-20-2008
459. 20080283998 ELECTRONIC SYSTEM WITH EXPANSION FEATURE 11-20-2008
460. 20080273312 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERFERENCE-FIT FEATURE 11-06-2008
461. 20080272487 SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS 11-06-2008
462. 20080272479 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DEVICE CAVITY 11-06-2008
463. 20080265409 INTEGRATED CIRCUIT HARD MASK PROCESSING SYSTEM 10-30-2008
464. 20080263542 Software-Firmware Transfer System - software and/or hardware transfer system is provided including: reading hidden computing device identification 10-23-2008
465. 20080258289 INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING 10-23-2008
466. 20080251901 STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM 10-16-2008
467. 20080251383 Microfluidic Liquid Stream Configuration System 10-16-2008
468. 20080242053 INTEGRATED CIRCUIT SYSTEM WITH A DEBRIS TRAPPING SYSTEM 10-02-2008
469. 20080238937 HAPTIC INTERFACE SYSTEM FOR VIDEO SYSTEMS 10-02-2008
470. 20080237880 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTECTED CONDUCTIVE LAYERS 10-02-2008
471. 20080237873 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BONDING IN VIA 10-02-2008
472. 20080237825 STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONDUCTIVE SPACER 10-02-2008
473. 20080237817 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEAT SINK SPACER STRUCTURES 10-02-2008
474. 20080237816 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATING FEATURES 10-02-2008
475. 20080237343 PRODUCT IDENTIFICATION SYSTEM WITH COMPONENT CHARACTERISTICS 10-02-2008
476. 20080237157 WAFER TRANSPORT SYSTEM - is provided including providing a wafer cassette having a slot, and placing a protection insert into the slot 10-02-2008
477. 20080235941 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING FEATURES 10-02-2008
478. 20080230925 SOLDER-BUMPING STRUCTURES PRODUCED BY A SOLDER BUMPING METHOD 09-25-2008
479. 20080230907 INTEGRATED CIRCUIT SYSTEM WITH CARBON ENHANCEMENT 09-25-2008
480. 20080230883 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLDED STRIP PROTRUSION 09-25-2008
481. 20080230881 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEAD SUPPORT 09-25-2008
482. 20080230841 INTEGRATED CIRCUIT SYSTEM EMPLOYING STRESS MEMORIZATION TRANSFER 09-25-2008
483. 20080227238 INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MULTI-PACKAGE MODULE TECHNIQUES 09-18-2008
484. 20080224871 Radio Frequency Identification System - includes: supplying a radio frequency identification tag including providing a radio frequency identification 09-18-2008
485. 20080220563 MODULE HAVING STACKED CHIP SCALE SEMICONDUCTOR PACKAGES 09-11-2008
486. 20080218969 ELECTRONIC SYSTEM WITH ADJUSTABLE VENTING SYSTEM 09-11-2008
487. 20080217726 INTEGRATED CIRCUIT SYSTEM EMPLOYING DIPOLE MULTIPLE EXPOSURE 09-11-2008
488. 20080215841 Memory Lock System - is provided that includes: providing a controller 09-04-2008
489. 20080215807 VIDEO DATA SYSTEM - is presented including buffering video data for a display device preserving the video data in a non-volatile video random access 09-04-2008
490. 20080211111 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH UNDERFILL 09-04-2008
491. 20080211084 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERPOSER 09-04-2008
492. 20080209259 METHOD AND SYSTEM FOR TESTING RELIABILITY OF DATA STORED IN RAID 08-28-2008
493. 20080209235 POWER SWITCHING CIRCUIT - includes a flip-flop for receiving an abnormal power-off signal output by shutdown software of an electronic device 08-28-2008
494. 20080204991 ELECTRONIC SYSTEM WITH REMOVABLE COMPUTING DEVICE AND MUTABLE FUNCTIONS 08-28-2008
495. 20080204599 MOBILE DISPLAY CONTROL SYSTEM - is provided including providing a camera for monitoring an ambient light level 08-28-2008
496. 20080203549 STACKABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE INTERCONNECT INTERFACE 08-28-2008
497. 20080198636 SWITCHING CONTROLLER FOR PARALLEL POWER SUPPLY 08-21-2008
498. 20080197708 SWITCHING CONTROLLER FOR POWER SHARING OF PARALLEL POWER SUPPLIES 08-21-2008