300 mm lithography enters reality

Article Abstract:

The enthusiasm for the advent of the 300 mm wafer size conversion waned with the realization that changing the technology node and wafer size at the same time would be risky and unnecessary to obtain the desired cost reduction. Equipment suppliers spent millions or billions on research and development costs during the initial 300 mm tool development. However, in 1998, when majority of the equipment was ready, the market was not and instead, stayed with the technology-driven cost reduction at 200 mm. The renewed enthusiasm for the 300 mm has again began but only because of the need for small but powerful chips in greater volume at lower cost. Mature 300 mm lithography tools are ready but the insertion node is not 250 nm technology but 130 nm.

Market information - general

Controlling static charge in spin rinser dryers

Article Abstract:

Static charge generated in spin rinse dryers (SRDs) could be placed under control by providing electrical path for the charge to slowly drain to the ground. Such path would prevent static charge-related events, which is generated in the highest levels in SRDs though it is also generated inside most semiconductors. Ionization of the nitrogen used for drying is the selected method in an SRD, where the offending charge is on isolated and suspended wafers. SRD ionization guidelines include reliability and maintenance, compressed gas ionizer, cleanliness and alarm indicators.

Comment:

Static charge generated in spin rinse dryers could be control by providing electrical path for charge to slowly drain to ground

Manufacturing processes

The challenges of the copper CMP clean

Article Abstract:

OnTrack Systems Inc., a subsidiary of Lam Research Corp., has developed a new cleaning formulation for use in copper CMP cleaning. Copper CMP poses a unique set of challenges to the CMP cleaning process but company officials stated that the MCC solution does the job because it allows brush scrubbing to be successfully used for copper CMP cleaning. The new cleaning formulation utilizes the zeta potential concept to control the removal of slurry from the water surface while prohibiting the slurry from accumulating in the PVA brushes.

Comment:

Developes a new cleaning formulation for use in copper CMP cleaning

Product information, OnTrak Systems Inc.