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PATTERSON & SHERIDAN, LLP - - APPM/TX

HOUSTON, TX US

1. 20090275215 SUITABLY SHORT WAVELENGTH LIGHT FOR LASER ANNEALING OF SILICON IN DSA TYPE SYSTEMS 11-05-2009
2. 20090274830 ROLL TO ROLL OLED PRODUCTION SYSTEM - The present invention generally relates to a method and an apparatus for processing one or more substrates on a 11-05-2009
3. 20090274454 SYSTEM FOR NON RADIAL TEMPERATURE CONTROL FOR ROTATING SUBSTRATES 11-05-2009
4. 20090272717 METHOD AND APPARATUS OF A SUBSTRATE ETCHING SYSTEM AND PROCESS 11-05-2009
5. 20090272647 PROCESS KIT FOR RF PHYSICAL VAPOR DEPOSITION 11-05-2009
6. 20090270015 HIGH THROUGHPUT CHEMICAL MECHANICAL POLISHING SYSTEM 10-29-2009
7. 20090269923 ADHESION AND ELECTROMIGRATION IMPROVEMENT BETWEEN DIELECTRIC AND CONDUCTIVE LAYERS 10-29-2009
8. 20090269512 NONPLANAR FACEPLATE FOR A PLASMA PROCESSING CHAMBER 10-29-2009
9. 20090269507 SELECTIVE COBALT DEPOSITION ON COPPER SURFACES 10-29-2009
10. 20090266139 REAL TIME LEAD-LINE CHARACTERIZATION FOR MFC FLOW VERIFICATION 10-29-2009
11. 20090264056 SUBSTRATE HOLDER WITH LIQUID SUPPORTING SURFACE 10-22-2009
12. 20090264049 PLATEN EXHAUST FOR CHEMICAL MECHANICAL POLISHING SYSTEM 10-22-2009
13. 20090263972 BORON NITRIDE AND BORON-NITRIDE DERIVED MATERIALS DEPOSITION METHOD 10-22-2009
14. 20090263961 HARDWARE SET FOR GROWTH OF HIGH K & CAPPING MATERIAL FILMS 10-22-2009
15. 20090263930 MICROCRYSTALLINE SILICON DEPOSITION FOR THIN FILM SOLAR APPLICATIONS 10-22-2009
16. 20090263215 END EFFECTOR FOR A CLUSTER TOOL - Embodiments of the present invention generally provide an apparatus and method for transferring substrates in a 10-22-2009
17. 20090261331 LOW TEMPERATURE THIN FILM TRANSISTOR PROCESS, DEVICE PROPERTY, AND DEVICE STABILITY IMPROVEMENT 10-22-2009
18. 20090260982 WAFER PROCESSING DEPOSITION SHIELDING COMPONENTS 10-22-2009
19. 20090258574 POLISHING SYSTEM HAVING A TRACK - Embodiments described herein relate to a track system in a polishing system 10-15-2009
20. 20090258484 METHODS FOR FABRICATING DUAL MATERIAL GATE IN A SEMICONDUCTOR DEVICE 10-15-2009
21. 20090258162 PLASMA PROCESSING APPARATUS AND METHOD - The present invention generally includes a plasma enhanced chemical vapor deposition processing chamber having 10-15-2009
22. 20090257927 FOLDED COAXIAL RESONATORS - method for constructing a distributed element coaxial resonator includes folding a coaxial resonator to provide a structure 10-15-2009
23. 20090256581 SOLAR PARAMETRIC TESTING MODULE AND PROCESSES 10-15-2009
24. 20090255892 METHOD AND APPARATUS TO REMOVE AND REPLACE FACTORY INTERFACE TRACK 10-15-2009
25. 20090255798 METHOD TO PREVENT PARASITIC PLASMA GENERATION IN GAS FEEDTHRU OF LARGE SIZE PECVD CHAMBER 10-15-2009
26. 20090250955 WAFER TRANSFER BLADE - Projections 22 of the blade 16 provided on a blade surface in a wafer-loading region 18b of a body 18 support a wafer W loaded on 10-08-2009
27. 20090250169 LOWER LINER WITH INTEGRATED FLOW EQUALIZER AND IMPROVED CONDUCTANCE 10-08-2009
28. 20090242957 ATOMIC LAYER DEPOSITION PROCESSES FOR NON-VOLATILE MEMORY DEVICES 10-01-2009
29. 20090239359 INTEGRATED PROCESS SYSTEM AND PROCESS SEQUENCE FOR PRODUCTION OF THIN FILM TRANSISTOR ARRAYS USING DOPED OR COMPOUNDED METAL OXIDE SEMICONDUCTOR 09-24-2009
30. 20090238734 SUSCEPTOR WITH ROLL-FORMED SURFACE AND METHOD FOR MAKING SAME 09-24-2009
31. 20090236597 PROCESS TO MAKE METAL OXIDE THIN FILM TRANSISTOR ARRAY WITH ETCH STOPPING LAYER 09-24-2009
32. 20090236315 SHIELDED LID HEATER ASSEMBLY - shielded lid heater lid heater suitable for use with a plasma processing chamber a plasma processing chamber having a 09-24-2009
33. 20090236214 TUNABLE GROUND PLANES IN PLASMA CHAMBERS 09-24-2009
34. 20090233424 THIN FILM METAL OXYNITRIDE SEMICONDUCTORS 09-17-2009
35. 20090233387 LINEAR PLASMA SOURCE FOR DYNAMIC (MOVING SUBSTRATE) PLASMA PROCESSING 09-17-2009
36. 20090233384 METHOD FOR MEASURING DOPANT CONCENTRATION DURING PLASMA ION IMPLANTATION 09-17-2009
37. 20090232986 HEATED VALVE MANIFOLD FOR AMPOULE - Embodiments of the invention provide an apparatus and a method for generating a gaseous chemical precursor that may 09-17-2009
38. 20090232630 TENDON ENHANCED END EFFECTOR - end effector assembly for a substrate transfer robot is described 09-17-2009
39. 20090230425 WATER-BARRIER ENCAPSULATION METHOD - The present invention generally relates to organic light emitting diode structures and methods for their 09-17-2009
40. 20090230089 ELECTRICAL CONTROL OF PLASMA UNIFORMITY USING EXTERNAL CIRCUIT 09-17-2009
41. 20090221217 SOLAR PANEL EDGE DELETION MODULE - The present invention generally relates to an edge deletion module positioned within an automated solar cell 09-03-2009
42. 20090221150 ETCH RATE AND CRITICAL DIMENSION UNIFORMITY BY SELECTION OF FOCUS RING MATERIAL 09-03-2009
43. 20090221149 MULTIPLE PORT GAS INJECTION SYSTEM UTILIZED IN A SEMICONDUCTOR PROCESSING SYSTEM 09-03-2009
44. 20090220865 METHOD AND APPARATUS FOR SOURCE FIELD SHAPING IN A PLASMA ETCH REACTOR 09-03-2009
45. 20090218324 DIRECT REAL-TIME MONITORING AND FEEDBACK CONTROL OF RF PLASMA OUTPUT FOR WAFER PROCESSING 09-03-2009
46. 20090218317 METHOD TO CONTROL UNIFORMITY USING TRI-ZONE SHOWERHEAD 09-03-2009
47. 20090218315 METHOD AND SYSTEM FOR CONTROLLING CENTER-TO-EDGE DISTRIBUTION OF SPECIES WITHIN A PLASMA 09-03-2009
48. 20090218314 ADVANCED PROCESS SENSING AND CONTROL USING NEAR INFRARED SPECTRAL REFLECTOMETRY 09-03-2009
49. 20090218043 GAS FLOW EQUALIZER PLATE SUITABLE FOR USE IN A SUBSTRATE PROCESS CHAMBER 09-03-2009
50. 20090217953 DRIVE ROLLER FOR A CLEANING SYSTEM - drive roller for use in a semiconductor substrate cleaning system is provided 09-03-2009
51. 20090215264 PROCESS FOR SELECTIVE GROWTH OF FILMS DURING ECP PLATING 08-27-2009
52. 20090215260 METHODS OF FORMING A BARRIER LAYER IN AN INTERCONNECT STRUCTURE 08-27-2009
53. 20090214798 APPARATUS AND METHOD FOR FRONT SIDE PROTECTION DURING BACKSIDE CLEANING 08-27-2009
54. 20090211071 METHOD AND APPARATUS FOR FORMING AN ELECTRICAL CONNECTION ON A SOLAR CELL 08-27-2009
55. 20090209112 MILLISECOND ANNEALING (DSA) EDGE PROTECTION 08-20-2009
56. 20090205703 APPARATUS AND METHOD OF MOUNTING AND SUPPORTING A SOLAR PANEL 08-20-2009
57. 20090203197 NOVEL METHOD FOR CONFORMAL PLASMA IMMERSED ION IMPLANTATION ASSISTED BY ATOMIC LAYER DEPOSITION 08-13-2009
58. 20090202710 ATOMIC LAYER DEPOSITION OF TANTALUM-CONTAINING MATERIALS USING THE TANTALUM PRECURSOR TAIMATA 08-13-2009
59. 20090200553 HIGH TEMPERATURE THIN FILM TRANSISTOR ON SODA LIME GLASS 08-13-2009
60. 20090200552 MICROCRYSTALLINE SILICON THIN FILM TRANSISTOR 08-13-2009
61. 20090200551 MICROCRYSTALLINE SILICON THIN FILM TRANSISTOR 08-13-2009
62. 20090200279 AUTOMATIC FOCUS AND EMISSIVITY MEASUREMENTS FOR A SUBSTRATE SYSTEM 08-13-2009
63. 20090199765 HIGH EFFICIENCY ELECTRO-STATIC CHUCKS FOR SEMICONDUCTOR WAFER PROCESSING 08-13-2009
64. 20090197406 SEQUENTIAL DEPOSITION OF TANTALUM NITRIDE USING A TANTALUM-CONTAINING PRECURSOR AND A NITROGEN-CONTAINING PRECURSOR 08-06-2009
65. 20090197086 ELIMINATION OF PHOTORESIST MATERIAL COLLAPSE AND POISONING IN 45-NM FEATURE SIZE USING DRY OR IMMERSION LITHOGRAPHY 08-06-2009
66. 20090196724 EDGE CONTACT GRIPPER - The present invention generally provides a method and apparatus for supporting and transferring a substrate 08-06-2009
67. 20090195777 DOSIMETRY USING OPTICAL EMISSION SPECTROSCOPY/RESIDUAL GAS ANALYZER IN CONJUNCTION WITH ION CURRENT 08-06-2009
68. 20090195262 IN-LINE ELECTRON BEAM TEST SYSTEM - method and apparatus for testing a plurality of electronic devices formed on a large area substrate is described 08-06-2009
69. 20090194026 PROCESSING SYSTEM FOR FABRICATING COMPOUND NITRIDE SEMICONDUCTOR DEVICES 08-06-2009
70. 20090194024 CVD APPARATUS - Embodiments of the present invention generally relate to methods and apparatus for chemical vapor deposition on a substrate 08-06-2009
71. 20090191711 HARDMASK OPEN PROCESS WITH ENHANCED CD SPACE SHRINK AND REDUCTION 07-30-2009
72. 20090191703 PROCESS WITH SATURATION AT LOW ETCH AMOUNT FOR HIGH CONTACT BOTTOM CLEANING EFFICIENCY FOR CHEMICAL DRY CLEAN PROCESS 07-30-2009
73. 20090188625 ETCHING CHAMBER HAVING FLOW EQUALIZER AND LOWER LINER 07-30-2009
74. 20090188603 METHOD AND APPARATUS FOR CONTROLLING LAMINATOR TEMPERATURE ON A SOLAR CELL 07-30-2009
75. 20090188102 AUTOMATED SOLAR CELL ELECTRICAL CONNECTION APPARATUS 07-30-2009
76. 20090186282 CONTAMINATION PREVENTION IN EXTREME ULTRAVIOLET LITHOGRAPHY 07-23-2009
77. 20090184093 HIGH TEMPERATURE FINE GRAIN ALUMINUM HEATER 07-23-2009
78. 20090183322 ELECTROSTATIC SURFACE CLEANING - Embodiments of the present invention generally provide apparatus and methods for cleaning a substrate, such as a mask 07-23-2009
79. 20090179085 HEATED SHOWERHEAD ASSEMBLY - The present invention generally comprises a heated showerhead assembly that may be used to supply processing gases into a 07-16-2009
80. 20090178927 METHODS AND COMPOSITIONS FOR ELECTROPHORETIC METALLIZATION DEPOSITION 07-16-2009
81. 20090178617 RF GROUNDING OF CATHODE IN PROCESS CHAMBER 07-16-2009
82. 20090163042 THERMAL REACTOR WITH IMPROVED GAS FLOW DISTRIBUTION 06-25-2009
83. 20090163033 METHODS FOR EXTENDING CHAMBER COMPONENT LIFE TIME 06-25-2009
84. 20090162996 REMOVAL OF SURFACE DOPANTS FROM A SUBSTRATE 06-25-2009
85. 20090162952 APPARATUS AND METHOD FOR CONTROLLING EDGE PERFORMANCE IN AN INDUCTIVELY COUPLED PLASMA CHAMBER 06-25-2009
86. 20090162570 APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE USING INDUCTIVELY COUPLED PLASMA TECHNOLOGY 06-25-2009
87. 20090162551 HAFNIUM OXIDE ALD PROCESS - method and apparatus for performing ALD deposition of hafnium oxide on a substrate is provided 06-25-2009
88. 20090162259 HIGH EFFICIENCY UV CURING SYSTEM - ultraviolet cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof 06-25-2009
89. 20090159573 FOUR SURFACES COOLING BLOCK - cooling block for coupling a remote plasma source to a resistor is disclosed 06-25-2009
90. 20090159566 METHOD AND APPARATUS FOR CONTROLLING TEMPERATURE OF A SUBSTRATE 06-25-2009
91. 20090159425 METHOD OF CORRECTING BASELINE SKEW BY A NOVEL MOTORIZED SOURCE COIL ASSEMBLY 06-25-2009
92. 20090159424 DUAL ZONE GAS INJECTION NOZZLE - The present invention generally provides apparatus and method for processing a substrate 06-25-2009
93. 20090158265 IMPLEMENTATION OF ADVANCED ENDPOINT FUNCTIONS WITHIN THIRD PARTY SOFTWARE BY USING A PLUG-IN APPROACH 06-18-2009
94. 20090156004 METHOD FOR FORMING TUNGSTEN MATERIALS DURING VAPOR DEPOSITION PROCESSES 06-18-2009
95. 20090156003 METHOD FOR DEPOSITING TUNGSTEN-CONTAINING LAYERS BY VAPOR DEPOSITION TECHNIQUES 06-18-2009
96. 20090155025 LIFT PIN FOR SUBSTRATE PROCESSING - lift pin is provided for manipulating a substrate above a support surface of a substrate support and uniformly 06-18-2009
97. 20090151636 RPSC AND RF FEEDTHROUGH - The present invention generally comprises an apparatus having an RF choke and a remote plasma source combined into a single 06-18-2009
98. 20090149008 METHOD FOR DEPOSITING GROUP III/V COMPOUNDS 06-11-2009
99. 20090148764 METHOD FOR HIGH VOLUME MANUFACTURING OF THIN FILM BATTERIES 06-11-2009
100. 20090148033 OPTICAL INSPECTION APPARATUS FOR SUBSTRATE DEFECT DETECTION 06-11-2009
101. 20090146264 THIN FILM TRANSISTOR ON SODA LIME GLASS WITH BARRIER LAYER 06-11-2009
102. 20090145760 ELECTROPHORETIC SOLAR CELL METALLIZATION PROCESS AND APPARATUS 06-11-2009
103. 20090145360 METHOD AND APPARATUS FOR CLEANING A CVD CHAMBER 06-11-2009
104. 20090142880 Solar Cell Contact Formation Process Using A Patterned Etchant Material 06-04-2009
105. 20090142878 PLASMA TREATMENT BETWEEN DEPOSITION PROCESSES 06-04-2009
106. 20090142875 METHOD OF MAKING AN IMPROVED SELECTIVE EMITTER FOR SILICON SOLAR CELLS 06-04-2009
107. 20090142512 APPARATUS AND METHOD FOR DEPOSITING ELECTRICALLY CONDUCTIVE PASTING MATERIAL 06-04-2009
108. 20090142474 RUTHENIUM AS AN UNDERLAYER FOR TUNGSTEN FILM DEPOSITION 06-04-2009
109. 20090139568 Crystalline Solar Cell Metallization Methods 06-04-2009
110. 20090137132 DECREASING THE ETCH RATE OF SILICON NITRIDE BY CARBON ADDITION 05-28-2009
111. 20090136652 SHOWERHEAD DESIGN WITH PRECURSOR SOURCE - method and apparatus that may be utilized in deposition processes such as hydride vapor phase epitaxial 05-28-2009
112. 20090132189 METHOD FOR DETERMINING PLASMA CHARACTERISTICS 05-21-2009
113. 20090130856 METHOD FOR MONITORING PROCESS DRIFT USING PLASMA CHARACTERISTICS 05-21-2009
114. 20090130837 IN SITU DEPOSITION OF A LOW K DIELECTRIC LAYER, BARRIER LAYER, ETCH STOP, AND ANTI-REFLECTIVE COATING FOR DAMASCENE APPLICATION 05-21-2009
115. 20090130827 INTRINSIC AMORPHOUS SILICON LAYER - Embodiments of the present invention may include an improved thin film solar cell device that is formed by 05-21-2009
116. 20090121157 PULSE TRAIN ANNEALING METHOD AND APPARATUS 05-14-2009
117. 20090120924 PULSE TRAIN ANNEALING METHOD AND APPARATUS 05-14-2009
118. 20090120803 Pad for electrochemical processing - Systems and methods for electrochemically processing 05-14-2009
119. 20090120799 MULTIPLE-STEP ELECTRODEPOSITION PROCESS FOR DIRECT COPPER PLATING ON BARRIER METALS 05-14-2009
120. 20090117745 METHODS FOR SELECTIVELY ETCHING A BARRIER LAYER IN DUAL DAMASCENE APPLICATIONS 05-07-2009
121. 20090114157 AMPOULE SPLASH GUARD APPARATUS - Embodiments of the invention provide an apparatus for generating a precursor gas used in a vapor deposition process 05-07-2009
122. 20090114153 METHOD AND APPARATUS FOR SEALING AN OPENING OF A PROCESSING CHAMBER 05-07-2009
123. 20090111280 METHOD FOR REMOVING OXIDES - method for removing native oxides from a substrate surface is provided 04-30-2009
124. 20090111264 PLASMA-ENHANCED CYCLIC LAYER DEPOSITION PROCESS FOR BARRIER LAYERS 04-30-2009
125. 20090110520 ADVANCED FI BLADE FOR HIGH TEMPERATURE EXTRACTION 04-30-2009
126. 20090107955 OFFSET LINER FOR CHAMBER EVACUATION - The present invention generally includes a chamber liner spaced from a chamber wall to permit processing gases to 04-30-2009
127. 20090107626 ADHESION IMPROVEMENT OF DIELECTRIC BARRIER TO COPPER BY THE ADDITION OF THIN INTERFACE LAYER 04-30-2009
128. 20090107549 PERCOLATING AMORPHOUS SILICON SOLAR CELL 04-30-2009
129. 20090105873 METHOD OF DYNAMIC TEMPERATURE CONTROL DURING MICROCRYSTALLINE SI GROWTH 04-23-2009
130. 20090104733 MICROCRYSTALLINE SILICON DEPOSITION FOR THIN FILM SOLAR APPLICATIONS 04-23-2009
131. 20090104732 CVD PROCESS GAS FLOW, PUMPING AND/OR BOOSTING 04-23-2009
132. 20090104541 PLASMA SURFACE TREATMENT TO PREVENT PATTERN COLLAPSE IN IMMERSION LITHOGRAPHY 04-23-2009
133. 20090104376 GAS DIFFUSION SHOWER HEAD DESIGN FOR LARGE AREA PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION 04-23-2009
134. 20090104342 PHOTOVOLTAIC FABRICATION PROCESS MONITORING AND CONTROL USING DIAGNOSTIC DEVICES 04-23-2009
135. 20090102502 PROCESS TESTERS AND TESTING METHODOLOGY FOR THIN-FILM PHOTOVOLTAIC DEVICES 04-23-2009
136. 20090101201 NIP-NIP THIN-FILM PHOTOVOLTAIC STRUCTURE 04-23-2009
137. 20090101069 RF RETURN PLATES FOR BACKING PLATE SUPPORT 04-23-2009
138. 20090098276 MULTI-GAS STRAIGHT CHANNEL SHOWERHEAD - method and apparatus that may be utilized for chemical vapor deposition and/or hydride vapor phase epitaxial 04-16-2009
139. 20090097184 ELECTROSTATIC CHUCK ASSEMBLY - The present invention generally comprises an electrostatic chuck base an electrostatic chuck assembly 04-16-2009
140. 20090095621 SUPPORT ASSEMBLY - method and apparatus for removing native oxides from a substrate surface is provided 04-16-2009
141. 20090095334 SHOWERHEAD ASSEMBLY - method and apparatus for removing native oxides from a substrate surface is provided 04-16-2009
142. 20090095222 MULTI-GAS SPIRAL CHANNEL SHOWERHEAD - method and apparatus that may be utilized for chemical vapor deposition and/or hydride vapor phase epitaxial 04-16-2009
143. 20090095221 MULTI-GAS CONCENTRIC INJECTION SHOWERHEAD 04-16-2009
144. 20090093132 METHODS TO OBTAIN LOW K DIELECTRIC BARRIER WITH SUPERIOR ETCH RESISTIVITY 04-09-2009
145. 20090093128 METHODS FOR HIGH TEMPERATURE DEPOSITION OF AN AMORPHOUS CARBON LAYER 04-09-2009
146. 20090093112 METHODS AND APPARATUS OF CREATING AIRGAP IN DIELECTRIC LAYERS FOR THE REDUCTION OF RC DELAY 04-09-2009
147. 20090093100 METHOD FOR FORMING AN AIR GAP IN MULTILEVEL INTERCONNECT STRUCTURE 04-09-2009
148. 20090093080 SOLAR CELLS AND METHODS AND APPARATUSES FOR FORMING THE SAME INCLUDING I-LAYER AND N-LAYER CHAMBER CLEANING 04-09-2009
149. 20090092466 MULTI-LEVEL LOAD LOCK CHAMBER, TRANSFER CHAMBER, AND ROBOT SUITABLE FOR INTERFACING WITH SAME 04-09-2009
150. 20090091817 HIGH SPEED PHASE SCRAMBLING OF A COHERENT BEAM USING PLASMA 04-09-2009
151. 20090090952 PLASMA SURFACE TREATMENT FOR SI AND METAL NANOCRYSTAL NUCLEATION 04-09-2009
152. 20090090883 CHAMBER ISOLATION VALVE RF GROUNDING - Embodiments described herein provide a method and apparatus for grounding a chamber isolation valve 04-09-2009
153. 20090088050 CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING 04-02-2009
154. 20090087983 ALUMINUM CONTACT INTEGRATION ON COBALT SILICIDE JUNCTION 04-02-2009
155. 20090087982 SELECTIVE RUTHENIUM DEPOSITION ON COPPER MATERIALS 04-02-2009
156. 20090087977 LOW TEMPERATURE CONFORMAL OXIDE FORMATION AND APPLICATIONS 04-02-2009
157. 20090087585 DEPOSITION PROCESSES FOR TITANIUM NITRIDE BARRIER AND ALUMINUM 04-02-2009
158. 20090084413 VAPOR DRYER HAVING HYDROPHILIC END EFFECTOR 04-02-2009
159. 20090081884 METHOD OF IMPROVING OXIDE GROWTH RATE OF SELECTIVE OXIDATION PROCESSES 03-26-2009
160. 20090081868 VAPOR DEPOSITION PROCESSES FOR TANTALUM CARBIDE NITRIDE MATERIALS 03-26-2009
161. 20090081866 VAPOR DEPOSITION OF TUNGSTEN MATERIALS - Embodiments of the invention provide an improved process for depositing tungsten-containing materials 03-26-2009
162. 20090078916 TANTALUM CARBIDE NITRIDE MATERIALS BY VAPOR DEPOSITION PROCESSES 03-26-2009
163. 20090078198 CHAMBER COMPONENTS WITH INCREASED PYROMETRY VISIBILITY 03-26-2009
164. 20090077805 PHOTOVOLTAIC PRODUCTION LINE - The present invention generally relates to a system that can be used to form a photovoltaic device 03-26-2009
165. 20090077804 PRODUCTION LINE MODULE FOR FORMING MULTIPLE SIZED PHOTOVOLTAIC DEVICES 03-26-2009
166. 20090071403 PECVD PROCESS CHAMBER WITH COOLED BACKING PLATE 03-19-2009
167. 20090068783 METHODS OF EMITTER FORMATION IN SOLAR CELLS 03-12-2009
168. 20090068433 CERAMIC COVER WAFERS OF ALUMINUM NITRIDE OR BERYLLIUM OXIDE 03-12-2009
169. 20090068356 HIGH PRODUCTIVITY PLASMA PROCESSING CHAMBER 03-12-2009
170. 20090067956 CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE 03-12-2009
171. 20090065816 MODULATING THE STRESS OF POLY-CRYSTALINE SILICON FILMS AND SURROUNDING LAYERS THROUGH THE USE OF DOPANTS AND MULTI-LAYER SILICON FILMS WITH CONTROLLED CRYSTAL STRUCTURE 03-12-2009
172. 20090064934 SOURCE GAS FLOW PATH CONTROL IN PECVD SYSTEM TO CONTROL A BY-PRODUCT FILM DEPOSITION ON INSIDE CHAMBER 03-12-2009
173. 20090064929 CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE 03-12-2009
174. 20090064928 CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE 03-12-2009
175. 20090061743 METHOD OF SOFT PAD PREPARATION TO REDUCE REMOVAL RATE RAMP-UP EFFECT AND TO STABILIZE DEFECT RATE 03-05-2009
176. 20090061741 ECMP POLISHING SEQUENCE TO IMPROVE PLANARITY AND DEFECT PERFORMANCE 03-05-2009
177. 20090061617 EDGE BEAD REMOVAL PROCESS WITH ECMP TECHNOLOGY 03-05-2009
178. 20090060687 TRANSFER CHAMBER WITH ROLLING DIAPHRAGM - Embodiments of the invention include a vacuum transfer chamber having one rolling or more rolling diaphragm 03-05-2009
179. 20090057264 HIGH THROUGHPUT LOW TOPOGRAPHY COPPER CMP PROCESS 03-05-2009
180. 20090056743 METHOD OF CLEANING PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION CHAMBER 03-05-2009
181. 20090056626 APPARATUS FOR CYCLICAL DEPOSITING OF THIN FILMS 03-05-2009
182. 20090053902 LOW DIELECTRIC (LOW K) BARRIER FILMS WITH OXYGEN DOPING BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD) 02-26-2009
183. 20090053893 ATOMIC LAYER DEPOSITION OF TUNGSTEN MATERIALS 02-26-2009
184. 20090053847 METHODS AND APPARATUS FOR DEPOSITING A MICROCRYSTALLINE SILICON FILM FOR PHOTOVOLTAIC DEVICE 02-26-2009
185. 20090053426 COBALT DEPOSITION ON BARRIER SURFACES - Embodiments of the invention provide processes for depositing a cobalt layer on a barrier layer and subsequently 02-26-2009
186. 20090050884 THIN FILM TRANSISTORS USING THIN FILM SEMICONDUCTOR MATERIALS 02-26-2009
187. 20090050270 SENSORS FOR DYNAMICALLY DETECTING SUBSTRATE BREAKAGE AND MISALIGNMENT OF A MOVING SUBSTRATE 02-26-2009
188. 20090047446 UNIFORMITY CONTROL FOR LOW FLOW PROCESS AND CHAMBER TO CHAMBER MATCHING 02-19-2009
189. 20090046750 INCREASED NANOSECOND LASER PULSE-TO-PULSE ENERGY REPEATABILITY USING ACTIVE LASER PULSE ENERGY CONTROL 02-19-2009
190. 20090045182 PULSED LASER ANNEAL SYSTEM ARCHITECTURE - Embodiments of the present invention provide method and apparatus for annealing semiconductor substrates 02-19-2009
191. 20090044753 METHODS TO IMPROVE THE IN-FILM DEFECTIVITY OF PECVD AMORPHOUS CARBON FILMS 02-19-2009
192. 20090042481 METHOD OF CALIBRATING OR COMPENSATING SENSOR FOR MEASURING PROPERTY OF A TARGET SURFACE 02-12-2009
193. 20090036037 APPARATUS FOR CONDITIONING PROCESSING PADS 02-05-2009
194. 20090036032 TEMPERATURE CONTROL FOR ECMP PROCESS - Methods for polishing a substrate are provided 02-05-2009
195. 20090035944 METHODS OF FOR FORMING ULTRA THIN STRUCTURES ON A SUBSTRATE 02-05-2009
196. 20090034072 METHOD AND APPARATUS FOR DECORRELATION OF SPATIALLY AND TEMPORALLY COHERENT LIGHT 02-05-2009
197. 20090034071 METHOD FOR PARTITIONING AND INCOHERENTLY SUMMING A COHERENT BEAM 02-05-2009
198. 20090032511 Apparatus and method of improving beam shaping and beam homogenization 02-05-2009
199. 20090032408 ELECTROLYTE RETAINING ON A ROTATING PLATEN BY DIRECTIONAL AIR FLOW 02-05-2009
200. 20090029560 Apparatus and method for single substrate processing 01-29-2009
201. 20090029544 ADHESION AND MINIMIZING OXIDATION ON ELECTROLESS CO ALLOY FILMS FOR INTEGRATION WITH LOW K INTER-METAL DIELECTRIC AND ETCH STOP 01-29-2009
202. 20090029528 METHOD AND APPARATUS FOR CLEANING A SUBSTRATE SURFACE 01-29-2009
203. 20090029502 APPARATUSES AND METHODS OF SUBSTRATE TEMPERATURE CONTROL DURING THIN FILM SOLAR MANUFACTURING 01-29-2009
204. 20090025749 METHOD FOR VERTICAL TRANSFER OF SEMICONDUCTOR SUBSTRATES IN A CLEANING MODULE 01-29-2009
205. 20090023241 CLEAN RATE IMPROVEMENT BY PRESSURE CONTROLLED REMOTE PLASMA SOURCE 01-22-2009
206. 20090022908 PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION TECHNOLOGY FOR LARGE-SIZE PROCESSING 01-22-2009
207. 20090022905 RF CHOKE FOR GAS DELIVERY TO AN RF DRIVEN ELECTRODE IN A PLASMA PROCESSING APPARATUS 01-22-2009
208. 20090020802 INTEGRATED SCHEME FOR FORMING INTER-POLY DIELECTRICS FOR NON-VOLATILE MEMORY DEVICES 01-22-2009
209. 20090020154 MULTI-JUNCTION SOLAR CELLS AND METHODS AND APPARATUSES FOR FORMING THE SAME 01-22-2009
210. 20090017640 BORON DERIVED MATERIALS DEPOSITION METHOD 01-15-2009
211. 20090017639 NOVEL SILICON PRECURSORS TO MAKE ULTRA LOW-K FILMS OF K<2.2 WITH HIGH MECHANICAL PROPERTIES BY PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION 01-15-2009
212. 20090017637 METHOD AND APPARATUS FOR BATCH PROCESSING IN A VERTICAL REACTOR 01-15-2009
213. 20090017635 APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE EDGE REGION 01-15-2009
214. 20090017231 NOVEL SILICON PRECURSORS TO MAKE ULTRA LOW-K FILMS WITH HIGH MECHANICAL PROPERTIES BY PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION 01-15-2009
215. 20090017228 APPARATUS AND METHOD FOR CENTERING A SUBSTRATE IN A PROCESS CHAMBER 01-15-2009
216. 20090016406 NOVEL METHOD FOR MONITORING AND CALIBRATING TEMPERATURE IN SEMICONDUCTOR PROCESSING CHAMBERS 01-15-2009
217. 20090014409 ENDPOINT DETECTION FOR PHOTOMASK ETCHING 01-15-2009
218. 20090014324 INTEGRATED APPARATUS FOR EFFICIENT REMOVAL OF HALOGEN RESIDUES FROM ETCHED SUBSTRATES 01-15-2009
219. 20090014323 HIGH TEMPERATURE CATHODE FOR PLASMA ETCHING 01-15-2009
220. 20090014127 SYSTEMS FOR PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION AND BEVEL EDGE ETCHING 01-15-2009
221. 20090012643 METHOD OF ACHIEVING HIGH PRODUCTIVITY FAULT TOLERANT PHOTOVOLTAIC FACTORY WITH BATCH ARRAY TRANSFER ROBOTS 01-08-2009
222. 20090011578 METHODS TO FABRICATE MOSFET DEVICES USING A SELECTIVE DEPOSITION PROCESS 01-08-2009
223. 20090011129 METHOD AND APPARATUS FOR PROVIDING PRECURSOR GAS TO A PROCESSING CHAMBER 01-08-2009
224. 20090010626 PROCESSING MULTILAYER SEMICONDUCTORS WITH MULTIPLE HEAT SOURCES 01-08-2009
225. 20090008600 METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE 01-08-2009
226. 20090008239 REMOTE INDUCTIVELY COUPLED PLASMA SOURCE FOR CVD CHAMBER CLEANING 01-08-2009
227. 20090007846 DIFFUSER GRAVITY SUPPORT - apparatus and method for supporting a substantial center portion of a gas distribution plate is disclosed 01-08-2009
228. 20090004875 METHODS OF TRIMMING AMORPHOUS CARBON FILM FOR FORMING ULTRA THIN STRUCTURES ON A SUBSTRATE 01-01-2009
229. 20090004870 METHODS FOR HIGH TEMPERATURE ETCHING A HIGH-K MATERIAL GATE STRUCTURE 01-01-2009
230. 20090004850 PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN TUNGSTEN CONTACT APPLICATIONS 01-01-2009
231. 20090004405 Thermal Batch Reactor with Removable Susceptors 01-01-2009
232. 20090000551 METHODS AND APPARATUS FOR DEPOSITING A UNIFORM SILICON FILM WITH FLOW GRADIENT DESIGNS 01-01-2009
233. 20080318441 PROCESS SEQUENCE FOR DOPED SILICON FILL OF DEEP TRENCHES 12-25-2008
234. 20080317973 DIFFUSER SUPPORT - Embodiments of gas distribution apparatus comprise a diffuser support member coupled to a diffuser and moveably disposed through a 12-25-2008
235. 20080317954 PULSED DEPOSITION PROCESS FOR TUNGSTEN NUCLEATION 12-25-2008
236. 20080314571 ANNULAR BAFFLE - baffle assembly for an etching apparatus is disclosed 12-25-2008
237. 20080314522 APPARATUS AND METHOD TO CONFINE PLASMA AND REDUCE FLOW RESISTANCE IN A PLASMA REACTOR 12-25-2008
238. 20080314317 SHOWERHEAD DESIGN WITH PRECURSOR PRE-MIXING 12-25-2008
239. 20080314311 HVPE SHOWERHEAD DESIGN - method and apparatus that may be utilized in deposition processes such as hydride vapor phase epitaxial deposition of metal 12-25-2008
240. 20080305629 TUNGSTEN NITRIDE ATOMIC LAYER DEPOSITION PROCESSES 12-11-2008
241. 20080305246 APPARATUS FOR DEPOSITING A UNIFORM SILICON FILM AND METHODS FOR MANUFACTURING THE SAME 12-11-2008
242. 20080302303 METHODS AND APPARATUS FOR DEPOSITING A UNIFORM SILICON FILM WITH FLOW GRADIENT DESIGNS 12-11-2008
243. 20080299735 METHODS FOR FORMING A TRANSISTOR - Methods are provided for depositing materials in forming semiconductor devices on a substrate, such as metal oxide 12-04-2008
244. 20080296352 BONDING METHOD FOR CYLINDRICAL TARGET - The present invention generally comprises a method and apparatus for bonding a cylindrical sputtering target to 12-04-2008
245. 20080296142 SWINGING MAGNETS TO IMPROVE TARGET UTILIZATION 12-04-2008
246. 20080293343 PAD WITH SHALLOW CELLS FOR ELECTROCHEMICAL MECHANICAL PROCESSING 11-27-2008
247. 20080292811 CHAMBER IDLE PROCESS FOR IMPROVED REPEATABILITY OF FILMS 11-27-2008
248. 20080292798 BORON NITRIDE AND BORON NITRIDE-DERIVED MATERIALS DEPOSITION METHOD 11-27-2008
249. 20080292433 BATCH EQUIPMENT ROBOTS AND METHODS OF ARRAY TO ARRAY WORK-PIECE TRANSFER FOR PHOTOVOLTAIC FACTORY 11-27-2008
250. 20080291428 FULL SPECTRUM ADAPTIVE FILTERING (FSAF) FOR LOW OPEN AREA ENDPOINT DETECTION 11-27-2008
251. 20080289687 METHODS FOR DEPOSITING A SILICON LAYER ON A LASER SCRIBED TRANSMITTING CONDUCTIVE OXIDE LAYER SUITABLE FOR USE IN SOLAR CELL APPLICATIONS 11-27-2008
252. 20080289686 METHOD AND APPARATUS FOR DEPOSITING A SILICON LAYER ON A TRANSMITTING CONDUCTIVE OXIDE LAYER SUITABLE FOR USE IN SOLAR CELL APPLICATIONS 11-27-2008
253. 20080289575 METHODS AND APPARATUS FOR DEPOSITING A GROUP III-V FILM USING A HYDRIDE VAPOR PHASE EPITAXY PROCESS 11-27-2008
254. 20080289284 PROCESS CHAMBER AND LOAD-LOCK SPLIT FRAME CONSTRUCTION 11-27-2008
255. 20080286463 RF SHUTTER - The present invention generally comprises an RF shutter assembly for use in a plasma processing apparatus 11-20-2008
256. 20080284760 LOCALIZATION OF DRIVER FAILURES WITHIN LIQUID CRYSTAL DISPLAYS 11-20-2008
257. 20080282982 APPARATUS AND METHOD FOR DEPOSITION OVER LARGE AREA SUBSTRATES 11-20-2008
258. 20080281457 METHOD OF ACHIEVING HIGH PRODUCTIVITY FAULT TOLERANT PHOTOVOLTAIC FACTORY WITH BATCH ARRAY TRANSFER ROBOTS 11-13-2008
259. 20080280457 METHOD OF IMPROVING INITIATION LAYER FOR LOW-K DIELECTRIC FILM BY DIGITAL LIQUID FLOW METER 11-13-2008
260. 20080280453 APPARATUS AND METHOD FOR SUPPORTING, POSITIONING AND ROTATING A SUBSTRATE IN A PROCESSING CHAMBER 11-13-2008
261. 20080280438 METHODS FOR DEPOSITING TUNGSTEN LAYERS EMPLOYING ATOMIC LAYER DEPOSITION TECHNIQUES 11-13-2008
262. 20080280413 METHODS FOR FORMING A TRANSISTOR - Methods are provided for depositing materials in forming semiconductor devices on a substrate, such as metal oxide 11-13-2008
263. 20080280212 METHOD FOR PHOTOMASK FABRICATION UTILIZING A CARBON HARD MASK 11-13-2008
264. 20080279672 BATCH EQUIPMENT ROBOTS AND METHODS OF STACK TO ARRAY WORK-PIECE TRANSFER FOR PHOTOVOLTAIC FACTORY 11-13-2008
265. 20080279658 BATCH EQUIPMENT ROBOTS AND METHODS WITHIN EQUIPMENT WORK-PIECE TRANSFER FOR PHOTOVOLTAIC FACTORY 11-13-2008
266. 20080277787 METHOD AND PAD DESIGN FOR THE REMOVAL OF BARRIER MATERIAL BY ELECTROCHEMICAL MECHANICAL PROCESSING 11-13-2008
267. 20080276868 RIGID RF TRANSMISSION LINE WITH EASY REMOVAL SECTION 11-13-2008
268. 20080276867 TRANSFER CHAMBER WITH VACUUM EXTENSION FOR SHUTTER DISKS 11-13-2008
269. 20080276864 APPARATUS AND METHOD FOR SUPPORTING, POSITIONING AND ROTATING A SUBSTRATE IN A PROCESSING CHAMBER 11-13-2008
270. 20080276860 CROSS FLOW APPARATUS AND METHOD FOR HYDRIDE VAPOR PHASE DEPOSITION 11-13-2008
271. 20080274626 METHOD FOR DEPOSITING A HIGH QUALITY SILICON DIELECTRIC FILM ON A GERMANIUM SUBSTRATE WITH HIGH QUALITY INTERFACE 11-06-2008
272. 20080274299 APPARATUS AND METHOD FOR HYBRID CHEMICAL PROCESSING 11-06-2008
273. 20080274279 NOBLE METAL LAYER FORMATION FOR COPPER FILM DEPOSITION 11-06-2008
274. 20080271309 HEATED SUBSTRATE SUPPORT AND METHOD OF FABRICATING SAME 11-06-2008
275. 20080268753 NON-CONTACT WET WAFER HOLDER - load cup configured to speed up substrate transferring to and from a carrier head and to reduce corrosion during the 10-30-2008
276. 20080268645 METHOD FOR FRONT END OF LINE FABRICATION 10-30-2008
277. 20080268636 DEPOSITION METHODS FOR BARRIER AND TUNGSTEN MATERIALS 10-30-2008
278. 20080268635 PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN COPPER CONTACT APPLICATIONS 10-30-2008
279. 20080268617 METHODS FOR SUBSTRATE SURFACE CLEANING SUITABLE FOR FABRICATING SILICON-ON-INSULATOR STRUCTURES 10-30-2008
280. 20080268173 PECVD PROCESS CHAMBER BACKING PLATE REINFORCEMENT 10-30-2008
281. 20080268171 APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION 10-30-2008
282. 20080268154 METHODS FOR DEPOSITING A HIGH-K DIELECTRIC MATERIAL USING CHEMICAL VAPOR DEPOSITION PROCESS 10-30-2008
283. 20080264777 THIN FILM SEMICONDUCTOR MATERIAL PRODUCED THROUGH REACTIVE SPUTTERING OF ZINC TARGET USING NITROGEN GASES 10-30-2008
284. 20080264480 MULTI-JUNCTION SOLAR CELLS AND METHODS AND APPARATUSES FOR FORMING THE SAME 10-30-2008
285. 20080261800 EROSION RESISTANCE ENHANCED QUARTZ USED IN PLASMA ETCH CHAMBER 10-23-2008
286. 20080261413 PRETREATMENT PROCESSES WITHIN A BATCH ALD REACTOR 10-23-2008
287. 20080261335 ENDPOINT DETECTION FOR PHOTOMASK ETCHING 10-23-2008
288. 20080258091 FLOATING SLIT VALVE FOR TRANSFER CHAMBER INTERFACE 10-23-2008
289. 20080257260 Batch wafer handling system - The present invention generally provides a batch processing system having a processing chamber and a loading chamber 10-23-2008
290. 20080254722 PAD CONDITIONER - is provided for conditioning a polishing pad in chemical mechanical planarization 10-16-2008
291. 20080254713 PAD ASSEMBLIES FOR ELECTROCHEMICALLY ASSISTED PLANARIZATION 10-16-2008
292. 20080254613 METHODS FOR FORMING METAL INTERCONNECT STRUCTURE FOR THIN FILM TRANSISTOR APPLICATIONS 10-16-2008
293. 20080254233 PLASMA-INDUCED CHARGE DAMAGE CONTROL FOR PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION PROCESSES 10-16-2008
294. 20080254203 SILICON NITRIDE PASSIVATION FOR A SOLAR CELL 10-16-2008
295. 20080251137 IN-SITU MONITOR OF INJECTION VALVE - The present invention generally provides methods and apparatus for monitoring performance of an injection valve 10-16-2008
296. 20080251019 SYSTEM AND METHOD FOR TRANSFERRING A SUBSTRATE INTO AND OUT OF A REDUCED VOLUME CHAMBER ACCOMMODATING MULTIPLE SUBSTRATES 10-16-2008
297. 20080246101 METHOD OF POLY-SILICON GRAIN STRUCTURE FORMATION 10-09-2008
298. 20080245414 METHODS FOR FORMING A PHOTOVOLTAIC DEVICE WITH LOW CONTACT RESISTANCE 10-09-2008
299. 20080242202 EXTENDED PAD LIFE FOR ECMP AND BARRIER REMOVAL 10-02-2008
300. 20080241419 DEVICE THAT ENABLES PLASMA IGNITION AND COMPLETE FARADAY SHIELDING OF CAPACITIVE COUPLING FOR AN INDUCTIVELY-COUPLED PLASMA 10-02-2008
301. 20080241355 THIN FILM TRANSISTOR DEVICES HAVING HIGH ELECTRON MOBILITY AND STABILITY 10-02-2008
302. 20080236615 METHOD OF PROCESSING WAFERS IN A SEQUENTIAL FASHION 10-02-2008
303. 20080233022 METHOD OF FABRICATING PLASMA REACTOR PARTS 09-25-2008
304. 20080230518 GAS FLOW DIFFUSER - method and apparatus for providing flow into a processing chamber are provided 09-25-2008
305. 20080230154 ABSORBER LAYER FOR DSA PROCESSING - method of processing a substrate comprising depositing a layer comprising amorphous carbon on the substrate and then 09-25-2008
306. 20080227291 FORMATION OF COMPOSITE TUNGSTEN FILMS - Embodiments of the invention provide methods for depositing tungsten materials 09-18-2008
307. 20080223440 MULTI-JUNCTION SOLAR CELLS AND METHODS AND APPARATUSES FOR FORMING THE SAME 09-18-2008
308. 20080220150 MICROBATCH DEPOSITION CHAMBER WITH RADIANT HEATING 09-11-2008
309. 20080219815 HIGH TEMPERATURE ANTI-DROOP END EFFECTOR FOR SUBSTRATE TRANSFER 09-11-2008
310. 20080216743 CHEMICAL PRECURSOR AMPOULE FOR VAPOR DEPOSITION PROCESSES 09-11-2008
311. 20080216077 SOFTWARE SEQUENCER FOR INTEGRATED SUBSTRATE PROCESSING SYSTEM 09-04-2008
312. 20080214014 ABSORBER LAYER CANDIDATES AND TECHNIQUES FOR APPLICATION 09-04-2008
313. 20080210307 CONTROL OF SLIT VALVE DOOR SEAL PRESSURE 09-04-2008
314. 20080210163 Independent Radiant Gas Preheating for Precursor Disassociation Control and Gas Reaction Kinetics in Low Temperature CVD Systems 09-04-2008
315. 20080206987 PROCESS FOR TUNGSTEN NITRIDE DEPOSITION BY A TEMPERATURE CONTROLLED LID ASSEMBLY 08-28-2008
316. 20080203056 METHODS FOR ETCHING HIGH ASPECT RATIO FEATURES 08-28-2008
317. 20080202610 METHOD AND APPARATUS FOR CONTROLLING GAS FLOW TO A PROCESSING CHAMBER 08-28-2008
318. 20080202609 METHOD AND APPARATUS FOR CONTROLLING GAS FLOW TO A PROCESSING CHAMBER 08-28-2008
319. 20080202588 METHOD AND APPARATUS FOR CONTROLLING GAS FLOW TO A PROCESSING CHAMBER 08-28-2008
320. 20080202425 TEMPERATURE CONTROLLED LID ASSEMBLY FOR TUNGSTEN NITRIDE DEPOSITION 08-28-2008
321. 20080199282 CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE 08-21-2008
322. 20080198895 SUBSTRATE TEMPERATURE MEASUREMENT BY INFRARED TRANSMISSION 08-21-2008
323. 20080196661 PLASMA SPRAYED DEPOSITION RING ISOLATOR - substrate processing chamber component including a deposition ring for protecting exposed portions of a 08-21-2008