MILITARY IMPLICATIONS OF THE TRANSFER OF SEMICONDUCTOR TECHNOLOGY TO THE USSR

Created: 9/25/1974

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FOR:

SUBJECT

Ad Hoc Working Group on Military Implications of Technology Transfer.

Military Implications of the Transfer of Semiconductor Technology to tho USSR

attached report discusses the use of semiconductor technology ir. the US MINUTEMAN and Soviet ICBM programs, and considers whether the Soviet ICBM program would benefit from the acquisition of US semiconductor technology. Although there are some changes in wording, substantively it does notom the draft submitted to you earlier.

This is an interim report. As you know, we plan to press our investigation further to identify the unique processing equipment ana technology required to produce ICs and otherfor highly specialized military use. Also, we want

to examine the relationship of semiconductor technology zo other military systems. We hope to prepare,aterinal

militarv implications of transferring

us semiconductor technology to the USSR.

oiii.ee ci Jicor.omic Research

Attachment: as stated

ATTACHMENT

Military Implications of the Transfer of Semiconductor Technology to the USSR

Conclusions

. The developmentIRV system for use on MINUTEMAN-1II was aided importantly by US advances in microminiaturization of electronics subsystemsthat is, by advances in integrated circuit stato-of-tha-art.

. The USSR is developing MIRVs for several new variants of land-based iCDMa, but is believed to be using transistors rather than IC technology.

. The USSR probably lacks the oxperience and processing know-how to produce ICs to the standards of quality and reliability needed for ICBM use.

. The USSR may not be able to keep up with advances in US missile technologysuch as MARVswithout developing IC-based guidance systems.

. The export of US IC technology to the USSR wouldthe transition to iC-basod guidance systems design.

Use of Semiconductor Technology in MINUTEMAN ICBMs

All variants of the HINUTEMAN Missile have usedin the on-board guidance system. sed only conventional dovicostransistors and diodesostly for the guidance computer. Innd III, integrated circuits were usedajor way in the computer andesser extent also in the non-computer parts of the guidance system (see The number of ICs used in the MINUTEMAN guidance system is moderatelyor MINUTE-MAN- II,or MINUTEMAN-III. These figures arebecause one IC performs the function of at leastransistors. Thus, in very rough terms, ics in use in MINUTE-MAN-II and III are equivalent to0espectively which dramatically illustrates the increased complexity of the electronics systems of MINUTEMAN-II and III compared toransistors). In general, the use of ICS has resultedore complex guidanceuch more powerful computer, and improved reliability while reducing the size and weight of the entire electronic package. The developmentomplex guidance system based on ICs has contributed importantly to increasing the accuracy of MINUTEMAN-II, and to introduction of MIRVs on MINUTEMAN-III.

The ICs in use in MINUTEMAN-III are relatively simpleate transistor-transistor logic (TTL) types

mm

equivalent4 US state-of-the-art. Functionally, they are similar to those in MINUTEMAN-II but are designed for greater reliability, enhanced resistance to degradation from radiation, and added protection against contamination.

Reliability was enhanced by strengthening all types of bonds (for example/ shiftingimetallic to an alloy chip mount) and by reducing "purple plague" (metal migration associated with gold to aluminum bonds). Radiation resistance was greatly enhanced though the use of dielectric isolation of circuit elements and thin-film resistors, rather than junction isolation and diffused resistors. In addition, ICs used in MINUTEMAN-III employ passivation of the roetalization to reduce contamination and other damage to the chip surface (see Tablehese improvements as well as others represent extensive research and development efforts which have extended overears and are continuing. Semiconductor and IC reliability problems persist, especially in the areas of wire bonds and the hermetic seals of encapsulated packages.

US advances in integrated circuit technology haveimportantly to the development of ever more complex guidance systems, and hence, to the increased flexibility of ICBM systems. Future increases in missle flexibilityfor example the development of maneuverable warhe)is (MARV)are linked crucially to further advances in IC technology such as the perfection of non-volatile semiconductor memories.

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Use of Semiconductors in Soviet ICBMs

Guidance Systems on board Soviet ICBMs historicallyless complex and less electronics-intensive thanOS systems; for example, they have not been fullyhave not used on-board computers. Because Sovietvery large, and because Soviet military designsimplicity, especially in:electronics systems,miniaturize have been small if not altogether absent. technology has playedinor role in

With the advent of minutemak-III the USSR initiated ato develop its own MIRV capability, generating newfor more advanced telectronics-intensive) guidance systems. Four ICBMs now under,pparently incorporate guidance systems with on-board digital computers. Iteasonable assumption that these systems are transistorized, although it is very unlikely that they are based on IC technology. The USSR makes ICS including TTLs in adequate volume to meet the relatively small quantitative requirements of their ICBM program. However, Soviet ICs probably do not meet qualitative requirements. US experience has shown that basic ttl circuits must be modified extensively for ICBM use. The USSR has not demonstrated that they possess the experience or sophisticated processing technology needed to make all of the necessary modifications.

Soviet Interest in OS and Western IC Technology

The USSR recognizes US IC technology as the best in the world and, for several years, has actively sought to purchase devices, industrial items of equipment, and whole plants. Some US IC production and test equipment has been acquired illicitly outside embargo channels.. The USSR is seeking to buy, in particular, US know-how and experience. The USSR is actively procuring or attempting to procure equipment and technology in West Europe and Japan also, although neither area can match US IC technology across-the-board. The USSR seeks US and other Western technology in order to "increase the quantity and upgrade the quality and reliability of IC production.

Potential Military impact of US and Western IC Technology

Almost certainly, any US or other Western production technology acquired for use by the Soviet IC industry could be expected to serve priority military requirementsirst imperative. Soviet military authorities, which control and closely supervise the production of ICs in the USSR have first claim on output. Indeed, most of current Soviet output goes to the military, probably to research and development facilities for the design and construction of prototype electronics systems for military/space use.

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In particular, acquisition of US technology probably would accelerate the development of third-generation guidance systems for use in ICBMs. There is evidence that the Soviets are dissatisfied with existing missile guidance controls and have given the development of new systems an urgent national priority. IC-basod systems would enhance the reliability and probably also the accuracy of Soviet missile systems. if the USSR is to stay abreast of US advances in ICBM design, the use of ICs in future guidance systems may be indispensable; in the judgement of US weapons experts, the development of advanced warhead designs, such as MARV, is unattainable with conventional semiconductor technology.

Semiconductor Devices Used in MINUTEMAH On-Board Guidance Systems (in units)

Computer Non-Computer Total

3

Computer Non-Computer Total

and

Integrated Circuits

Hon -Compuotal

Table 2

Characteristics of Semiconductors Used in MINUTEMAN Guidance Systems

MINUTEMAN

Diodes

Alloy junction

Standard commercial package

II

Diffused junction

Military

Same as II

Same as II

and PLANAR

Germanium and

Standard commercial package

Sameame as I

Military

as II Same as II

Same as II

of metali zation

Circuits

TTL Bimetallic bond mount Diffused resistors

Junction isolation

Same as II

Alloy mount

Thin-film resistorschrome)

Dielectric isolation

Passivation of metalization

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Original document.

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