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DAVID AKER
HARTSDALE, NY US
1. 20110034043 COMMUNICATION WITH A MULTI-CONTACT PAD HAVING A USB APPLICATION 02-10-20112. 20110003402 RECOVERY OF HYDROPHOBICITY OF LOW-K AND ULTRA LOW-K ORGANOSILICATE FILMS USED AS INTER METAL DIELECTRICS 01-06-2011
3. 20090197114 MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS 08-06-2009
4. 20090197103 MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS 08-06-2009
5. 20090080833 APPARATUS AND METHODS FOR REMAKEABLE CONNECTIONS TO OPTICAL WAVEGUIDES 03-26-2009
6. 20090039472 STRUCTURE AND METHOD FOR CREATING RELIABLE DEEP VIA CONNECTIONS IN A SILICON CARRIER 02-12-2009
7. 20090038004 ROLE CHANGE BASED ON COUPLING OR DOCKING OF INFORMATION HANDLING APPARATUS AND METHOD FOR SAME 02-05-2009
8. 20080266502 METHOD OF PRODUCING UV STABLE LIQUID CRYSTAL ALIGNMENT 10-30-2008
9. 20080206979 INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS 08-28-2008
10. 20080203585 INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS 08-28-2008
11. 20080202792 INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS 08-28-2008