New hydrogen purification technology developed

Article Abstract:

Johnson Matthey of Wayne, PA, and Air Products and Chemicals of Lehigh Valley, PA, have come up with a new palladium membrane diffusion technology to yield ultra-high purity hydrogen. The technology was developed to eliminate carbon monoxide, carbon dioxide and methane contamination in hydrogen. John Matthey and Air Products have filed a joint patent on the technology. Air Products will initially use the technology in major semiconductor manufacturing projects in the Pacific Rim. The new technology will be used in locations where commercially available hydrogen sources contain relatively high levels of contaminants.

Comment:

Has come up with a new palladium membrane diffusion technology with Air Products to yield ultra-high purity hydrogen

All Other Miscellaneous General Purpose Machinery Manufacturing, Industrial Gas Filters NEC, Johnson Matthey, Gas filters

Defect-free silicon crystal

Article Abstract:

MEMC Electronic Materials have come up with a new approach to defect management, leading to silicon crystal ingots that no longer suffer from in-grown agglomerated or clustered defects. The process stops the formation of two kinds of defects in crystal ingots used in IC manufacturing. The company has come ups with a new crystal growth process that works beyond controlling the rate of the defect creating reaction to integrating defect management across the whole growth process. At the moment, defect-free silicon crystals have been attained at diameters as big as 200 mm.

Comment:

Comes up w/ new approach to defect management, leading to silicon crystal ingots w/ no in-grown agglomerated or clustered defect

All Other Miscellaneous Nonmetallic Mineral Product Manufacturing, Silicon Crystals

Smart card assembly: requires advanced pre-assembly methods

Article Abstract:

The continuing requirement for reduced thickness of smart cards requires advanced pre-assembly methods. The most common process sequence leading to thin wafers involves taping the wafer's active side, backgrinding the wafer and etching the backside. Before assembly, detaping and separation should also be conducted. On the assembly line, the chips pass through die bonding, wire bonding and encapsulation, which is followed by electrical testing. The modules become ready for shipment after completion of the electrical testing.

Magnetic and Optical Recording Media Manufacturing, Magnetic Cards