Inventors list |
Agents list |
Assignees list |
List by place |
Classification tree browser |
Top 100 Inventors |
Top 100 Agents |
Top 100 Assignees |
BAKER & MCKENZIE LLP
NEW YORK, NY US
1. 20110040753 PERSONALIZED SEARCH ENGINE - Computer-implemented methods and systems for searching network information through the use of user identification 02-17-20112. 20100042688 SYSTEMS AND METHODS FOR PROVISION OF CONTENT DATA 02-18-2010
3. 20100018116 SYSTEM AND METHOD FOR CONVERTING SOLIDS INTO FUEL 01-28-2010
4. 20090200412 FISHING SPINNING REEL - The present invention has a spool mounted on a spool shaft and rolled thereon with a fishline a rotor rotated by a rolling 08-13-2009
5. 20090141645 STEALTH NETWORK - Described herein are systems and methods in which taps which mirror or provide a copy of network traffic 06-04-2009
6. 20090096505 SYSTEMS, CIRCUITS AND METHODS FOR REDUCING THERMAL DAMAGE AND EXTENDING THE DETECTION RANGE OF AN INSPECTION SYSTEM 04-16-2009
7. 20090080759 SYSTEMS AND METHODS FOR CREATING PERSISTENT DATA FOR A WAFER AND FOR USING PERSISTENT DATA FOR INSPECTION-RELATED FUNCTIONS 03-26-2009
8. 20090079974 METHODS AND SYSTEMS FOR LITHOGRAPHY PROCESS CONTROL 03-26-2009
9. 20090077383 SYSTEM AND METHOD FOR AUTHENTICATION, DATA TRANSFER, AND PROTECTION AGAINST PHISHING 03-19-2009
10. 20090055783 COMPUTER-IMPLEMENTED METHODS FOR DETERMINING IF ACTUAL DEFECTS ARE POTENTIALLY SYSTEMATIC DEFECTS OR POTENTIALLY RANDOM DEFECTS 02-26-2009
11. 20090048931 SYSTEM AND METHOD FOR MANAGING RELATED ACCOUNTS 02-19-2009
12. 20090043527 COMPUTER-IMPLEMENTED METHODS, CARRIER MEDIA, AND SYSTEMS FOR GENERATING A METROLOGY SAMPLING PLAN 02-12-2009
13. 20090041332 METHODS FOR GENERATING A STANDARD REFERENCE DIE FOR USE IN A DIE TO STANDARD REFERENCE DIE INSPECTION AND METHODS FOR INSPECTING A WAFER 02-12-2009
14. 20090040525 SYSTEMS CONFIGURED TO INSPECT A WAFER - are provided 02-12-2009
15. 20090040511 SYSTEMS, CIRCUITS AND METHODS FOR EXTENDING THE DETECTION RANGE OF AN INSPECTION SYSTEM BY AVOIDING DETECTOR SATURATION 02-12-2009
16. 20090037134 SEMICONDUCTOR DEVICE PROPERTY EXTRACTION, GENERATION, VISUALIZATION, AND MONITORING METHODS 02-05-2009
17. 20090024967 COMPUTER-IMPLEMENTED METHODS, SYSTEMS, AND COMPUTER-READABLE MEDIA FOR DETERMINING A MODEL FOR PREDICTING PRINTABILITY OF RETICLE FEATURES ON A WAFER 01-22-2009
18. 20090016595 METHODS AND SYSTEMS FOR DETECTING DEFECTS IN A RETICLE DESIGN PATTERN 01-15-2009
19. 20090009754 SYSTEMS AND METHODS FOR INSPECTING A WAFER WITH INCREASED SENSITIVITY 01-08-2009
20. 20080306701 COMPUTER-IMPLEMENTED METHODS, CARRIER MEDIA, AND SYSTEMS FOR DETECTING DEFECTS ON A WAFER BASED ON MULTI-CORE ARCHITECTURE 12-11-2008
21. 20080304069 SYSTEMS AND METHODS FOR INSPECTING A SPECIMEN WITH LIGHT AT VARYING POWER LEVELS 12-11-2008
22. 20080304056 METHODS FOR DETECTING AND CLASSIFYING DEFECTS ON A RETICLE 12-11-2008
23. 20080286885 METHODS AND SYSTEMS FOR CREATING OR PERFORMING A DYNAMIC SAMPLING SCHEME FOR A PROCESS DURING WHICH MEASUREMENTS ARE PERFORMED ON WAFERS 11-20-2008
24. 20080279444 COMPUTER-IMPLEMENTED METHODS, COMPUTER-READABLE MEDIA, AND SYSTEMS FOR IDENTIFYING ONE OR MORE OPTICAL MODES OF AN INSPECTION SYSTEM AS CANDIDATES FOR USE IN INSPECTION OF A LAYER OF A WAFER 11-13-2008
25. 20080264905 METHODS AND SYSTEMS FOR MEASURING A CHARACTERISTIC OF A SUBSTRATE OR PREPARING A SUBSTRATE FOR ANALYSIS 10-30-2008
26. 20080255579 Implantation Tool for Intraocular Lenses 10-16-2008
27. 20080252889 SYSTEMS AND METHODS FOR MEASUREMENT OF A SPECIMEN WITH VACUUM ULTRAVIOLET LIGHT 10-16-2008
28. 20080250384 SYSTEMS AND METHODS FOR CREATING INSPECTION RECIPES 10-09-2008
29. 20080219545 METHODS FOR IDENTIFYING ARRAY AREAS IN DIES FORMED ON A WAFER AND METHODS FOR SETTING UP SUCH METHODS 09-11-2008
30. 20080215606 FOCAL POINT COMPRESSION METHOD AND APPARATUS 09-04-2008
31. 20080207089 METHODS AND SYSTEMS FOR MONITORING A PARAMETER OF A MEASUREMENT DEVICE DURING POLISHING, DAMAGE TO A SPECIMEN DURING POLISHING, OR A CHARACTERISTIC OF A POLISHING PAD OR TOOL 08-28-2008
32. 20080205745 METHODS FOR ACCURATE IDENTIFICATION OF AN EDGE OF A CARE AREA FOR AN ARRAY AREA FORMED ON A WAFER AND METHODS FOR BINNING DEFECTS DETECTED IN AN ARRAY AREA FORMED ON A WAFER 08-28-2008