Article Abstract:
Prevention of microcontamination, health and safety maintenance and environmental compliance at microelectronics or semiconductor manufacturing plants rely strongly, in part, on the design and selection of both exhaust conditioners and centralized air abatements systems. A comprehensive approach on the management of process exhaust gases emitted from microelectronics production machinery and facilities has been developed. This approach may help engineers to better understand process exhaust systems and minimize air flow rates and emissions.
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Article Abstract:
Corrosion coupons, electric resistance, linear polarization resistance are the three most-commonly used methods for the direct monitoring of corrosion. For instance, corrosion coupons are weighed before and after exposure to assess mass-loss corrosion. On the other hand, indirect methods measure an outcome of corrosion, such as the remaining wall thickness of a pipe, vessel or other piece of equipment. Ultrasonic testing and radiography are the two most popular methods of monitoring corrosion indirectly.
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Article Abstract:
The EPA's Reference Method 21 is the federally-specified method for monitoring fugitive emissions from piping system components including valves, connectors and compressor seals. Emissions are measured by placing the instrument probe at the surface of the interface where leakage would likely occur in nonmoving components. For moving components, the probe is placed within 1 cm of the interface. The probe should be perpendicular and not tangential to the leak interface.
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