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SCHEIN & CAI LLP
SAN JOSE, CA US
1. 20090134964 Lead frame-based discrete power inductor 05-28-20092. 20090134503 Semiconductor power device package having a lead frame-based integrated inductor 05-28-2009
3. 20090130799 Stacked dual MOSFET package - method of fabricating a stacked dual MOSFET die package is disclosed 05-21-2009
4. 20090086348 System for simultaneously turning and tilting an array of mirror concentrators 04-02-2009
5. 20090084375 Aligned multiple flat mirror reflector array for concentrating sunlight onto a solar cell 04-02-2009
6. 20090020854 Process of forming ultra thin wafers having an edge support ring 01-22-2009
7. 20090014853 Integrated circuit package for semiconductior devices with improved electric resistance and inductance 01-15-2009
8. 20080309442 Semiconductor power device having a stacked discrete inductor structure 12-18-2008
9. 20080238599 Chip scale power converter package having an inductor substrate 10-02-2008
10. 20080208886 Encryption based silicon IP protection - method and system for protecting silicon IPs from unauthorized use transfer and sale and for hiding 08-28-2008
11. 20080207094 Method and apparatus for ultra thin wafer backside processing 08-28-2008
12. 20080203548 High current semiconductor power device soic package 08-28-2008